Read Sony CMT-CPZ3 / HCD-CPZ3 Service Manual online
HCD-CPZ3
2
1.
SERVICING NOTES
............................................. 3
2. DISASSEMBLY
2-1. Disassembly Flow ........................................................... 4
2-2. Case .................................................................................
2-2. Case .................................................................................
5
2-3. Front Panel Block ........................................................... 5
2-4. TC Board, Mechanical Deck .......................................... 6
2-5. PANEL Board ................................................................. 7
2-6. MAIN Board ................................................................... 7
2-7. CD Mechanism Deck (CDM80BH-F1BD83) ................ 8
2-8. Chassis (Top) .................................................................. 8
2-9. Lever (Loading-L/R) ....................................................... 9
2-10. Lever (Disc Sensor), Lever (Disc Stop) .......................... 10
2-11 DRIVER Board, Motor Assy (Loading) (M701) ............ 10
2-12. BD Board ........................................................................ 11
2-13. BU Section ...................................................................... 11
2-14. Optical Pick-up Block (KSM-215DCP) ......................... 12
2-15. Lever (BU Lock) ............................................................. 12
2-16. Close Lever ..................................................................... 13
2-17. Lever (DIR), Gear (IDL-B) ............................................ 13
2-18. Gear (IDL-C) .................................................................. 14
2-4. TC Board, Mechanical Deck .......................................... 6
2-5. PANEL Board ................................................................. 7
2-6. MAIN Board ................................................................... 7
2-7. CD Mechanism Deck (CDM80BH-F1BD83) ................ 8
2-8. Chassis (Top) .................................................................. 8
2-9. Lever (Loading-L/R) ....................................................... 9
2-10. Lever (Disc Sensor), Lever (Disc Stop) .......................... 10
2-11 DRIVER Board, Motor Assy (Loading) (M701) ............ 10
2-12. BD Board ........................................................................ 11
2-13. BU Section ...................................................................... 11
2-14. Optical Pick-up Block (KSM-215DCP) ......................... 12
2-15. Lever (BU Lock) ............................................................. 12
2-16. Close Lever ..................................................................... 13
2-17. Lever (DIR), Gear (IDL-B) ............................................ 13
2-18. Gear (IDL-C) .................................................................. 14
3.
TEST MODE
............................................................. 15
4.
MECHANICAL ADJUSTMENTS
....................... 16
5.
ELECTRICAL ADJUSTMENTS
......................... 17
6. DIAGRAMS
6-1. Block Diagram
– CD SERVO/TAPE DECK/TUNER Section – ............. 18
6-2. Block Diagram – MAIN Section – ................................. 19
6-3. Block Diagram
6-3. Block Diagram
– PANEL/KEY/POWER SUPPLY Section – ................. 20
6-4. Printed Wiring Board – BD Board – ............................... 22
6-5. Schematic Diagram – BD Board – ................................. 23
6-6. Printed Wiring Board – TC Board – ............................... 24
6-7. Schematic Diagram – TC Board – .................................. 25
6-8. Printed Wiring Board – DRIVER Board – ..................... 26
6-9. Schematic Diagram – DRIVER Board – ........................ 26
6-10. Printed Wiring Board – MAIN Board – .......................... 27
6-11. Schematic Diagram – MAIN Board (1/2) – .................... 28
6-12. Schematic Diagram – MAIN Board (2/2) – .................... 29
6-13. Schematic Diagram – AMP Board (1/2) – ...................... 30
6-14. Schematic Diagram – AMP Board (2/2) – ...................... 31
6-15. Printed Wiring Board – AMP Board – ............................ 32
6-16. Printed Wiring Board – SP Board – ................................ 33
6-17. Schematic Diagram – SP Board – ................................... 33
6-18. Printed Wiring Board – LCD Board – ............................ 34
