Read Sony CMT-CPX1 / HCD-CPX1 Service Manual online
SERVICE MANUAL
CD
Section
Tape deck
Section
Amplifier section
DIN power output (rated): 55 + 55 W
(4 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
70 + 70 W
(4 ohms at 1 kHz, 10%
THD)
(4 ohms at 1 kHz, 10%
THD)
Inputs
MD (VIDEO) IN (phono jacks):
MD (VIDEO) IN (phono jacks):
Sensitivity 450/250 mV,
impedance 47 kilohms
impedance 47 kilohms
Outputs
CD DIGITAL OUT:
CD DIGITAL OUT:
Optical Wavelength:
660 nm
660 nm
PHONES:
accepts headphones with
an impedance of 8 ohms or
more
an impedance of 8 ohms or
more
SPEAKER:
accepts impedance of
4 ohms
4 ohms
CD player section
Laser
Semiconductor laser
(CD:
(CD:
λ =780 nm)
Emission duration:
continuous
continuous
Frequency response
CD: 2 Hz – 20 kHz
Wavelength
780 – 790 nm
Tape deck section
Recording system
4-track 2-channel stereo
Frequency response
50 – 13,000 Hz (
±3 dB),
using Sony TYPE I
cassettes
cassettes
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
87.5 – 108.0 MHz (50 kHz
step)
step)
Antenna
FM wire antenna
Antenna terminals
75 ohms unbalanced
Intermediate frequency
10.7 MHz
AM tuner section
Tuning range
531 – 1,602 kHz
(with the tuning interval
set at 9 kHz)
(with the tuning interval
set at 9 kHz)
Antenna
AM loop antenna, external
antenna terminal
Intermediate frequency
450 kHz
General
Power requirements
230 V AC, 50/60 Hz
Power consumption
50 W
0.3 W (in Power Saving
mode)
0.3 W (in Power Saving
mode)
Dimensions (w/h/d)
Approx. 174
× 240.5 × 291
mm
Mass
Approx. 4.3 kg
Design and specifications are subject to change
without notice.
without notice.
COMPACT DISC DECK RECEIVER
AEP Model
UK Model
SPECIFICATIONS
HCD-CPX1
Ver 1.0 2003.02
HCD-CPX1 is the Amplifier, CD
player, Tape Deck and Tuner section
in CMT-CPX1.
player, Tape Deck and Tuner section
in CMT-CPX1.
Model Name Using Similar Mechanism
NEW
CD Mechanism Type
CDM55C-K6BD44S
Base Unit Name
BU-K6BD44S
Optical Block Name
KSM-213DCP
Optical Pick-up Name
KSS-213D
Model Name Using Similar Mechanism
NEW
9-877-059-01
Sony Corporation
2003B0500-1
Home Audio Company
C
2003.02
Published by Sony Engineering Corporation
2
HCD-CPX1
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
other than those specified herein may result in hazardous ra-
diation exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED
LINE WITH MARK
0
ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
TABLE OF CONTENTS
1.
SERVICING NOTES
...............................................
3
2.
GENERAL
Location of Controls .......................................................
7
Setting the Clock .............................................................
8
3.
DISASSEMBLY
3-1. Disassembly Flow ...........................................................
9
3-2. Case ................................................................................. 10
3-3. Front Panel Section ......................................................... 10
3-4. TC Board, Mechanical Deck .......................................... 11
3-5. MAIN Board ................................................................... 11
3-6. Tuner Unit ....................................................................... 12
3-7. CD Mechanism Deck (CDM55C-K6BD44S) ................ 12
3-8. Loading Board ................................................................. 13
3-9. Cam (CDM55) ................................................................ 13
3-10. Base Unit (BU-K6BD44S) ............................................. 14
3-3. Front Panel Section ......................................................... 10
3-4. TC Board, Mechanical Deck .......................................... 11
3-5. MAIN Board ................................................................... 11
3-6. Tuner Unit ....................................................................... 12
3-7. CD Mechanism Deck (CDM55C-K6BD44S) ................ 12
3-8. Loading Board ................................................................. 13
3-9. Cam (CDM55) ................................................................ 13
3-10. Base Unit (BU-K6BD44S) ............................................. 14
4.
TEST MODE
.............................................................. 15
5.
