CMT-CP505MD, HCD-CP505 - Sony Audio Service Manual (repair manual)

AEP Model

UK Model

E Model

Chinese Model

— Continued on next page —

HCD-CP505 is the Amplifier, CD player, MD
deck, Tape player and Tuner section in
CMT-CP505MD.

Model Name Using Similar Mechanism

NEW

CD Mechanism Type

CDM55G-30BBD61B

Base Unit Type

BU-30BBD61B

Optical Pick-up Type

A-MAX. 3

Model Name Using Similar Mechanism

NEW

MD Mechanism Type

MDM-7S2C

Optical Pick-up Type

KMS-262E

Model Name Using Similar Mechanism

NEW

Tape Transport Mechanism Type

CMAL1Z-221A

CD

Section

MD

Section

Tape deck

Section

2009L05-1

© 2009.12

European model:
DIN power output (rated): 30 + 30 W

(6 ohms at 1 kHz, DIN)

Continuous RMS power output (reference):

35 + 35 W
(6 ohms at 1 kHz, 10%
THD)

Music power output (reference):

70 + 70 W

Other models:
The following measured at 230 V AC, 60 Hz
DIN power output (rated): 25 + 25 W

(6 ohms at 1 kHz, DIN)

Continuous RMS power output (reference):

30 + 30 W
(6 ohms at 1 kHz, 10%
THD)

The following measured at 220 V AC, 60 Hz
DIN power output (rated): 22 + 22 W

(6 ohms at 1 kHz, DIN)

Continuous RMS power output (reference):

28 + 28 W
(6 ohms at 1 kHz, 10%
THD)

Inputs
ANALOG IN:

Sensitivity 250 mV,

(phono jacks)

impedance 47 kilohms

DIGITAL OPTICAL IN (supported sampling
frequencies: 32 kHz, 44.1 kHz and 48 kHz)

Outputs
PHONES:

Accepts headphones with
an impedance of 8 ohms
or more

SPEAKER:

accepts impedance of 6 to
16 ohms.

System

Compact disc and digital
audio system

Laser

Semiconductor laser
(

λ=780 nm)

Emission duration:
continuous

Frequency response

2 Hz – 20 kHz

System

Minidisc digital audio
system

Laser

Semiconductor laser
(

λ=780 nm)

Emission duration:
continuous

Sampling frequency

44.1 kHz

Frequency response

5 Hz – 20 kHz

Recording system

4-track 2-channel stereo

Frequency response

50 – 13,000 Hz (

±3 dB),

using Sony TYPE I
cassettes

2

FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range

87.5 - 108.0 MHz
(50-kHz step)

Antenna

FM wire antenna

Antenna terminals

75 ohms unbalanced

Intermediate frequency

10.7 MHz

AM tuner section
Tuning range
European model:

531 - 1,602 kHz
(with the tuning interval
set at 9 kHz)

Other models:

530 - 1,710 kHz
(with the tuning interval
set at 10 kHz)
531 - 1,602 kHz
(with the tuning interval
set at 9 kHz)

Antenna

AM loop antenna, external
antenna terminal

Intermediate frequency

450 kHz

Power requirements
European model:

230 V AC, 50/60 Hz

Other models:

110 – 120 V or
220 – 240 V AC,
50/60 Hz
Adjustable with voltage
selector

Power consumption
European model:

See the name plate
0.3 watts (at the Power
Saving mode)

Other models:

See the name plate

Dimensions (w/h/d) incl. projecting parts and controls
Amplifier/Tuner/Tape/MD/CD section:

Approx. 175 

× 240 ×

341.5 mm

Speaker:

Approx. 152 

× 240 ×

258.5 mm

Mass
Amplifier/Tuner/Tape/MD/CD section:

Approx. 6.1 kg

Speakers:

Approx. 2.6 kg net per
speaker

Supplied accessories

Remote (1)
R6 (size AA) batteries (2)
AM loop antenna (1)
FM lead antenna (1)

Optional accessories

Sony PC connection kit
(See the catalogue and
other promotional
materials for the release
date.)
The optional accessories
for this system are subject
to change without notice.
For details, consult your
nearest Sony dealer.

Design and specifications are subject to change
without notice.

This appliance is
classified as a CLASS 1
LASER product. This
label is located on the
rear exterior.

Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

Never look into the laser diode emission from right above when
checking it for adjustment. It is feared that you will lose your sight.

Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.

• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)

The following caution label is located inside the apparatus.

