Read Sony CFD-V8L Service Manual online
3
CFD-V8L
SECTION 1
SERVICING NOTES
The laser diode in the optical pick-up block may suffer electro-
static breakdown because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic breakdown and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled
with care.
static breakdown because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic breakdown and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled
with care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode
emission, observe more than 30 cm away from the objective
lens.
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode
emission, observe more than 30 cm away from the objective
lens.
CHUCK PLATE JIG ON REPAIRING
On repairing CD section, playing a disc without the CD lid, use
Chuck Plate Jig.
Chuck Plate Jig.
• Code number of Chuck Plate Jig : X-4918-255-1
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
CHECK
1. Press CD open knob.
2. Open the lid for CD.
3. Push on SWITCH (S801) as following figure.
4. Confirm the laser diode emission while observing the objecting
2. Open the lid for CD.
3. Push on SWITCH (S801) as following figure.
4. Confirm the laser diode emission while observing the objecting
lens. When there is no emission, Auto Power Control circuit
or Optical Pick-up is broken.
Objective lens moves up and down once for the focus search.
or Optical Pick-up is broken.
Objective lens moves up and down once for the focus search.
Insert a precision
screw driver and push
SWITCH (S801)
screw driver and push
SWITCH (S801)
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40
°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
Note on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
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