Read Sony CDP-M400CS Service Manual online
3
CDP-M400CS
SECTION 1
SERVICING NOTES
TABLE OF CONTENTS
1.
SERVICING NOTES
................................................
3
2.
GENERAL
...................................................................
6
3.
DISASSEMBLY
3-1.
Disassembly Flow ...........................................................
7
3-2.
Case .................................................................................
8
3-3.
MAIN Board ....................................................................
8
3-4.
TRANS Board .................................................................
9
3-5.
IR-IN Board .....................................................................
9
3-6.
Front Panel Assembly ...................................................... 10
3-7.
JOG Board, DISP Board, KEYBOARD Board ............... 10
3-8.
Cover (PT), Table (400) Assembly .................................. 11
3-9.
LED Board, Guide (Door) ............................................... 11
3-10. DOOR SW Board ............................................................ 12
3-11. Base (Door Driving) Assembly ....................................... 13
3-12. Pop-up Assembly ............................................................. 13
3-13. D.MOTOR Board, Motor Assembly (Door) (M603) ...... 14
3-14. T.SENS Board, Holder (Table Sensor 400) ..................... 14
3-15. D.SENS (OUT) Board, D.SENS (IN) Board .................. 15
3-16. Back Panel Section .......................................................... 15
3-17. CD Mechanism, Magnet Assembly ................................. 16
3-18. LOADING SW Board, LOCK SW Board ...................... 17
3-19. CDM Assembly ............................................................... 18
3-20. Motor Assembly (Table) (M601),
3-11. Base (Door Driving) Assembly ....................................... 13
3-12. Pop-up Assembly ............................................................. 13
3-13. D.MOTOR Board, Motor Assembly (Door) (M603) ...... 14
3-14. T.SENS Board, Holder (Table Sensor 400) ..................... 14
3-15. D.SENS (OUT) Board, D.SENS (IN) Board .................. 15
3-16. Back Panel Section .......................................................... 15
3-17. CD Mechanism, Magnet Assembly ................................. 16
3-18. LOADING SW Board, LOCK SW Board ...................... 17
3-19. CDM Assembly ............................................................... 18
3-20. Motor Assembly (Table) (M601),
Motor Assembly (Loading) (M602) ................................ 18
3-21. BU Holder ....................................................................... 19
3-22. BD Board, Optical Pick-up (KSM-213BFN) .................. 19
3-22. BD Board, Optical Pick-up (KSM-213BFN) .................. 19
4.
TEST MODE
............................................................... 20
5.
ELECTRICAL ADJUSTMENT
............................. 25
6.
DIAGRAMS
6-1.
Block Diagram — BD Section — .................................. 30
— MAIN Section — ....................................................... 31
— MAIN Section — ....................................................... 31
6-2.
Printed Wiring Board — BD Section — ........................ 32
6-3.
Schematic Diagram — BD Section — ........................... 33
6-4.
Printed Wiring Board — MAIN Section — ................... 34
6-5.
Schematic Diagram — MAIN Section (1/2) — ............. 35
6-6.
Schematic Diagram — MAIN Section (2/2) — ............. 36
6-7.
Printed Wiring Board — SENSOR Section — .............. 37
6-8.
Schematic Diagram — SENSOR Section — ................. 37
6-9.
Printed Wiring Board — DISPLAY Section — ............. 38
6-10. Schematic Diagram — DISPLAY Section — ................ 39
6-11. Printed Wiring Board — JOG Section — ...................... 40
6-12. Schematic Diagram — JOG Section — ......................... 41
6-13. Printed Wiring Board — POWERSection — ................. 42
6-14. Schematic Diagram — POWER Section — .................. 43
6-11. Printed Wiring Board — JOG Section — ...................... 40
6-12. Schematic Diagram — JOG Section — ......................... 41
6-13. Printed Wiring Board — POWERSection — ................. 42
6-14. Schematic Diagram — POWER Section — .................. 43
7.
EXPLODED VIEWS
7-1.
Case Section .................................................................... 51
7-2.
Chassis Section 1 ............................................................. 52
7-3.
Chassis Section 2 ............................................................. 53
7-4.
Front Panel Section ......................................................... 54
7-5.
Mechanism Section 1 (CDM62-K1BD46A) ................... 55
7-6.
Mechanism Section 2 (CDM62-K1BD46A) ................... 56
7-7.
Mechanism Section 3 (CDM62-K1BD46A) ................... 57
7-8.
Mechanism Section 4 (CDM62-K1BD46A) ................... 58
7-9.
Optical Pick-up Section (BU-K1BD46A) ....................... 59
8.
ELECTRICAL PARTS LIST
.................................. 60
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
CHECK
Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveforms is output three times.
that the S curve waveforms is output three times.
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
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