3

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········································································ 12

······························································ 15

3-1. Top Panel Section ·························································· 16
3-2. Cassette Mechanism Deck ············································ 16
3-3. Front Panel, MD Mechanism Deck Block ···················· 17
3-4. SWITCH Board, JACK Board ······································ 18
3-5. Back Panel Section (Including OPTICAL Board,

OPTICAL RETAINER Board) ····································· 19

3-6. MAIN Board ································································· 19
3-7. POWER Board ······························································ 20
3-8. CONTROL Board, CD Mechanism Deck

(CDM55G-30BBD61B) ················································ 20

3-9. Cam (CDM55) ······························································ 21
3-10. Base Unit (BU-30BBD61B) ········································ 21
3-11. Optical Pick-Up (BU-30B Assy) ································· 22
3-12. MD Mechanism Deck (MDM-7S2C) ·························· 22
3-13. DIGITAL Board ·························································· 23
3-14. Holder Section ····························································· 23
3-15. BD (MD) Board ·························································· 24
3-16. Loading Motor Assembly (M103),

Spindle Motor Assembly (M101),
Sled Motor Assembly (M102) ····································· 24

3-17. Over Wright Head (HR901) ········································ 25
3-18. Mini Disc Device (KMS-262E) ·································· 25

···································································· 26

······························· 31

······································································ 44

6-1. Circuit Boards Location ················································ 45
6-2. Block Diagrams ····························································· 46

MD Section ··································································· 46
CD and Main Section ···················································· 47

0

0

6-3. Printed Wiring Board  – BD (CD) Board – ··················· 48
6-4. Schematic Diagram  –  BD (CD) Board  – ···················· 49
6-5. Printed Wiring Board  –  BD (MD) Board  – ················ 50
6-6. Schematic Diagram  – BD (MD) Board (1/2) – ············ 51
6-7. Schematic Diagram  – BD (MD) Board (2/2) – ············ 52
6-8. Printed Wiring Board  – MAIN Board – ······················· 53
6-9. Schematic Diagram  – MAIN Board (1/2) – ················· 54
6-10. Schematic Diagram  – MAIN Board (2/2) – ··············· 55
6-11. Printed Wiring Board  – DIGITAL Board – ················ 56
6-12. Schematic Diagram  – DIGITAL Board – ··················· 57
6-13. Printed Wiring Board  – TC Board – ··························· 58
6-14. Schematic Diagram  – TC Board – ····························· 59
6-15. Printed Wiring Board  – Control Section (Side A) – ··· 60
6-16. Printed Wiring Boards  – Control Section (Side B) – · 61
6-17. Schematic Diagram  – Control Section (1/2) – ··········· 62
6-18. Schematic Diagram  – Control Section (2/2) – ··········· 63
6-19. Printed Wiring Boards  – Switch Section – ················· 64
6-20. Schematic Diagram  – Switch Section – ····················· 65
6-21. Printed Wiring Board  – POWER Board – ·················· 66
6-22. Schematic Diagram  – POWER Board – ····················· 67
6-23. Printed Wiring Board  – OPTICAL Board – ··············· 68
6-24. Schematic Diagram  – OPTICAL Board – ·················· 69
6-25. IC Block Diagrams ······················································ 70
6-26. IC Pin Function Description ········································ 78

7-1. Overall Section ······························································ 83
7-2. Front Panel Section ······················································· 84
7-3. Back Panel Section ························································ 85
7-4. MD Mechanism Deck Section-1 (MDM-7S2C) ··········· 86
7-5. MD Mechanism Deck Section-2 (MDM-7S2C) ··········· 87
7-6. CD Mechanism Deck Section-1

(CDM55G-30BBD61B) ················································ 88

7-7. CD Mechanism Deck Section-2 (BU-30BBD61B) ······ 89

······································· 90

Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40

°C higher than

ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350

°C.

Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

4

The sound source is a copy of a commercially
available music software or CD-R.

cThe Serial Copy Management System prevents

making a digital copy (see page 64). In addition,
you cannot copy from a CD-R.

No component is connected to the DIGITAL
OPTICAL IN jack, or you tried to record from the
digital component which is not connected
correctly.

cConnect the optional digital component correctly

to the DIGITAL OPTICAL IN jack using the
digital optical cable (not supplied) (see page 53).

The power of the connected component is not
turned on.

cCheck if the power of the connected digital

component is on. Refer to the operating
instructions supplied with the component.

The digital optical cable is disconnected, or the
power of the connected component is turned off
while recording the digital audio from the
component connected to the DIGITAL OPTICAL
IN jack.
cConnect the digital optical cable, or turn on the

power of the connected component.

The component has internal problem.

cConsult your nearest Sony dealer.

There is a problem with the laser pickup.

cThe laser pickup may be damaged. Consult your

nearest Sony dealer.

There is a problem with the loading.

cConsult your nearest Sony dealer.

This system has a Self-diagnosis display
function to let you know if there is a system
malfunction. The display shows a code made
up of three or five letters and a message
alternately to show you the problem. To solve
the problem refer to the following list. If any
problem persists, consult your nearest Sony
dealer.

The MD is protected against erasure.
cRemove the MD and slide the tab to close the

slot (see page 17).

You tried to record a CD with a format that the
system does not support, such as a CD-ROM.

cRemove the disc and turn off the system once,

then turn it on again.

Recording could not be performed properly.

cMove the system to a stable place, and start

recording over from the beginning.

The MD is dirty or scratched, or the MD does not
meet the standards.

cReplace the MD and start recording over from

the beginning.

The MD deck cannot read the disc information
properly.

cRemove the MD once, then insert it again.

The MD deck cannot read the disc information
properly.
cReplace the MD.
cErase all the recorded contents of the MD using

the All Erase Function (see page 34).