Read Sony BDV-HZ970W / BDV-IZ1000W / HBD-HZ970W / HBD-IZ1000W Service Manual online
HBD-HZ970W/IZ1000W
HBD-HZ970W/IZ1000W
36
36
For Schematic Diagrams.
Note:
• All capacitors are in μF unless otherwise noted. (p: pF) 50
• All capacitors are in μF unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
specifi ed.
• f : internal component.
• 2 : nonfl ammable resistor.
• 5 : fusible resistor.
• C : panel designation.
• 2 : nonfl ammable resistor.
• 5 : fusible resistor.
• C : panel designation.
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
(In addition to this, the necessary note is printed in each block.)
• A : B+ Line.
• B : B– Line.
• Voltages and waveforms are dc with respect to ground
• B : B– Line.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
– MB-135 board –
no mark : BD PLAY
no mark : BD PLAY
*
: Impossible to measure
– Other board –
no mark : TUNER
no mark : TUNER
*
: Impossible to measure
• Voltages are taken with VOM (Input impedance 10 M
Ω).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F :
F :
AUDIO
E :
VIDEO
J
: DISC PLAY
L :
USB
d :
LAN
f :
TUNER
• Abbreviation
AUS :
AUS :
Australian
model
CH
: Chinese model
CND : Canadian model
RU
RU
: Russian model
SP
: Singapore model
TW :
Taiwan
model
• The voltage and waveform of CSP (chip size package)
cannot be measured, becaise its lead layout is different
from that of conventional IC.
from that of conventional IC.
For Printed Wiring Boards.
Note:
• X : Parts extracted from the component side.
• Y : Parts extracted from the conductor side.
• f : Internal component.
•
• X : Parts extracted from the component side.
• Y : Parts extracted from the conductor side.
• f : Internal component.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
• Indication of transistor.
C
B
These are omitted.
E
Q
B
These are omitted.
C E
Q
• Abbreviation
AUS :
AUS :
Australian
model
CH
: Chinese model
CND : Canadian model
RU
RU
: Russian model
SP
: Singapore model
TW :
Taiwan
model
• Lead layouts
surface
CSP (Chip Size Package)
Lead layout of conventional IC
Caution:
Pattern face side:
(Conductor Side)
Parts face side:
(Component Side)
Pattern face side:
(Conductor Side)
Parts face side:
(Component Side)
Parts on the pattern face side seen
from the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
from the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
• MAIN and MB-135 boards are multi-layer printed board.
However, the patterns of intermediate-layers have not
been included in this diagrams.
been included in this diagrams.
• Circuit Boards Location
TUNER (FM) (TU1)
POWER board
FL board
AMP board
MAIN board
LINE_FILTER board
IO-USB-F board
MB-135 board
PW-KEY board
IO-AV board
S-AIR-CONNECT board
Ver. 1.1
Note: The components identifi ed by mark 0 or
dotted line with mark 0 are critical for safety.
Replace only with part number specifi ed.
Note: Les composants identifi és par une marque
0 sont critiques pour la sécurité.
Ne les remplacer que par une piéce portant
le numéro spécifi é.
le numéro spécifi é.
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