BMZ-K1, CX-BK1 - Sony Audio Service Manual (repair manual)

Model
BMZ-K1 CX-BK1
Pages
112
Size
9.38 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
bmz-k1-cx-bk1-1.pdf
Date

View Sony BMZ-K1 / CX-BK1 Service Manual online

SERVICE MANUAL
COMPACT DISC RECEIVER
US model
COMPACT DISC DECK RECEIVER
AEP, UK, Chilean, Peruvian and Mexican models
US Model
AEP Model
UK Model
E Model
CX-BK1
Ver 1.1  2004.02
9-877-426-02
Sony Corporation
2004B05-1
Home Audio Company
C
 2004.02
Published by Sony Engineering Corporation
SPECIFICATIONS
CX-BK1 is the amplifier, CD player, tape deck
and tuner section in BMZ-K1.
Tape deck is not loaded in US model.
TUNER
FM tuning range
87.5 MHz to 108 MHz
FM usable sensitivity (IHF) 13.2 dBf
FM antenna terminal
75 
 (unbalanced)
AM tuning range
530 kHz to 1710 kHz (10 kHz step)
531 kHz to 1710 kHz (9 kHz step)
AM usable sensitivity
350 
µ
V/m
AM antenna
Loop antenna
AMPLIFIER
Power output
US model:
110 W + 110 W (40 Hz - 20 kHz,
THD less than 1%, 6 
)
140 W + 140 W (40 Hz - 20 kHz,
THD 10%, 6 
)
Chilean, Peruvian and Mexican models:
140 W + 140 W (1 kHz, THD
less than 1%, 6 
)
180 W + 180 W (1 kHz, THD
10%, 6 
)
Total harmonic distortion
0.08 % (90 W, 1 kHz, 6 
)
Input
LINE IN VIDEO: 1.0 Vp-p (75 
)
LINE IN AUDIO: 1.1 V
AUX (MD) IN: 1.1 V
MIC: 2.5mV (Chilean, Peruvian
and Mexican models)
Outputs
SPEAKERS: 6 
 or more
PHONES: 32 
 or more
AUX (MD) OUT: 500 mV
VIDEO OUT: 1.0 Vp-p (75 
)
CD PLAYER
Laser
Semiconductor laser (
λ
 = 800 nm)
Emission duration: continuous
D/A converter
1 bit dual
Signal-to-noise ratio
85 dB (1 kHz, 0 dB)
Wow and flutter
Unmeasurable
CASSETTE DECK (Except US model)
Track format
4 tracks, 2 channels stereo
Frequency response
100 Hz – 10000 Hz (
±
 3dB)
Recording system
AC bias
Heads
Recording/playback 
×
 1, erase 
×
 1
GENERAL
Power requirements
US model:
120 V, 60 Hz
Mexican model:
127 V, 60 Hz
Chilean and Peruvian models:
120 V/220 – 230 V/240 V AC
(switchable), 50/60 Hz
Licensed by BBE Sound, Inc. under USP4638258, 5510752
and 5736897.
Model Name Using Similar Mechanism
NEW
CD Section
CD Mechanism Type
CDM69BV-30CBD64NS
Base Unit Name
BU-30CBD64NS
Optical Pick-up Name
A-MAX.3
TAPE Section
Model Name Using Similar Mechanism
NEW
(Except US model)
Tape Transport Mechanism Type
CMAL1Z240A
Power consumption
US model:
120 W
Chilean and Peruvian models:
155 W
Mexican model:
160 W
Power consumption in standby mode
US model:
with ECO mode on: 0.25 W
with ECO mode off: 20 W
Chilean and Mexican models:
with ECO mode on: 0.25 W
with ECO mode off: 28 W
Dimensions (w/h/d)
Approx. 211 
×
 379 
×
 419 mm
(8 
3
/
8
 
