Read Sony CMT-BX3R / CMT-BX4R / HCD-BX3R / HCD-BX4R Service Manual online
SERVICE MANUAL
COMPACT DISC RECEIVER
SPECIFICATIONS
HCD-BX3R/BX4R
Ver. 1.1 2007.07
Model Name Using Similar Mechanism
NEW
Base Unit Name
BU-K6BD91UR-WOD
Optical Pick-up Mechanism Type
KSM-213DCP
9-887-739-02
2007G05-1
© 2007.07
© 2007.07
Sony Corporation
Personal Audio Division
Published by Sony Techno Create Corporation
Published by Sony Techno Create Corporation
E Model
Russian Model
HCD-BX3R
Mexican Model
HCD-BX3R/BX4R
•
HCD-BX3R is the amplifier, USB, CD player and
tuner section in CMT-BX3R.
tuner section in CMT-BX3R.
•
HCD-BX4R is the amplifier, USB, CD player and
tuner section in CMT-BX4R.
tuner section in CMT-BX4R.
• “WALKMAN” and “WALKMAN” logo are registered
trademarks of Sony Corporation.
• MICROVAULT is a trademark of Sony Corporation.
• MPEG Layer-3 audio coding technology and patents
• MPEG Layer-3 audio coding technology and patents
licensed from Fraunhofer IIS and Thomson.
Amplier section
Russian model:
DIN power output (rated):
18 + 18 watts (6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
25 + 25 watts (6 ohms at 1 kHz, 10% THD)
Music power output (reference):
38 + 38 watts (6 ohms at 1 kHz, 10% THD)
18 + 18 watts (6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
25 + 25 watts (6 ohms at 1 kHz, 10% THD)
Music power output (reference):
38 + 38 watts (6 ohms at 1 kHz, 10% THD)
Other models:
DIN power output (rated):
18 + 18 watts (6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
25 + 25 watts (6 ohms at 1 kHz, 10% THD)
18 + 18 watts (6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
25 + 25 watts (6 ohms at 1 kHz, 10% THD)
Inputs:
AUDIO IN (stereo mini jack): voltage
250 mV, impedance 47 kilohms
250 mV, impedance 47 kilohms
(USB) port: Type A, maximum current
500 mA
Outputs:
PHONES (stereo mini jack): accepts
headphones of 8 ohms or more
SPEAKER: accepts impedance of 6 to 16 ohms
headphones of 8 ohms or more
SPEAKER: accepts impedance of 6 to 16 ohms
USB section
Supported bit rate
MP3 (MPEG 1 Audio Layer-3):
32
32
−
320 kbps, VBR
Sampling frequencies
MP3 (MPEG 1 Audio Layer-3):
32/44.1/48 kHz
32/44.1/48 kHz
(USB) port
USB-A (Full Speed)
CD player section
System: Compact disc and digital audio system
Laser Diode Properties
Laser Diode Properties
Emission duration: continuous
Laser Output*: Less than 44.6
Laser Output*: Less than 44.6
µ
W
* This output is the value measurement at a
distance of 200mm from the objective lens
surface on the Optical Pick-up Block with 7mm
aperture.
surface on the Optical Pick-up Block with 7mm
aperture.
Frequency response: 20 Hz
−
20 kHz
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 90 dB
Dynamic range: More than 90 dB
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section:
Tuning range:
87.5
−
108.0 MHz (50 kHz step)
Antenna: FM lead antenna
Antenna terminals: 75 ohms unbalanced
Intermediate frequency: 10.7 MHz
Antenna terminals: 75 ohms unbalanced
Intermediate frequency: 10.7 MHz
AM tuner section:
Tuning range
Russian model:
531
531
−
1,602 kHz (with 9 kHz tuning interval)
Other models:
530
530
−
1,710 kHz (with 10 kHz tuning interval)
531
−
1,710 kHz (with 9 kHz tuning interval)
Antenna: AM loop antenna, external antenna terminal
Intermediate frequency: 450 kHz
Intermediate frequency: 450 kHz
General
Power requirements
Russian model: 230 V AC, 50/60 Hz
Mexican model: 120 V AC, 60 Hz
Argentine model: 220 V AC, 50/60 Hz
Other models: 120 V, 220 V, 230
Mexican model: 120 V AC, 60 Hz
Argentine model: 220 V AC, 50/60 Hz
Other models: 120 V, 220 V, 230
−
240 V AC,
50/60 Hz, adjustable with voltage selector
Power consumption: 65 watts
Dimensions (w/h/d) (excl. speakers):
Approx. 200
Dimensions (w/h/d) (excl. speakers):
Approx. 200
×
132
×
298 mm
Mass (excl. speakers): Approx. 3.7 kg
Design and specications are subject to change
without notice.
without notice.
Photo: HCD-BX3R
2
HCD-BX3R/BX4R
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
•
Keep the temperature of the soldering iron around 270 ˚C
during repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
other than those specified herein may result in hazardous radiation
exposure.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
TABLE OF CONTENTS
1.
SERVICING NOTES
...............................................
3
2.
GENERAL
...................................................................
5
3.
DISASSEMBLY
3-1.
Disassembly Flow ...........................................................
6
3-2.
Panel (Side L/R) ..............................................................
7
3-3.
Panel (Top) ......................................................................
7
3-4.
MAIN Board, Shield Plate (PWB MAIN) ......................
8
3-5.
Lid (CD) Assy .................................................................
9
3-6.
Panel (Front) Assy ...........................................................
9
3-7.
D.C. Fan (M301), Panel (Rear) ....................................... 10
3-8.
