Read Sony CMT-CP11 / CMT-CP11K / HCD-CP11 Service Manual online
3
1. SERVICING NOTES
······················································ 3
2. GENERAL
·········································································· 5
3. DISASSEMBLY
································································ 7
4. SERVICE MODE
··························································· 11
5. ELECTRICAL CONFIRMATIONS AND
ADJUSTMENTS
···························································· 12
6. DIAGRAMS
6-1. Circuit Boards Locations ··················································· 14
6-2. Block Diagram – TAPE Section – ····································· 15
6-3. Block Diagram – MAIN Section – ···································· 16
6-4. Block Diagram
6-2. Block Diagram – TAPE Section – ····································· 15
6-3. Block Diagram – MAIN Section – ···································· 16
6-4. Block Diagram
– DISPLAY/POWER SUPPLY Section – ························· 17
6-5. Printed Wiring Board – MAIN Section – ·························· 18
6-6. Schematic Diagram – MAIN Section (1/2) – ···················· 19
6-7. Schematic Diagram – MAIN Section (2/2) – ···················· 20
6-8. Printed Wiring Boards
6-6. Schematic Diagram – MAIN Section (1/2) – ···················· 19
6-7. Schematic Diagram – MAIN Section (2/2) – ···················· 20
6-8. Printed Wiring Boards
– LCD/HEADPHONE/LOADING/SPEAKER Section – · 21
6-9. Schematic Diagrams
– HEADPHONE/SPEAKER Section – ····························· 21
6-10. Printed Wiring Boards – CONTROL Section – ················· 22
6-11. Schematic Diagram – CONTROL Section – ····················· 23
6-12. Printed Wiring Board – POWER Section – ······················· 24
6-13. Schematic Diagram – POWER Section – ·························· 25
6-14. IC Block Diagrams ···························································· 26
6-15. IC Pin Function Description ·············································· 28
6-11. Schematic Diagram – CONTROL Section – ····················· 23
6-12. Printed Wiring Board – POWER Section – ······················· 24
6-13. Schematic Diagram – POWER Section – ·························· 25
6-14. IC Block Diagrams ···························································· 26
6-15. IC Pin Function Description ·············································· 28
7. EXPLODED VIEWS
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8. ELECTRICAL PARTS LIST
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TABLE OF CONTENTS
SECTION 1
SERVICING NOTES
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
other than those specified herein may result in hazardous
radiation exposure.
This appliance is classified as a CLASS 1 LASER product.
The CLASS 1 LASER PRODUCT MARKING is located on
the rear exterior.
The CLASS 1 LASER PRODUCT MARKING is located on
the rear exterior.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
exceeding the limit for Class 1.
The following caution label is located inside the unit.
CAUTION
:
INVISIBLE LASER RADIATION WHEN OPEN AND
INTERLOCKS DEFEATED. AVOID EXPOSURE TO BEAM.
ADVARSEL :
USYNLIG LASERSTRÅLING VED ÅBNING NÅR
SIKKERHEDSAFBRYDERE ER UDE AF FUNKTION. UNDGÅ UDSAETTELSE
FOR STRÅLING.
FOR STRÅLING.
VORSICHT :
UNSICHTBARE LASERSTRAHLUNG, WENN
ABDECKUNG GEÖFFNET UND SICHERUEITSVERRIEGELUNG
ÜBERBRÜCKT. NICHT DEM STRAHL AUSSETZEN.
ÜBERBRÜCKT. NICHT DEM STRAHL AUSSETZEN.
VARO
!
:
AVATTAESSA JA SUOJALUKITUS OHITETTAESSA OLET ALT-
TIINA NÄKYMÄTTÖMÄLLE LASERSÄTEILYLLE. ÄLÄ KATSO SÄTEESEEN.
VARNING
:
OSYNLING LASERSTRÅLING NÄR DENNA DEL ÄR ÖPPNAD
OCH SPÄRREN ÄR URKOPPLAD. BETRAKTA EJ STRÅLEN.
ADVERSEL :
USYNLIG LASERSTRÅLING NÅR DEKSEL ÅPNES OG
SIKKERHEDSLÅS BRYTES. UNNGÅ EKSPONERING FOR STRÅLEN.
VIGYAZAT
! :
A BURKOLAT NYITÁSAKOR LÁTHATATLAN LÉZERSU-
GÁRVESZÉLY
! KERÜLJE A BESUGÁRZÁST!
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