CDP-CE500 - Sony Audio Service Manual (repair manual)

cdp-ce500 service manual
Model
CDP-CE500
Pages
52
Size
3.58 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
cdp-ce500.pdf
Date

Read Sony CDP-CE500 Service Manual online

SERVICE MANUAL
Sony Corporation
Published by Sony Techno Create Corporation
CDP-CE500
SPECIFICATIONS
COMPACT DISC PLAYER
9-893-037-01
2010L05-1
© 
2010.12
US Model
Canadian Model
Ver. 1.0  2010.12
Model Name Using Similar Mechanism
NEW
CD Mechanism Type
CDM59-DA11
Base Unit Name
BU-DA11BD75
Optical Pick-up Block Name
DA11MMVGP
s MPEG Layer-3 audio coding 
technology and patents licensed 
from Fraunhofer IIS and 
Thomson.
s Windows Media is a registered 
trademark of Microsoft 
Corporation in the United States 
and/or other countries.
CD player section
Laser
Semiconductor laser (
λ = 
780 nm)
Emission duration: 
continuous
Frequency response
2 Hz to 20 kHz ± 0.5 dB
Dynamic range
More than 90 dB
Harmonic distortion
Less than 0.006%
Laser Diode Properties
Emission Duration: 
Continuous
Laser Output: Less than 
44.6 
μW
* This output is the value measurement at a 
distance of 200 mm from the objective lens 
surface on the optical pick-up block with 7 mm 
aperture.
USB section
Supported bit rate
MP3 (MPEG 1 Audio 
Layer 3): 32 kbps – 320 
kbps, VBR
WMA: 48 kbps – 192 kbps
AAC: 48 kbps – 320 kbps
Sampling frequencies
MP3 (MPEG 1 Audio 
Layer 3): 32 kHz/
44.1 kHz/48 kHz
WMA: 44.1 kHz
AAC: 44.1 kHz
USB port
Maximum current: 
500 mA
Outputs
General
Power requirements
120 V AC, 60 Hz
Power consumption
16 W
Dimensions (approx.)
430 mm × 110 mm × 
400 mm
(w/h/d)
(17 in × 4 3/8 in × 
15 3/4 in) incl. projecting 
parts
Mass (approx.)
5.2 kg (11 lbs 1 oz)
Supplied accessories
Audio cord
Red and white (1)
Remote commander
RM-ASU100 (1)
Battery
R6 (size-AA) (2)
Design and specifications are subject to change 
without notice.
Jack type Maximum 
output level
Load 
impedance
ANALOG 
OUT
Phono 
jacks
2 V (at 50 
kilohms)
Over 10 
kilohms
DIGITAL 
OUT 
OPTICAL
Optical 
output 
jack
–18 dBm
Wave 
length: 
660 nm
s Standby power consumption: 0.3 W
s Halogenated flame retardants are not used in the 
certain printed wiring boards.
CDP-CE500
2
1. 
SERVICING  NOTES
  .............................................   3
2. DISASSEMBLY
2-1.  Disassembly  Flow ...........................................................  
5
2-2. 
Case .................................................................................  
5
2-3.  Front Panel Block ...........................................................   6
2-4.  CD Mechanism Deck (CDM59-DA11) ..........................   7
2-5.  MAIN  Board ...................................................................  
8
2-6. 
USB-AUDIO  Board ........................................................  
8
2-7.  Table  Block .....................................................................  
9
2-8.  Tray .................................................................................   10
2-9.  Chucking (DA11) Pulley Assy ........................................   10
2-10.  Rotary Motor Assy (M11), SENSOR Board ...................   11
2-11.  Gear (RV), Gear (U/D), Swing Gear ..............................   12
2-12.  Loading Motor Assy (M10), 
 
LOADING MOTOR Board ............................................   13
2-13.  JUNCTION  Board ..........................................................   14
2-14.  Base Unit Block ..............................................................   14
2-15.  Base Unit (BU-DA11BD75) ...........................................   15
2-16.  Optical Pick-up Block (DA11MMVGP) ........................   15
3. 
TEST  MODE 
 ............................................................   16
4. 
ELECTRICAL  CHECK 
 .........................................   19
5. DIAGRAMS
5-1.  Block  Diagram ................................................................   20
5-2.  Printed Wiring Board - BD75 Board - ............................   22
5-3.  Schematic Diagram - BD75 Board - ...............................   23
5-4.  Printed Wiring Boards - MECHANISM Section - .........   24
5-5.  Schematic Diagram - MECHANISM Section - ..............   25
5-6.  Printed Wiring Board - USB-AUDIO Board - ................   26
5-7.  Schematic Diagram - USB-AUDIO Board - ..................   27
5-8.  Printed Wiring Boards - PANEL Section - .....................   28
5-9.  Schematic Diagram - PANEL Section - ..........................   29
5-10.  Schematic Diagram - MAIN Board (1/2) - .....................   30
5-11.  Schematic Diagram - MAIN Board (2/2) - .....................   31
5-12.  Printed Wiring Board - MAIN Board - ...........................   32
6. 
EXPLODED  VIEWS
6-1. 
Case  Section ....................................................................   40
6-2.  Front Panel Section .........................................................   41
6-3.  Chassis Section ...............................................................   42
6-4.  CD Mechanism Deck Section (Table Block) 
 
(CDM59-DA11) ..............................................................   43
6-5.  CD Mechanism Deck Section (Chassis Block) 
 
