CMT-BX30R, CMT-BX40R, HCD-BX30R, HCD-BX40R - Sony Audio Service Manual (repair manual)

2008H05-1

© 

2008.08

Model Name Using Similar Mechanism

NEW

Base Unit Name

BU-K6BD91UR2-WOD

Optical Pick-up Block Name

KSM-213DCP

•  HCD-BX30R is the amplifi er, USB, CD player 

and tuner section in CMT-BX30R.

•  HCD-BX40R is the amplifi er, USB, CD player 

and tuner section in CMT-BX40R.

• “WALKMAN” and “WALKMAN” logo are registered trademarks 
   of Sony Corporation.
• MPEG Layer-3 audio coding technology and patents licensed from 
   Fraunhofer IIS and Thomson.
• Windows Media is a registered trademark of Microsoft Corporation 
   in the United States and/or other countries.

European and Russian models:

DIN power output (rated):
18 + 18 watts (6 ohms at 1 kHz, DIN)
Continuous RMS power output
(reference): 25 + 25 watts (6 ohms at
1 kHz, 10% THD)
Music power output (reference):
38 + 38 watts (6 ohms at 1 kHz, 10% 
THD)

Other models:

DIN power output (rated):
18 + 18 watts (6 ohms at 1 kHz, DIN)
Continuous RMS power output
(reference): 25 + 25 watts (6 ohms at
1 kHz, 10% THD)

Inputs:

AUDIO IN (stereo mini jack):
voltage 250 mV, impedance
47 kilohms

 (USB) port: Type A, maximum

current 500 mA

Outputs:

PHONES (stereo mini jack): accepts
headphones of 8 ohms or more
SPEAKER: accepts impedance of
6 ohms

Supported bit rate

MP3 (MPEG 1 Audio Layer-3):
32 — 320 kbps, VBR
WMA: 32 —  192 kbps, VBR
AAC: 48 —  320 kbps

Sampling frequencies

MP3 (MPEG 1 Audio Layer-3):
32/44.1/48 kHz
WMA: 44.1 kHz
AAC: 44.1 kHz

System: Compact disc and digital audio
system
Laser Diode Properties

Emission Duration: Continuous
Laser Output*: Less than 44.6μW

*

This output is the value measurement

at a distance of 200mm from the
objective lens surface on the Optical
Pick-up Block with 7mm aperture.

Frequency response: 20 Hz — 20 kHz
Signal-to-noise ratio: More than 90 dB
Dynamic range: More than 90 dB

FM stereo, FM/AM superheterodyne tuner

FM tuner section:

Tuning range:

87.5 — 108.0 MHz (50 kHz step)

Antenna: FM lead antenna
Antenna terminals: 75 ohms unbalanced
Intermediate frequency: 10.7 MHz

AM tuner section:

Tuning range

European and Russian models:
531 — 1,602 kHz (with 9 kHz tuning
interval)
Other models:
530 — 1,710 kHz (with 10 kHz tuning
interval)
531 — 1,710 kHz (with 9 kHz tuning
interval)

Power requirements

European and Russian models: 230 V 
AC, 50/60 Hz
Mexican model: 120 V AC, 60 Hz
Argentine model: 220 V AC, 50/60 Hz
Other models: 120 V, 220 V, 230 −
240 V AC, 50/60 Hz, adjustable with
voltage selector

Power consumption

European model: 60 watts
Other models: 63 watts

Dimensions (w/h/d) (excl. speakers):
Approx. 215 × 140 × 298 mm
Mass (excl. speakers): Approx. 3.9 kg

change without notice.

Design and specifications are subject to

Antenna: AM loop antenna, external
antenna terminal
Intermediate frequency: 450 kHz

Photo: HCD-BX30R

Notes on chip component replacement
• 

Never reuse a disconnected chip component.

• 

Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

Flexible Circuit Board Repairing
• 

Keep the temperature of soldering iron around 270 °C during 
repairing.

• 

Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).

• 

Be careful not to apply force on the conductor when soldering 
or unsoldering.

COMPONENTS  IDENTIFIED  BY  MARK 0 OR  DOTTED  LINE  
WITH  MARK 0 ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 

CAUTION
Use of controls or adjustments or performance of procedures other than 
those specifi ed herein may result in hazardous radiation exposure.