POWER Transformer (T1) .............................................. 10
3-9.
Loading Mechanism Block ............................................. 11
3-10. Base Unit ......................................................................... 11
3-11. Belt .................................................................................. 12
3-12. OP Base Assy (KSM-213D) ............................................ 12
3-11. Belt .................................................................................. 12
3-12. OP Base Assy (KSM-213D) ............................................ 12
4.
TEST MODE
.............................................................. 13
5.
ELECTRICAL CHECKS
........................................ 15
6.
DIAGRAMS
6-1.
Block Diagram – CD SERVO Section – ......................... 17
6-2.
Block Diagram – TUNER, USB Section – ..................... 18
6-3.
Block Diagram – MAIN Section – .................................. 19
6-4.
Block Diagram
– PANEL, POWER SUPPLY Section – .......................... 20
– PANEL, POWER SUPPLY Section – .......................... 20
6-5.
Printed Wiring Boards – CD Section – ........................... 22
6-6.
Schematic Diagram – CD Board – .................................. 23
6-7.
Printed Wiring Board – USB Board – ............................. 24
6-8.
Schematic Diagram – USB Board – ................................ 25
6-9.
Printed Wiring Boards – REGULATOR Section – ......... 26
6-10. Schematic Diagram – REGULATOR Section – .............. 26
6-11. Printed Wiring Board – MAIN Board – .......................... 27
6-12. Schematic Diagram – MAIN Section (1/4) – .................. 28
6-13. Schematic Diagram – MAIN Section (2/4) – .................. 29
6-14. Schematic Diagram – MAIN Section (3/4) – .................. 30
6-15. Schematic Diagram – MAIN Section (4/4) – .................. 31
6-16. Printed Wiring Board – AMP Board – ............................ 32
6-17. Schematic Diagram – AMP Board – ............................... 33
6-18. Printed Wiring Boards – SPEAKER Section – ............... 34
6-19. Schematic Diagram – SPEAKER Section – .................... 35
6-20. Printed Wiring Boards – PANEL Section – ..................... 36
6-21. Schematic Diagram – PANEL Section – ......................... 37
6-22. Printed Wiring Boards
6-11. Printed Wiring Board – MAIN Board – .......................... 27
6-12. Schematic Diagram – MAIN Section (1/4) – .................. 28
6-13. Schematic Diagram – MAIN Section (2/4) – .................. 29
6-14. Schematic Diagram – MAIN Section (3/4) – .................. 30
6-15. Schematic Diagram – MAIN Section (4/4) – .................. 31
6-16. Printed Wiring Board – AMP Board – ............................ 32
6-17. Schematic Diagram – AMP Board – ............................... 33
6-18. Printed Wiring Boards – SPEAKER Section – ............... 34
6-19. Schematic Diagram – SPEAKER Section – .................... 35
6-20. Printed Wiring Boards – PANEL Section – ..................... 36
6-21. Schematic Diagram – PANEL Section – ......................... 37
6-22. Printed Wiring Boards
– POWER Section (BX3R: E2, E51) – ........................... 38
6-23. Schematic Diagram
– POWER Section (BX3R: E2, E51) – ........................... 39
6-24. Printed Wiring Board
– POWER Board (BX3R: MX, AR, RU/BX4R) – .......... 40
6-25. Schematic Diagram
– POWER Board (BX3R: MX, AR, RU/BX4R) – .......... 41
7.
EXPLODED VIEWS
7-1.
Panel Section ................................................................... 52
7-2.
Front Panel Section ......................................................... 53
7-3.
Main Section .................................................................... 54
7-4.
POWER Board Section ................................................... 55
7-5.
Loading Mechanism Section ........................................... 56
7-6.
Base Unit Section (BU-K6BD91UR-WOD) ................... 57
8.
ELECTRICAL PARTS LIST
................................ 58
classified as a CLASS
1 LASER product. This
marking is located on the
rear exterior.
1 LASER product. This
marking is located on the
rear exterior.
This appliance is
•
Abbreviation
AR
AR
: Argentina model
E2
: 120V AC area in E model
E51 : Chilean and Peruvian models
MX : Mexican model
RU
MX : Mexican model
RU
: Russian model
Ver. 1.1
3
HCD-BX3R/BX4R
SECTION 1
SERVICING NOTES
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•
Unleaded solder melts at a temperature about 40 ˚C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•
Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
ANTITHEFT UNLOCK MODE
Procedure:
1. Press the
I/
1
button to turn the power on.
2. Press the [CD] button on the remote commander to select “CD”.
3. Press two buttons of
3. Press two buttons of
x
/CANCEL
and
Z
for 5 seconds.
4. The message “UNLOCKED” is displayed on the liquid crystal
display and the disc tray is unlocked.
Note:
When “LOCKED” is displayed, the tray lock is not released by turning
power on/off with the
power on/off with the
I
/1 button.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
MODEL IDENTIFICATION
Part No.
Model
3-106-904-0[]
BX3R: E2, E51
3-106-902-0[]
BX3R: MX
3-106-905-0[]
BX3R: AR
3-106-901-0[]
BX3R: RU
3-268-318-0[]
BX4R
Part No.
– Rear View –
•
Abbreviation
AR
AR
: Argentina model
E2
: 120V AC area in E model
E51 : Chilean and Peruvian models
MX : Mexican model
RU
MX : Mexican model
RU
: Russian model
Ver. 1.1
4
HCD-BX3R/BX4R
HOW TO OPEN THE TRAY WHEN POWER SWITCH TURN OFF
2
Push the boss.
3
Open the tray.
1
Insert the driver.
