Read Sony CDP-EX100 / MHC-EX100AV / MHC-EX50 / MHC-EX70AV / MHC-EX90 Service Manual online
– 2 –
The laser component in this product
is capable of emitting radiation
exceeding the limit for Class 1.
exceeding the limit for Class 1.
The following caution label is located inside of the unit.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
!
OR DOTTED LINE
WITH MARK
!
ON THE SCHEMATIC DIAGRAMS AND IN THE
PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE
THESE COMPONENTS WITH SONY PARTS WHOSE PART
NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
THESE COMPONENTS WITH SONY PARTS WHOSE PART
NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
TABLE OF CONTENTS
1. SERVICE NOTE
.................................................................. 3
2. GENERAL
............................................................................. 4
3. DISASSEMBLY
3-1. Loading Panel .......................................................................... 4
3-2. MD Block ................................................................................ 5
3-3. Holder (BU) Assy .................................................................... 5
3-2. MD Block ................................................................................ 5
3-3. Holder (BU) Assy .................................................................... 5
4. ELECTRICAL ADJUSTMENTS
.................................... 6
5. DIAGRAMS
5-1. IC Pin Function ....................................................................... 8
5-2. Circuit Boards Location ........................................................ 10
5-3. Printed Wiring Board – BD Section – ................................... 11
5-4. Schematic Diagram – BD Section – ...................................... 13
5-5. Printed Wiring Boards – Main Section – .............................. 16
5-6. Schematic Diagram – Main Section – ................................... 19
5-2. Circuit Boards Location ........................................................ 10
5-3. Printed Wiring Board – BD Section – ................................... 11
5-4. Schematic Diagram – BD Section – ...................................... 13
5-5. Printed Wiring Boards – Main Section – .............................. 16
5-6. Schematic Diagram – Main Section – ................................... 19
6. EXPLODED VIEWS
6-1. Chassis Section ...................................................................... 26
6-2. Front Panel Section ............................................................... 27
6-3. CD Mechanism Section ......................................................... 28
6-4. Base Unit Section .................................................................. 29
6-2. Front Panel Section ............................................................... 27
6-3. CD Mechanism Section ......................................................... 28
6-4. Base Unit Section .................................................................. 29
7. ELECTRICAL PARTS LIST
.......................................... 30
This appliance is classified
as a CLASS 1 LASER
product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
as a CLASS 1 LASER
product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
CAUTION
Use of controls or adjustments or performance of proce-
dures other than those specified herein may result in haz-
ardous radiation exposure.
dures other than those specified herein may result in haz-
ardous radiation exposure.
Notes on Chip Component Replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR
BASE UNIT
BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-up
block. Therefore, when checking the laser diode emission, observe
from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-up
block. Therefore, when checking the laser diode emission, observe
from more than 30 cm away from the objective lens.
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