This appliance is classifi ed as a CLASS 
1 LASER product. For Latin American 
models only except for the Mexico and 
Argentine models, this marking is located 
on the bottom exterior. For other models, 
this marking is located on the rear exterior.

  .............................................   3

  ..................................................................   5

3-1. Disassembly 

Flow 

...........................................................   7

3-2.  Panel (Side L/R) ..............................................................   8
3-3.  Top Panel Block ..............................................................   8
3-4.  TOP KEY Board, Panel Top ...........................................   9
3-5.  Front Panel Block ...........................................................   9
3-6.  Rear Panel Block ............................................................   10
3-7.  D.C.Fan (M901), Tuner (FM/AM), Panel (Rear) ...........   10
3-8. MAIN 

Board 

...................................................................  11

3-9.  POWER Board Block .....................................................   11
3-10.  AMP Board Block ...........................................................   12
3-11.  Loading Mechanism Block .............................................   12
3-12. Base Unit .........................................................................   13
3-13. Belt ..................................................................................   13
3-14.  OP Base Assy (KSM-213D) ...........................................   14

TEST  MODE 

 ............................................................   15

ELECTRICAL  CHECKS 

 ......................................   17

6-1.  Block Diagram - CD SERVO Section - ..........................   18
6-2.  Block Diagram - MAIN Section - ...................................   19
6-3. Block 

Diagram 

 

- PANEL/POWER SUPPLY Section - ............................   20

6-4.  Printed Wiring Boards - CD Section - ............................   22
6-5.  Schematic Diagram - CD Section - .................................   23
6-6.  Printed Wiring Board - USB Board - ..............................   24
6-7.  Schematic Diagram - USB Board - .................................   25
6-8.  Printed Wiring Boards - MAIN Section - .......................   26
6-9.  Schematic Diagram - MAIN Section (1/3) - ...................   27
6-10.  Schematic Diagram - MAIN Section (2/3) - ...................   28
6-11.  Schematic Diagram - MAIN Section (3/3) - ...................   29
6-12.  Printed Wiring Boards - AMP/HP Boards - ....................   30
6-13.  Schematic Diagram - AMP/HP Boards - ........................   31
6-14.  Printed Wiring Boards - PANEL Section - .....................   32
6-15.  Schematic Diagram - PANEL Section - ..........................   33
6-16.  Printed Wiring Boards - POWER SUPPLY Section - ....   34
6-17.  Schematic Diagram - POWER SUPPLY Section - .........   35

7-1. Panel 

Section 

...................................................................  44

7-2.  Top Panel Section ...........................................................   45
7-3.  Front Panel Section .........................................................   46
7-4.  MAIN Board Section ......................................................   47
7-5.  POWER Board Section ...................................................   48
7-6.  Loading Mechanism Section ..........................................   49
7-7.  Base Unit Section (BU-K6BD91UR2-WOD)  ...............   50

  ..............................   51

The laser diode in the optical pick-up block may suffer electrostat-
ic break-down because of the potential difference generated by the 
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.

NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution:  The printed pattern (copper foil) may peel away if the 

heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

• 

Usable with ordinary solder

 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

ANTITHEFT  UNLOCK  MODE
Procedure:
1.  Press the [

?/1

] button to turn the power on.

2.  Press the [FUNCTION] button to select “CD”.
3.  Press two buttons of [

x/

CANCEL] and [

A

] for 5 seconds.

4.  The message “UNLOCKED” is displayed on the fl uorescent 

indicator tube and the disc tray is unlocked.

Note:  When “LOCKED” is displayed, the tray lock is not released by 

turning power on/off with the [?/1] button.

BX30R: AEP model

3-293-466-0[]

BX30R: Russian model

3-295-845-0[]

BX30R: 120V AC area in E, Chilean 
              and Peruvian models

3-295-846-0[]

BX30R: Mexican model

3-295-847-0[]

BX30R: Argentina model

3-295-864-0[]

BX40R: Mexican model

4-107-474-0[]

Note:  Please insert a screwdriver after removing the panel (side L).
 

About disassembly of the panel (side L), please refer to “3-2. Panel (Side L/R)” (page 8).