CFD-44 - Sony Audio Service Manual (repair manual). Page 3

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Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270

°

C during

repairing.

• Do not touch the soldering iron on the same conductor of the cir-

cuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering or

unsoldering.

Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.

! OR DOTTED LINE

! ON THE SCHEMATIC DIAGRAMS AND IN THE

NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-up
block. Therefore, when checking the laser diode emission, observe
more than 30 cm away from the  objective lens.

! SUR LES