6-19. Schematic Diagram – LCD Board – ............................... 35
6-20. Printed Wiring Boards – PANEL Section – .................... 36
6-21. Schematic Diagram – PANEL Section – ........................ 37
6-22. Printed Wiring Boards – JACK Section – ...................... 38
6-23. Schematic Diagram – JACK Section – ........................... 39
6-24. Printed Wiring Board – SW POWER Board – ............... 40
6-25. Schematic Diagram – SW POWER Board – .................. 41
6-26. Printed Wiring Board – SUB POWER Board – ............. 42
6-27. Schematic Diagram – SUB POWER Board – ................ 43
6-5. Schematic Diagram – BD Board – ................................. 23
6-6. Printed Wiring Board – TC Board – ............................... 24
6-7. Schematic Diagram – TC Board – .................................. 25
6-8. Printed Wiring Board – DRIVER Board – ..................... 26
6-9. Schematic Diagram – DRIVER Board – ........................ 26
6-10. Printed Wiring Board – MAIN Board – .......................... 27
6-11. Schematic Diagram – MAIN Board (1/2) – .................... 28
6-12. Schematic Diagram – MAIN Board (2/2) – .................... 29
6-13. Schematic Diagram – AMP Board (1/2) – ...................... 30
6-14. Schematic Diagram – AMP Board (2/2) – ...................... 31
6-15. Printed Wiring Board – AMP Board – ............................ 32
6-16. Printed Wiring Board – SP Board – ................................ 33
6-17. Schematic Diagram – SP Board – ................................... 33
6-18. Printed Wiring Board – LCD Board – ............................ 34
6-19. Schematic Diagram – LCD Board – ............................... 35
6-20. Printed Wiring Boards – PANEL Section – .................... 36
6-21. Schematic Diagram – PANEL Section – ........................ 37
6-22. Printed Wiring Boards – JACK Section – ...................... 38
6-23. Schematic Diagram – JACK Section – ........................... 39
6-24. Printed Wiring Board – SW POWER Board – ............... 40
6-25. Schematic Diagram – SW POWER Board – .................. 41
6-26. Printed Wiring Board – SUB POWER Board – ............. 42
6-27. Schematic Diagram – SUB POWER Board – ................ 43
TABLE OF CONTENTS
7.
EXPLODED VIEWS
7-1.
Case Sect ion .................................................................... 54
7-2. Mechanical Deck (Tape) Section .................................... 55
7-3. Front Panel Section ......................................................... 56
7-4. Lid (TC) Section ............................................................. 57
7-5. Chassis Section ............................................................... 58
7-6. AMP/Power Section ....................................................... 59
7-7. CD Mechanism Deck Section-1
7-3. Front Panel Section ......................................................... 56
7-4. Lid (TC) Section ............................................................. 57
7-5. Chassis Section ............................................................... 58
7-6. AMP/Power Section ....................................................... 59
7-7. CD Mechanism Deck Section-1
(CDM80BH-F1BD83) .................................................... 60
7-8. CD Mechanism Deck Section-2
(CDM80BH-F1BD83) .................................................... 61
7-9. CD Mechanism Deck Section-3
(CDM80BH-F1BD83) .................................................... 62
7-10. Base Unit Section (BU-F1BD83) ................................... 63
8.
ELECTRICAL PARTS LIST
.............................. 64
NOTES ON CHIP COMPONENT REPLACEMENT
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
•
•
Keep the temperature of soldering iron around 270 °C during
repairing.
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
This appliance is classi
fi ed as
a CLASS 1 LASER product.
This marking is located on the
rear or bottom exterior.
This marking is located on the
rear or bottom exterior.
CAUTION
Use of controls or adjustments or performance of procedures
other than those speci
Use of controls or adjustments or performance of procedures
other than those speci
fi ed herein may result in hazardous radia-
tion exposure.
Ver. 1.1
Note: Refer to SUPPLEMENT-1 for information on the MAIN and TC
boards of unit that corresponds to serial No. 5138502 or larger.
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