BDV-Z7, HCD-Z7 - Sony Audio Service Manual (repair manual)

2010A05-1

© 

2010.01

•  HCD-Z7 is the video, BD/DVD/CD system and tuner section in BDV-Z7.
•  In this set, repair in the state of having connected with SA-WSZ7.

•  This product incorporates copyright protection technol-

ogy that is protected by U.S. patents and other intellectual 
property rights.

  Use of this copyright protection technology must be autho-

rized by Macrovision, and is intended for home and other 
limited viewing uses only unless otherwise authorized by 
Macrovision.

  Reverse engineering or disassembly is prohibited.
•  This system incorporates with Dolby* Digital and the 

DTS** Digital Surround System.

 

*  Manufactured under license from Dolby Laborato-

ries.

 

 

Dolby and the double-D symbol are trademarks of 
Dolby Laboratories.

 

**  Manufactured under license under U.S. Patent 

#’s: 5,451,942; 5,956,674; 5,974,380; 5,978,762; 
6,226,616; 6,487,535; 7,392,195; 7,272,567; 
7,333,929; 7,212,872 & other U.S. and worldwide 
patents issued & pending. DTS is a registered trade-
mark and the DTS logos, Symbol, DTS-HD and 
DTS-HD Master Audio | Essential are trademarks 
of DTS, Inc. © 1996-2008 DTS, Inc. All Rights 
Reserved.

•  This system incorporates High-Defi nition Multimedia 

Interface (HDMITM) technology.

  HDMI, the HDMI logo and High-Defi nition Multimedia 

Interface are trademarks or registered trademarks of HDMI 
Licensing LLC.

•  Java and all Java-based trademarks and logos are trade-

marks or registered trademarks of Sun Microsystems, Inc.

•  “BD-Live” and “BonusView” are trademarks of Bluray 

Disc Association.

•  “Blu-ray Disc” is a trademark.
•  “Blu-ray Disc,” “DVD+RW,” “DVD-RW,” “DVD+R,” 

“DVD-R,” “DVD VIDEO,” and “CD” logos are trade-
marks.

•  “BRAVIA” is a trademark of Sony Corporation.
•  “AVCHD” and the “AVCHD” logo are trademarks of Mat-

sushita Electric Industrial Co., Ltd. and Sony Corporation.

• 

, “XMB,” and “xross media bar” are trademarks of 

Sony Corporation and Sony Computer Entertainment Inc.

•  “PLAYSTATION” is a trademark of Sony Computer 

Entertainment Inc.

•  “x.v.Colour” and “x.v.Colour” logo are trademarks of Sony 

Corporation.

•  “PhotoTV HD” and the “PhotoTV HD” logo are trade-

marks of Sony Corporation.

•  Other system and product names are generally trademarks 

or registered trademarks of the manufacturers. ™ and ® 
marks are not indicated in this document.

Signal format system

PAL/NTSC

System

PLL quartz-locked digital 
synthesizer

FM tuner section
Tuning range

87.5 MHz - 108.0 MHz 
(50 kHz step)

Antenna (aerial)

FM wire antenna (aerial)

Antenna (aerial) terminals 75 ohms, unbalanced
Intermediate frequency

10.7 MHz

Outputs

VIDEO: 1 Vp-p 75 ohms
COMPONENT:
Y: 1 Vp-p 75 ohms

P

B

/C

B

, P

R

/C

R

: 0.7 Vp-p 

75 ohms

HDMI OUT: Type A 
(19 pin)

Output voltage (DIGITAL MEDIA PORT)

DC 5 V

Output current (DIGITAL MEDIA PORT)

700 mA (MAX)

Output voltage (EXT)

DC 5 V

Output current (EXT)

500 mA (MAX)

LAN(100)

100BASE-TX Terminal

Dimensions (approx.)

350 mm × 69 mm × 
277 mm (w/h/d)

Mass (approx.)

3.6 kg

Design and specifications are subject to change 
without notice.

Model Name Using Similar Mechanism

BDP-S350

Mechanism Type

BPD-200

0  OR  DOTTED  LINE  

0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  

When the self-diagnosis function is activated to 
prevent the system from malfunctioning, an 
error code appears in the front panel display, or 
just 

 appears without any messages on the 

entire screen. In these cases, check the 
following.