×
 15 
×
16 
5
/
8
 in.)
Mass
US model:
Approx. 8.6 kg (19 lbs)
Chilean and Peruvian models:
Approx. 9.9 kg
Specifications and external appearance are subject to change
without notice.
CX-BK1
2
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
SAFETY-RELATED  COMPONENT  WARNING!!
COMPONENTS  IDENTIFIED  BY  MARK  
0
  OR  DOTTED
LINE  WITH  MARK  
0
  ON  THE  SCHEMATIC  DIAGRAMS
AND  IN  THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE
OPERATION.  REPLACE  THESE  COMPONENTS  WITH
SONY  PARTS  WHOSE  PART  NUMBERS  APPEAR  AS
SHOWN  IN  THIS  MANUAL  OR  IN  SUPPLEMENTS  PUB-
LISHED  BY  SONY.
The following caution label is located inside the unit.
SAFETY  CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE  TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indica-
tion is 0.75 V, so analog meters must have an accurate low-
voltage scale. The Simpson 250 and Sanwa SH-63Trd are ex-
amples of a passive VOM that is suitable. Nearly all battery
operated digital multimeters that have a 2 V AC range are suit-
able.  (See Fig. A)
Fig. A.
Using an AC voltmeter to check AC leakage.
1.5 k
0.15 
µ
F
AC
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Earth Ground
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 ˚C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges oc-
cur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
CLASS 1 LASER PRODUCT
LUOKAN 1 LASER LAITE
KLASS 1 LASER APPARA
T
This appliance is classified
as a CLASS 1 LASER
product.
This label is located on the
rear exterior.
CX-BK1
3
TABLE  OF  CONTENTS
1.
SERVICING NOTES
................................................
4
2.
GENERAL
Location of Controls .......................................................
6
3.
DISASSEMBLY
3-1. Disassembly Flow ...........................................................
8
3-2. Panel ................................................................................
9
3-3. Top Panel Block ..............................................................
9
3-4. Front Panel Assy ............................................................. 10
3-5. MAIN Board ................................................................... 10
3-6. Rear Cover ....................................................................... 11
3-7. Tuner (FM/AM) .............................................................. 11
3-8. SPEAKER Board ............................................................ 12
3-9. ACDC Board, Power Transformer .................................. 12
3-10. AMP Board ..................................................................... 13
3-11. CD Mechanism Deck (CDM69BV-30CBD64NS) ......... 13
3-12. Signal Cassette Mechanism ............................................ 14
3-13. Base Unit Section ............................................................ 14
3-14. Base Unit (BU-30CBD64NS) ......................................... 15
3-15. BD Board ......................................................................... 15
3-16. SW (1) Board, SW (2) Board, SW (3) Board,
SW (4) Board, Bracket (Top) Assy ................................. 16
3-17. CONNECTOR Board ..................................................... 16
3-18. Motor (Stocker) Assy (Stocker) (M761) ........................ 17
3-19. Motor (Roller) Assy (Roller) (M781) ............................. 17
3-20. Motor (Mode) Assy (Mode) (M771) .............................. 18
3-21. Rubber Roller (Slider) Assy ........................................... 18
3-22. Timing Belt (Front/Rear) ................................................ 19
3-23. Cam (Gear) ...................................................................... 19
3-24. SENSOR Board ............................................................... 20
4.
ASSEMBLY
4-1. How to Install the Cam (Eject Lock) .............................. 21
4-2. How to Install the Cam (Gear) ........................................ 21
4-3. How to Install the Gear (Mode C) .................................. 22
4-4. How to Install the Gear (Mode Cam) ............................. 22
4-5. How to Install the Rotary Encoder (S702),
Gear (Stocker Communication) ...................................... 23
4-6. How to Install the Stocker Assy ...................................... 23
5.
TEST  MODE
.............................................................. 24
6.
MECHANICAL  ADJUSTMENTS
....................... 25
7.
ELECTRICAL  ADJUSTMENTS
Deck Section ................................................................... 25
CD Section ...................................................................... 28
8.
DIAGRAMS
8-1. Block Diagram  – CD Section – ..................................... 31
8-2. Block Diagram  – TUNER/TAPE/USB Section – ......... 32
8-3. Block Diagram  – AMP Section – .................................. 33
8-4. Block Diagram  – POWER SUPPLY Section – ............. 34
8-5. Note for Printed Wiring Boards
and Schematic Diagrams ................................................ 35
