CFD-S170L - Sony Audio Service Manual (repair manual)

1

CD

Model Name Using Similar Mechanism CFD-S300L

Section

CD Mechanism Type

KSM-213CDP

Optical Pick-up Name

KSS-213C

TC

Model Name Using Similar Mechanism CFD-S300L

Section Tape Transport Mechanism Type

MF-S200

CD player section
System

Compact disc digital audio system

Laser diode properties

Material: GaAlAs
Wave length: 780 nm
Emission duration: Continuous
Laser output: Less than 44.6 

µW

(This output is the value measured at a distance of
about 200 mm from the objective lens surface on
the optical pick-up block with 7 mm aperture.)

Spindle speed

200 r/min (rpm) to 500 r/min (rpm) (CLV)

Number of channels

2

Frequency response

20 - 20,000 Hz +1/–2 dB

Wow and flutter

Below measurable limit

Radio section
Frequency range

FM: 87.5 - 108 MHz
MW: 531 - 1,611 kHz (9 kHz step)

530 - 1,610 kHz (10 kHz step)

LW: 153 - 279 kHz

IF

FM: 10.7 MHz
MW/LW: 450 kHz

Aerials

FM: Telescopic aerials
MW/LW: Built-in ferrite bar aerials

– Continued on next page –

Cassette-corder section
Recording system

4-track 2 channel stereo

Fast winding time

Approx. 120 sec. with Sony cassette C-60

Frequency response

TYPE I (normal): 80 - 10,000 Hz

General
Speaker

Full range: 10 cm dia.,
3.2 

Ω, cone type (2)

Outputs

Headphones jack (stereo minijack):
For 16 - 68 

Ω impedance headphones

Maximum power output

5.2 W

Power requirements

230 V AC, 50 Hz
9 V DC, 6R20 (size D) batteries

Power consumption

AC 14 W

AEP Model

UK Model

2007G04-1
© 2007.07

2

Battery life

For CD radio cassette-corder:

Sony R20P: approx. 13.5 h

Sony alkaline LR20: approx. 20 h

Sony R20P: approx. 7.5 h

Sony alkaline LR20: approx. 15 h

Sony R20P: approx. 2.5 h

Sony alkaline LR20: approx. 7 h

Dimensions

Approx. 414 

× 164 × 257 mm (w/h/d)

(incl. projecting parts)

Mass

Approx. 3.6 kg (incl. batteries)

Supplied accessories

Main lead (1)

Design and specifications are subject to change without
notice.

0

0

Use of controls or adjustments or performance of proce-
dures other than those specified herein may result in haz-
ardous radiation exposure.

• Keep the temperature of the soldering iron around 270˚C during

repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)

Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40

°C higher than

ordinary solder.

Ordinary soldering irons can be used but the iron tip has to be

applied to the solder joint for a slightly longer time.

Soldering irons using a temperature regulator should be set to

about 350

°C.

Caution: The printed pattern (copper foil) may peel away if

the heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscous (sticky, less prone to flow)

than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may

also be added to ordinary solder.

3

......................................................... 4

............................................................................ 5

3-1.   Cabinet Top Assy ................................................................ 7
3-2.   Cabinet Front Assy, Cabinet Bottom Assy .......................... 7
3-3.   Wires ................................................................................... 8
3-4.   MD Block ............................................................................ 8
3-5.   Cassette Holder ................................................................... 9
3-6.   Main Board ......................................................................... 9
3-7.   TU Board ........................................................................... 10
3-8.   Power Board ...................................................................... 10
3-9.   CD Lid ............................................................................... 11
3-10. CD Block Assy .................................................................. 11
3-11. Optical Pick-up ................................................................. 12
3-12. R/P Head (HRP301), TC Board ........................................ 12
3-13. Motor Assy (M801), Main Belt (B), Sub Belt (B) ............ 13

............................... 14

Tape Section .......................................................................... 14
Tuner Section ......................................................................... 15
CD Section ............................................................................ 16

6-1.   Block Diagram – CD Section – ......................................... 18
6-2.   Block Diagram – Main Section – ...................................... 19
6-3.   Printed Wiring Board – CD Section – ............................... 20
6-4.   Schematic Diagram – CD Section – .................................. 21
6-5.   Printed Wiring Board – Tuner Section – ........................... 22
6-6.   Schematic Diagram – Tuner Section – .............................. 23
6-7.   Printed Wiring Boards – Main Section – .......................... 24
6-8.   Schematic Diagram – Main Section (1/2) – ...................... 25
6-9.   Schematic Diagram – Main Section (2/2) – ...................... 26
6-10. Printed Wiring Board – TC Section – ............................... 27
6-11. Schematic Diagram – TC Section – .................................. 28
6-12. Printed Wiring Boards – Control Section – ....................... 29
6-13. Schematic Diagram – Control Section – ........................... 30
6-14. Printed Wiring Boards – Power Supply Section – ............ 31
6-15. Schematic Diagram – Power Supply Section – ................. 32

7-1.   Cabinet Section ................................................................. 36
7-2.   Cabinet (Front) Section ..................................................... 37
7-3.   Cabinet (Top) (1) Section .................................................. 38
7-4.   Cabinet (Top) (2) Section .................................................. 39
7-5.   Cabinet (Bottom) Section .................................................. 40
7-6.   Tape Mechanism Section .................................................. 41
7-7.   CD Mechanism Section .................................................... 42

......................................... 43

4

On repairing CD section, playing a disc without the lid (CD), use
Chuck Plate Jig.
• Code number of Chuck Plate Jig: X-4918-255-1

1. Turn ON the [OPERATE] button and press [CD] button to CD

position.

2. Open the CD lid.
3. Turn on S801 with screwdriver, etc. as following figure.
4. Press the  N X  (CD) button.
5. Confirm the laser diode emission while observing the objecting

lens. When there is no emission, Auto Power Control circuit or
Optical Pick-up is broken.
Objective lens moves up and down three times for focus search.

S801