(CDM59-DA11) ..............................................................   44
6-6.  Base Unit Section ............................................................   45
7. 
ELECTRICAL  PARTS  LIST
   ..............................   46
NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 
Never reuse a disconnected chip component.
• 
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE  CIRCUIT  BOARD  REPAIRING
• 
Keep the temperature of soldering iron around 270 °C during 
repairing.
• 
Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).
• 
Be careful not to apply force on the conductor when soldering 
or unsoldering.
SAFETY  CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, 
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE  TEST
The AC leakage from any exposed metal part to earth ground and 
from all exposed metal parts to any exposed metal part having a 
return to chassis, must not exceed 0.5 mA (500 microamperes.). 
Leakage current can be measured by any one of three methods.
1.  A commercial leakage tester, such as the Simpson 229 or RCA 
WT-540A. Follow the manufacturers’ instructions to use these 
instruments.
2.  A battery-operated AC milliammeter. The Data Precision 245 
digital multimeter is suitable for this job.
3.  Measuring the voltage drop across a resistor by means of a 
VOM or battery-operated AC voltmeter. The “limit” indication 
is 0.75 V, so analog meters must have an accurate low-voltage 
scale. The Simpson 250 and Sanwa SH-63Trd are examples 
of a passive VOM that is suitable. Nearly all battery operated 
digital multimeters that have a 2 V AC range are suitable. (See 
Fig. A)
1.5 k
Ω
0.15 
μF
AC
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Earth Ground
Fig. A.  Using an AC voltmeter to check AC leakage.
SAFETY-RELATED  COMPONENT  WARNING!
COMPONENTS  IDENTIFIED  BY  MARK  
0  OR  DOTTED  LINE  
WITH  MARK  
0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 
 
WHOSE  PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  
MANUAL  OR  IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
ATTENTION  AU  COMPOSANT  AYANT  RAPPORT  
À  LA  SÉCURITÉ!
LES  COMPOSANTS  IDENTIFIÉS  PAR  UNE  MARQUE  
0  SUR  
LES  DIAGRAMMES  SCHÉMATIQUES  ET  LA  LISTE  DES  
PIÈCES  SONT  CRITIQUES  POUR  LA  SÉCURITÉ  DE  FONC-
TIONNEMENT.  NE  REMPLACER  CES  COMPOSANTS  QUE  
PAR  DES  PIÈCES  SONY  DONT  LES  NUMÉROS  SONT  DON-
NÉS  DANS  CE  MANUEL  OU  DANS  LES  SUPPLÉMENTS  
PUBLIÉS  PAR  SONY.
CAUTION
Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous radia-
tion exposure.
TABLE  OF  CONTENTS
CDP-CE500
3
SECTION  1
SERVICING  NOTES
UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 
the lead free mark due to their particular size)
 : LEAD  FREE  MARK
Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 
than ordinary solder.
 
Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.
 
Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 
the heated tip is applied for too long, so be careful!
•  Strong viscosity
 
Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.
•  Usable with ordinary solder
 
It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.
NOTES  ON  HANDLING  THE OPTICAL  PICK-UP  
BLOCK  OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.
NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.
NOTE  OF  REPLACING  THE  IC901  ON  THE  USB-
AUDIO  BOARD
IC901 on the USB-AUDIO board cannot exchange with single. When this 
part is damaged, exchange the complete mounted board.
RELEASING  ANTITHEFT  LOCK  MODE
The disc tray lock function for the antitheft of a demonstration disc 
in the store is equipped.
Procedure:
1.  Press the [
?/1
] button to turn the power on.
2.  Press the [CD/USB] button to select CD function.
3.  Press two buttons of [ENTER] and [
Z
] for 5 seconds or larger 
simultaneously.
4.  The message “UNLOCKED” is displayed on the fl uorescent 
indicator tube, and the disc tray is unlocked.
Note: When “LOCKED” is displayed, the antitheft lock is not released by 
turning power on/off with the [\/1] button.
NOTE  OF  TRANSPORTING  THIS  SET
Transport it after executing “CD SHIP & COLD RESET” accord-
ing to the following procedure when this set is transported.
Procedure:
1.  Press the [
?/1
] button to turn the power on.
2.  Eject the CD.
3.  Press the [CD/USB] button to select CD function
4.  Press three buttons of [
M >
], [ENTER] and [
?/1
] simulta-
neously.
5.  When “STANDBY” and “RESET” appears, the set enters 
standby status.
CDP-CE500
4
HOW  TO  OPEN  THE  DISC  TABLE  WHEN  POWER  
SWITCH  TURNS  OFF
Insert a tapering driver into the aperture of the unit bottom, and 
turn it in the direction of the arrow (to OUT direction).
– bottom view –
tapering driver
table
Note: To close the table, turn the tapering driver 
 
in the reverse direction (to IN direction).
NOTE  FOR  GEAR  INSTALLATION
When following gears are installed, it is necessary to phase it.
Please refer to “2-11. GEAR (RV), GEAR (U/D), SWING GEAR” 
(page 12).
CD  MECHANISM  DECK  SERVICE  POSITION
gear (RV)
swing gear
gear (U/D)
base unit block
chucking block
disc for play
CD mechanism deck
(CDM59-DA11)
Connect extension jig 
(1.0 mm pitch/25 cores)
(Part No. J-2501-199-A)
to USB-AUDIO board (CN902)
and  BD75 board (CN403)
BD75 board
USB-AUDIO board
Note: When you do the operation check 
of base unit block, please check 
after installing temporary CD on 
the tray.
Page of 52
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Here you can read online and download Sony CDP-CE500 Service Manual in PDF. CDP-CE500 service manual will guide through the process and help you recover, restore, fix, disassemble and repair Sony CDP-CE500 Audio. Information contained in service manuals typically includes schematics / circuit diagrams, wiring diagrams, block diagrams, printed wiring boards, exploded views, parts list, disassembly / assembly, pcb.