8-6. Printed Wiring Board  – BD Board – ............................. 36
8-7. Schematic Diagram  – BD Board – ................................ 37
8-8. Printed Wiring Boards  – CHANGER Section – ............ 38
8-9. Schematic Diagram  – CHANGER Section – ................ 39
8-10. Printed Wiring Board
 – DECK Board (Except US model) – ............................ 40
8-11. Schematic Diagram
– DECK Board (Except US model) – ............................. 41
8-12. Printed Wiring Board  – MAIN Board – ........................ 43
8-13. Schematic Diagram  – MAIN Board (1/4) – .................. 44
8-14. Schematic Diagram  – MAIN Board (2/4) – .................. 45
8-15. Schematic Diagram  – MAIN Board (3/4) – .................. 46
8-16. Schematic Diagram  – MAIN Board (4/4) – .................. 47
8-17. Printed Wiring Board  – USB AUX Board – .................. 48
8-18. Schematic Diagram  – USB AUX Board – ..................... 49
8-19. Printed Wiring Boars  – MIC Board
(Chilean, Peruvian and Mexican models) – ................... 50
8-20. Schematic Diagram  – MIC Board
(Chilean, Peruvian and Mexican models) – ................... 51
8-21. Schematic Diagram  – AMP Board (1/2) – .................... 52
8-22. Schematic Diagram  – AMP Board (2/2) – .................... 53
8-23. Printed Wiring Board  – AMP Board – .......................... 54
8-24. Printed Wiring Board  – HEADPHONE Board – .......... 55
8-25. Schematic Diagram  – HEADPHONE Board – ............. 55
8-26. Printed Wiring Board  – SPEAKER Board – ................. 56
8-27. Schematic Diagram  – SPEAKER Board – .................... 57
8-28. Printed Wiring Boards  – KEY Section – ....................... 58
8-29. Schematic Diagram  – KEY Section – ........................... 59
8-30. Printed Wiring Boards  – LCD Section – ....................... 60
8-31. Schematic Diagram  – LCD Section – ........................... 61
8-32. Printed Wiring Board  – ACDC Board – ........................ 62
8-33. Schematic Diagram  – ACDC Board – ........................... 63
8-34. Printed Wiring Board
– PT Board (US, AEP and UK models) – ...................... 64
8-35. Schematic Diagram
– PT Board (US, AEP and UK models) – ...................... 65
8-36. Printed Wiring Board  – PT Board
(Chilean, Peruvian and Mexican models) – ................... 66
8-37. Schematic Diagram  – PT Board
(Chilean, Peruvian and Mexican models) – ................... 67
8-38. IC Pin Function Description ........................................... 73
9.
EXPLODED  VIEWS
9-1. Panel Section ................................................................... 79
9-2. Top Panel Block .............................................................. 80
9-3. Front Panel Block-1 ........................................................ 81
9-4. Front Panel Block-2 ........................................................ 82
9-5. Front Panel Block-3 ........................................................ 83
9-6. Chassis Block-1 ............................................................... 84
9-7. Chassis Block-2 ............................................................... 85
9-8. CD Mechanism Deck Section-1
(CDM69BV-30CBD64NS) ............................................. 86
9-9. CD Mechanism Deck Section-2
(CDM69BV-30CBD64NS) ............................................. 87
9-10. CD Mechanism Deck Section-3
(CDM69BV-30CBD64NS) ............................................. 88
9-11. CD Mechanism Deck Section-4
(CDM69BV-30CBD64NS) ............................................. 89
9-12. CD Mechanism Deck Section-5
(CDM69BV-30CBD64NS) ............................................. 90
9-13. CD Mechanism Deck Section-6
(CDM69BV-30CBD64NS) ............................................. 91
9-14. Optical Pick-up Section (BU-30CBD64NS) .................. 92
10. ELECTRICAL  PARTS  LIST
............................... 93
4
CX-BK1
SECTION  1
SERVICING  NOTES
NOTES  ON  HANDLING  THE  OPTICAL  PICK-UP
BLOCK  OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
LASER  DIODE  AND  FOCUS  SEARCH  OPERATION
CHECK
Carry out the “S curve check” in “CD section adjustment” and
check that the S curve waveforms is output three times.
• MODEL  IDENTIFICATION
– Rear Cover –
MODEL
PART No.
US model
4-245-039-0
[]
Chilean and Peruvian models
4-245-039-1
[]
AEP and UK models
4-245-039-2
[]
Mexican model
4-245-039-3
[]
PART No.
SERVICE  POSITION
– Tape mechanism deck (except US) –
Connect the wire (flat type) (8 core)
to the main board (CN903) and 
the mechanism deck.
Connect the wire (flat type) (11 core)
to the deck board (CN008) and the main board (CN009).

Download Sony BMZ-K1 / CX-BK1 Service Manual (Repair Manual)

Here you can view online and download Sony BMZ-K1 / CX-BK1 Service Manual in PDF. Usually contens schematics / circuit diagrams, wiring diagrams, block diagrams, printed wiring boards, exploded views, parts list, disassembly / assembly, pcb. This Service Manual can help you recover, restore, fix, disassemble and repair Sony BMZ-K1 / CX-BK1 Audio.