Read Sony CDP-XB820 Service Manual online
– 46 –
SECTION 8
ELECTRICAL PARTS LIST
NOTE:
• Due to standardization, replacements in the
parts list may be different from the parts speci-
fied in the diagrams or the components used
on the set.
fied in the diagrams or the components used
on the set.
• -XX and -X mean standardized parts, so they
may have some difference from the original
one.
one.
• RESISTORS
All resistors are in ohms.
METAL: Metal-film resistor.
METAL OXIDE: Metal oxide-film resistor.
F: nonflammable
METAL: Metal-film resistor.
METAL OXIDE: Metal oxide-film resistor.
F: nonflammable
• Items marked “*” are not stocked since they
are seldom required for routine service.
Some delay should be anticipated when order-
ing these items.
Some delay should be anticipated when order-
ing these items.
• SEMICONDUCTORS
In each case, u: µ, for example:
uA. .
uA. .
: µA. .
uPA. . : µPA. .
uPB. . : µPB. .
uPC. . : µPC. .
uPD. . : µPD. .
• CAPACITORS
uF: µF
• COILS
uH: µH
The components identified by
mark
mark
! or dotted line with mark
! are critical for safety.
Replace only with part number
specified.
specified.
When indicating parts by reference
number, please include the board.
number, please include the board.
Ref. No.
Part No.
Description
Remark
Ref. No.
Part No.
Description
Remark
AC SW BD
*
1-668-768-11 AC SW BOARD
************
< CAPACITOR >
! C610
1-113-924-11 CERAMIC
0.0047uF 20%
250V
< CONNECTOR >
CN610
1-690-123-21 REED (WITH CONNECTOR) (2 CORE)
< SWITCH >
! S610
1-572-267-51 SWITCH, PUSH (AC POWER) (1 KEY)
(
U (POWER))
************************************************************
*
A-4699-998-A BD BOARD, COMPLETE
*******************
< CAPACITOR >
C101
1-163-005-11 CERAMIC CHIP
470PF
10%
50V
C102
1-163-038-00 CERAMIC CHIP
0.1uF
25V
C103
1-163-005-11 CERAMIC CHIP
470PF
10%
50V
C104
1-163-005-11 CERAMIC CHIP
470PF
10%
50V
C105
1-135-155-21 TANTALUM CHIP 4.7uF
10%
16V
C108
1-163-035-00 CERAMIC CHIP
0.047uF
50V
C109
1-163-145-00 CERAMIC CHIP
0.0015uF 5%
50V
C110
1-163-017-00 CERAMIC CHIP
0.0047uF 5%
50V
C111
1-163-021-00 CERAMIC CHIP
0.01uF
10%
50V
C112
1-163-038-00 CERAMIC CHIP
0.1uF
25V
C113
1-163-038-00 CERAMIC CHIP
0.1uF
25V
C116
1-126-209-11 ELECT CHIP
100uF
20%
4V
C117
1-126-209-11 ELECT CHIP
100uF
20%
4V
C118
1-163-275-11 CERAMIC CHIP
0.001uF
5%
50V
C119
1-163-231-11 CERAMIC CHIP
15PF
5%
50V
C120
1-163-251-11 CERAMIC CHIP
100PF
5%
50V
C121
1-163-021-00 CERAMIC CHIP
0.01uF
10%
50V
C122
1-109-982-11 CERAMIC CHIP
1uF
10%
10V
C123
1-163-021-00 CERAMIC CHIP
0.01uF
10%
50V
C124
1-164-005-11 CERAMIC CHIP
0.47uF
25V
C125
1-104-851-11 TANTALUM CHIP 10uF
20%
10V
C126
1-115-339-11 CERAMIC CHIP
0.1uF
10%
50V
C127
1-163-038-00 CERAMIC CHIP
0.1uF
25V
C128
1-163-038-00 CERAMIC CHIP
0.1uF
25V
C129
1-163-038-00 CERAMIC CHIP
0.1uF
25V
C132
1-164-346-11 CERAMIC CHIP
1uF
16V
C140
1-163-038-00 CERAMIC CHIP
0.1uF
25V
C141
1-163-038-00 CERAMIC CHIP
0.1uF
25V
C151
1-163-005-11 CERAMIC CHIP
470PF
10%
50V
C152
1-163-005-11 CERAMIC CHIP
470PF
10%
50V
C153
1-163-038-00 CERAMIC CHIP
0.1uF
25V
C154
1-164-336-11 CERAMIC CHIP
0.33uF
25V
C155
1-163-005-11 CERAMIC CHIP
470PF
10%
50V
C156
1-163-005-11 CERAMIC CHIP
470PF
10%
50V
C157
1-163-023-00 CERAMIC CHIP
0.015uF
5%
50V
C158
1-163-023-00 CERAMIC CHIP
0.015uF
5%
50V
C159
1-163-019-00 CERAMIC CHIP
0.0068uF 10%
50V
C160
1-164-161-11 CERAMIC CHIP
0.0022uF 10%
100V
C161
1-163-038-00 CERAMIC CHIP
0.1uF
25V
C162
1-163-038-00 CERAMIC CHIP
0.1uF
25V
C171
1-163-005-11 CERAMIC CHIP
470PF
10%
50V
C172
1-163-005-11 CERAMIC CHIP
470PF
10%
50V
C173
1-163-021-00 CERAMIC CHIP
0.01uF
10%
50V
< CONNECTOR >
CN101
1-770-072-11 CONNECTOR, (LIF(NON-ZIF)) FFC23P
CN102
1-750-753-11 CONNECTOR, FFC/FPC 21P
CN103
1-774-653-21 PIN, CONNECTOR (PC BOARD) 3P
< DIODE >
D101
8-719-016-74 DIODE 1SS352
< IC >
IC101
8-752-389-34 IC CXD2585Q
IC102
8-759-071-79 IC BA6297AFP
IC103
8-752-085-51 IC CXA2568M-T6
< COIL >
L101
1-414-234-11 INDUCTOR CHIP 0uH
< TRANSISTOR >
Q101
8-729-010-08 TRANSISTOR MSB710-R
Q102
8-729-010-08 TRANSISTOR MSB710-R
Click on the first or last page to see other CDP-XB820 service manuals if exist.