CMT-BX10, CMT-BX20, CMT-BX50BT, HCD-BX10, HCD-BX20, HCD-BX50BT - Sony Audio Service Manual (repair manual). Page 2

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HCD-BX10/BX20/BX50BT
2
1. 
SERVICING  NOTES
  .............................................   3
2. GENERAL
  ..................................................................   5
3. DISASSEMBLY
3-1. Disassembly 
Flow 
...........................................................   7
3-2.  Panel (Side L/R) ..............................................................   8
3-3.  Top Panel Block ..............................................................   8
3-4.  TOP KEY Board, Panel Top ...........................................   9
3-5.  Front Panel Block ...........................................................   9
3-6.  Rear Panel Block ............................................................   10
3-7. Panel 
(Rear) 
....................................................................  10
3-8.  AMP Board Block ...........................................................   11
3-9.  POWER Board Block .....................................................   11
3-10. MAIN Board ...................................................................   12
3-11.  Loading Mechanism Block .............................................   12
3-12. Base Unit .........................................................................   13
3-13. Belt ..................................................................................   13
3-14.  OP Base Assy (KSM-213D) ...........................................   14
4. 
TEST  MODE 
 ............................................................   15
5. 
ELECTRICAL  CHECKS 
 ......................................   17
6. DIAGRAMS
6-1.  Block Diagram - CD SERVO Section - ..........................   19
6-2.  Block Diagram - TUNER/BLUETOOTH Section - .......   20
6-3.  Block Diagram - MAIN Section - ...................................   21
6-4. Block 
Diagram 
 
- PANEL/POWER SUPPLY Section - ............................   22
6-5.  Printed Wiring Boards - CD Section - ............................   24
6-6.  Schematic Diagram - CD Board - ...................................   25
6-7. Printed 
Wiring 
Boards 
 
- BLUETOOTH Section (BX50BT) - .............................   26
6-8. Schematic 
Diagram 
 
- BLUETOOTH Section (BX50BT) - .............................   27
6-9.  Printed Wiring Boards - MAIN Section - .......................   28
6-10.  Schematic Diagram - MAIN Section (1/3) - ...................   29
6-11.  Schematic Diagram - MAIN Section (2/3) - ...................   30
6-12.  Schematic Diagram - MAIN Section (3/3) - ...................   31
6-13. Printed Wiring Boards 
 
- AMP/HEADPHONE Section - .....................................   32
6-14.  Schematic Diagram - AMP/HEADPHONE Section - ....   33
6-15.  Printed Wiring Boards - PANEL Section - .....................   34
6-16.  Schematic Diagram - PANEL Section - ..........................   35
6-17.  Printed Wiring Boards - POWER Section - ....................   36
6-18.  Schematic Diagram - POWER Section - ........................   37
7. 
EXPLODED  VIEWS
7-1. Panel 
Section 
...................................................................  44
7-2.  Top Panel Section ...........................................................   45
7-3.  Front Panel Section .........................................................   46
7-4.  MAIN Board Section ......................................................   47
7-5.  POWER Board Section ...................................................   48
7-6.  Loading Mechanism Section ..........................................   49
7-7.  Base Unit Section (BU-K6BD90-WOD)  .......................   50
8. 
ELECTRICAL  PARTS  LIST
  ..............................   51
TABLE  OF  CONTENTS
Notes on chip component replacement
• 
Never reuse a disconnected chip component.
• 
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• 
Keep the temperature of soldering iron around 270 °C during 
repairing.
• 
Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).
• 
Be careful not to apply force on the conductor when soldering 
or unsoldering.
SAFETY-RELATED COMPONET WARNING!
COMPONENTS  IDENTIFIED  BY  MARK 0 OR  DOTTED  LINE  
WITH  MARK 
0 ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 
 
WHOSE  PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  
MANUAL  OR  IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
CAUTION
Use of controls or adjustments or performance of procedures other than 
those specifi ed herein may result in hazardous radiation exposure.
This appliance is classifi ed as a 
CLASS 1 LASER product.
This marking is located on the 
rear or bottom exterior.
Ver. 1.1
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㚐堩仒⯂ᷲ2䯟㼤₭濃DMBTT!2!
MBTFS濄ḋ␥Ɂ㚐㝫䫢ằᷲ倰曆⡺⡗
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