ELECTRICAL ADJUSTMENTS
Deck Section ................................................................... 17
CD Section ...................................................................... 18
CD Section ...................................................................... 18
6.
DIAGRAMS
6-1. Block Diagram – CD Servo Section – ........................... 19
6-2. Block Diagram – TUNER/TAPE DECK Section – ...... 20
6-3. Block Diagram – MAIN Section – ................................ 21
6-4. Block Diagram
6-2. Block Diagram – TUNER/TAPE DECK Section – ...... 20
6-3. Block Diagram – MAIN Section – ................................ 21
6-4. Block Diagram
– DISPLAY/POWER SUPPLY Section – ...................... 22
6-5. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 23
6-6. Printed Wiring Board – BD Board – ............................. 24
6-7. Schematic Diagram – BD Board – ................................ 25
6-8. Printed Wiring Board – TC Board – .............................. 26
6-9. Schematic Diagram – TC Board – ................................. 27
6-10. Printed Wiring Boards
6-7. Schematic Diagram – BD Board – ................................ 25
6-8. Printed Wiring Board – TC Board – .............................. 26
6-9. Schematic Diagram – TC Board – ................................. 27
6-10. Printed Wiring Boards
– LOADING/MAIN Boards – ....................................... 29
6-11. Schematic Diagram – MAIN Board (1/2) – .................. 30
6-12. Schematic Diagram
6-12. Schematic Diagram
– LOADING/MAIN (2/2) Boards – ............................... 31
6-13. Printed Wiring Board – AMP Board – .......................... 32
6-14. Schematic Diagram – AMP Board – ............................. 33
6-15. Printed Wiring Boards
6-14. Schematic Diagram – AMP Board – ............................. 33
6-15. Printed Wiring Boards
– BACK LIGHT/LCD/SWITCH Boards – .................... 34
6-16. Schematic Diagram
– BACK LIGHT/LCD/SWITCH Boards – ................... 35
6-17. Printed Wiring Board
– HP/ SP OUT/POWER Boards – ................................. 36
6-18. Schematic Diagram
– HP/ SP OUT/POWER Boards – ................................ 37
6-19. IC Pin Function Description ........................................... 42
7.
EXPLODED VIEWS
7-1. Case Section .................................................................... 45
7-2. Front Panel Section-1 ...................................................... 46
7-3. Front Panel Section-2 ...................................................... 47
7-4. Lid (TC) Section ............................................................. 48
7-5. Chassis Section-1 ............................................................ 49
7-6. Chassis Section-2 ............................................................ 50
7-7. Chassis Section-3 ............................................................ 51
7-8. CD Mechanism Deck Section
7-2. Front Panel Section-1 ...................................................... 46
7-3. Front Panel Section-2 ...................................................... 47
7-4. Lid (TC) Section ............................................................. 48
7-5. Chassis Section-1 ............................................................ 49
7-6. Chassis Section-2 ............................................................ 50
7-7. Chassis Section-3 ............................................................ 51
7-8. CD Mechanism Deck Section
(CDM55C-K6BD44S) .................................................... 52
7-9. Base Unit (BU-K6BD44S) ............................................. 53
8.
ELECTRICAL PARTS LIST
............................... 54
This appliance is
classified as a CLASS 1
LASER product. This
label is located on the
rear exterior.
classified as a CLASS 1
LASER product. This
label is located on the
rear exterior.
3
HCD-CPX1
SECTION 1
SERVICING NOTES
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
NOTE ON INSTALLING AND REMOVING THE TAPE MECHANICAL DECK
To prevent four screws of +BVTP 3
×
8 TYPE 2 TT (B), that fix the mechanical deck to the front panel, from being magnetized, must not
use a magnetic screwdriver.
screw +BVTP 3
×
8 TYPE 2 TT (B)
screw +BVTP 3
×
8 TYPE 2 TT (B)
non-magnetic screwdriver
4
HCD-CPX1
TAPE MECHANICAL DECK SERVICE POSITION
Set up the service position with putting an insulator under the mechanical deck as the figure shown below.
tape mechanical deck
insulator
CD MECHANISM DECK SERVICE POSITION
Set up the service position for the CD mechanism deck with disassembling the entire set as the figure shown below.
AMP section
CD mechanism deck
main board
front panel