Contact your nearest Sony dealer or local 
authorized Sony service facility.

Exxxx

Contact your nearest Sony dealer or 
local authorized Sony service 
facility and give the error code.

SYSTEM ERR

UPDATE NG

Disconnect the AC power cord 
(mains lead) from the wall outlet 
(mains), then reconnect and turn the 
system on. If the system does not 
work normally, consult your nearest 
Sony dealer or local authorized 
Sony service facility.

CAUTION
Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous radia-
tion exposure.

NOTES  ON  CHIP  COMPONENT  REPLACEMENT
•  Never reuse a disconnected chip component.
•  Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

FLEXIBLE  CIRCUIT  BOARD  REPAIRING
•  Keep the temperature of soldering iron around 270 °C during 

repairing.

•  Do not touch the soldering iron on the same conductor of the 

circuit board (within 3 times).

•  Be careful not to apply force on the conductor when soldering 

or unsoldering.

This appliance is 
classified as a CLASS 1 
LASER product. This 
marking is located on the 
laser protective housing 
inside the enclosure of 
the control unit.

  .............................................   3

2-1.   Disassembly Flow ...........................................................   6
2-2.   Panel (Top) Assy Service ................................................   7
2-3  Shield Plate (Top) ...........................................................   8
2-4.  Front Panel Block ...........................................................   8
2-5.  DSP Board, MAIN Board ...............................................   9
2-6.  BD Drive (BPD-200) ......................................................   10
2-7.  Rear Panel Block ............................................................   10
2-8. MB-124 

Board 

................................................................  11

TEST  MODE 

 ............................................................   12

ELECTRICAL  CHECK 

 .........................................   19

5-1.  Block Diagram - BD Section - ........................................   21
5-2.  Block Diagram - INPUT Section - ..................................   22
5-3.  Block Diagram - DSP Section - ......................................   23
5-4. Block 

Diagram 

 

- PANEL, POWER SUPPLY Section - ...........................   24

5-5. Printed 

Wiring 

Board 

 

- MB-124 Board (Component Side) - .............................   26

5-6. Printed 

Wiring 

Board 

 

- MB-124 Board (Conductor Side) - ...............................   27

5-7.  Schematic Diagram - MB-124 Board (1/10) - ................   28
5-8.  Schematic Diagram - MB-124 Board (2/10) - ................   29
5-9.  Schematic Diagram - MB-124 Board (3/10) - ................   30
5-10.  Schematic Diagram - MB-124 Board (4/10) - ................   31
5-11.  Schematic Diagram - MB-124 Board (5/10) - ................   32
5-12.  Schematic Diagram - MB-124 Board (6/10) - ................   33
5-13.  Schematic Diagram - MB-124 Board (7/10) - ................   34
5-14.  Schematic Diagram - MB-124 Board (8/10) - ................   35
5-15.  Schematic Diagram - MB-124 Board (9/10) - ................   36
5-16.  Schematic Diagram - MB-124 Board (10/10) - ..............   37
5-17.  Printed Wiring Board - IO Board - .................................   38
5-18.  Schematic Diagram - IO Board - ....................................   39
5-19. Printed Wiring Board 
 

- MAIN Board (Component Side) - ................................   40

5-20. Printed Wiring Board 
 

- MAIN Board (Conductor Side) - ..................................   41

5-21.  Schematic Diagram - MAIN Board (1/3) - .....................   42
5-22.  Schematic Diagram - MAIN Board (2/3) - .....................   43
5-23.  Schematic Diagram - MAIN Board (3/3) - .....................   44
5-24.  Printed Wiring Boards - KEY, EXT Section - ................   45
5-25.  Schematic Diagram - KEY, EXT Section - .....................   45
5-26.  Printed Wiring Board - DSP Board - ..............................   46
5-27.  Schematic Diagram - DSP Board - .................................   47
5-28.  Printed Wiring Board - REG Board - ..............................   48
5-29.  Schematic Diagram - REG Board - ................................   49
5-30.  Printed Wiring Board - FL Board - .................................   50
5-31.  Schematic Diagram - FL Board - ....................................   51

6-1.  Top Panel Section ...........................................................   83
6-2.  MAIN Board Section ......................................................   84
6-3.  Front Panel Section .........................................................   85
6-4.  Rear Panel Section ..........................................................   86

  ..............................   87

The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.

NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

•  Usable with ordinary solder
 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

RELEASING  THE  DISC  TRAY  LOCK
The disc tray lock function for the antitheft of an demonstration 
disc in the store is equipped.

Releasing Procedure:
1.  Press the [

?/1

] button to turn on the system.

2.  Press the [FUNCTION] button to select “BD/DVD”.
3.  Press the [

x

] and [

Z

] buttons simultaneously and hold down 

unit “UNLOCKED” displayed on the fluorescent indicator 
tube (around 5 seconds).

Note: When “LOCKED” is displayed, the disc tray lock is not released by 

turning power on/off with the [

?/1] button.

ABOUT  THE  LENS  CLEANING
Do not do the lens cleaning with the cotton bud etc. It causes the 
trouble.

BEGIN  IT  BEFORE  THE  REPAIR
When the HCD-Z7 is checked, connect to SA-WSZ7 (for active 
subwoofer of BDV-Z7).

NOTE  OF  WHEN  OPERATION  OF  THE  SET  IS  CON-
FIRMED
This set displays the protector when the fan stops for ten seconds 
or more, and operation is stopped.
Do not remove, and stop the fan when you confi rm the operation.

NOTE  THE  IC101,  IC102,  IC103,  IC202,  IC203,  IC307,  
IC308,  IC501,  IC502,  IC601,  IC602,  IC700  AND  IC701  
ON  THE  MB-124  BOARD  REPLACING
IC101, IC102, IC103, IC202, IC203, IC307, IC308, IC501, IC502, 
IC601, IC602, IC700 and IC701 on the MB-124 board cannot ex-
change with single. When these parts are damaged, exchange the 
entire mounted board.

NOTE  THE  IC212  ON  THE  MAIN  BOARD  REPLACING
IC212 on the MAIN board cannot exchange with single. When this 
part is damaged, exchange the entire mounted board.

NOTE  THE  IC5003  ON  THE  DSP  BOARD  REPLACING
IC5003 on the DSP board cannot exchange with single. When this 
part is damaged, exchange the entire mounted board.

NOTE  THE  IC502  AND  IC506  ON  THE  REG  BOARD  
REPLACING
IC502 and IC506 on the REG board cannot exchange with single. 
When these parts are damaged, exchange the entire mounted board.

J-6090-199-A

BLX-104

Single Layer

J-6090-200-A

BLX-204

Dual Layer

3-702-101-01

CD (YEDS-18)

J-6090-088-A

HLX-504

Single Layer (NTSC)

J-6090-089-A

HLX-505

Dual Layer (NTSC)

J-6090-077-A

HLX-506

Single Layer (PAL)

J-6090-078-A

HLX-507

Dual Layer (PAL)

Note: Refer to the service manual of BDP-BX1/S350 (Part No. 9-883-

989-1

[]) (page 1-3 to 1-14E) for the use of BLX-104/204.

1. BLX-104
Procedure:
1. Select 

23.976Hz/1080p.

2.  Play “4.Motion picture”.
3.  Check whether player can play back or not.
4.  Check each outputs.
 Video:
 Composite/S 

Video/component/HDMI.

 Audio:
 Speaker 

out.

*  When 1080/24p monitor is nothing, 1080i (59.94Hz or 50Hz) 

can use instead of 1080/24p.

 

However this is temporary correspondence.

2. BLX-204
Procedure:
1.  Select 1080i (59.94Hz or 50Hz).
2.  Play “4.Motion picture”.
3.  Check whether player can play back or not (Check the picture 

and sound output).

3. CD (YEDS-18)
Procedure:
Check whether player can play back or not (Check the sound out-
put).

4.  HLX-504/505 (NTSC), HLX-506/507 (PAL)
Procedure:
1.  After displayed Main Menu, select “1.Video Signal”.
2.  Play “1.Color bar 100%” (Check the picture and sound out-

put).

3.  Return to Menu.
4.  Play “Demonstration 4:3” or “Demonstration 16:9” (Check the 

picture and sound output).