Read Sony BDV-HZ970W / BDV-IZ1000W / HBD-HZ970W / HBD-IZ1000W Service Manual online
SERVICE MANUAL
Sony Corporation
Published by Sony Techno Create Corporation
HBD-HZ970W/IZ1000W
SPECIFICATIONS
BLU-RAY DISC/DVD RECEIVER
9-889-896-02
2010H05-1
©
2010.08
US Model
HBD-HZ970W
Canadian Model
AEP Model
UK Model
Australian Model
Chinese Model
Singapore Model
Taiwan Model
HBD-IZ1000W
Ver. 1.1 2010.08
Model Name Using Similar Mechanism
HBD-E370/E970W
Mechanism Type
BPX-5
Optical Pick-up Block Name
KEM-460AAA
• HBD-HZ970W is the amplifi er, video, HDMI, BD/DVD/Super Audio CD/CD system, USB, LAN and tuner section in BDV-HZ970W.
• HBD-IZ1000W is the amplifi er, video, HDMI, BD/DVD/Super Audio CD/CD system, USB, LAN and tuner section in BDV-IZ1000W.
• HBD-IZ1000W is the amplifi er, video, HDMI, BD/DVD/Super Audio CD/CD system, USB, LAN and tuner section in BDV-IZ1000W.
Photo: HBD-HZ970W
Amplifier Section
U.S. models:
POWER OUTPUT AND TOTAL HARMONIC
DISTORTION:
(FTC)
Front L + Front R:
U.S. models:
POWER OUTPUT AND TOTAL HARMONIC
DISTORTION:
(FTC)
Front L + Front R:
With 3 ohms loads, both
channels driven, from
180 Hz - 20,000 Hz; rated
60 W per channel
minimum RMS power,
with no more than 1% total
harmonic distortion from
250 milli watts to rated
output.
channels driven, from
180 Hz - 20,000 Hz; rated
60 W per channel
minimum RMS power,
with no more than 1% total
harmonic distortion from
250 milli watts to rated
output.
Other models:
POWER OUTPUT (rated)
Front L + Front R:
POWER OUTPUT (rated)
Front L + Front R:
105 W + 105 W (at 3 ohms,
1 kHz, 1% THD)
1 kHz, 1% THD)
POWER OUTPUT (reference)
Front L/Front R/Center:
Front L/Front R/Center:
167 W (per channel at 3
ohms, 1 kHz)
ohms, 1 kHz)
Subwoofer:
165 W (at 3 ohms, 80 Hz)
Inputs (Analog)
AUDIO (AUDIO IN)
AUDIO (AUDIO IN)
Sensitivity: 450/250 mV
Inputs (Digital)
DIGITAL IN (SAT/CABLE COAX), DIGITAL IN
DIGITAL IN (SAT/CABLE COAX), DIGITAL IN
(TV OPT)
Supported formats: LPCM
2CH (up to 48 kHz), Dolby
Digital, DTS
Supported formats: LPCM
2CH (up to 48 kHz), Dolby
Digital, DTS
Video Section
Outputs
Outputs
VIDEO: 1 Vp-p 75 ohms
COMPONENT:
Y: 1 Vp-p 75 ohms
P
COMPONENT:
Y: 1 Vp-p 75 ohms
P
B
/C
B
, P
R
/C
R
: 0.7 Vp-p
75 ohms
HDMI Section
Connector
Type A (19pin)
Video inputs
HDMI (IN 1), HDMI (IN
2):
640 × 480p@60 Hz
720 × [email protected]/60 Hz
720 × [email protected]/60 Hz
1280 × [email protected]/60 Hz
1920 × [email protected]/
60 Hz
1920 × [email protected]/
60 Hz
720 × 576i@50 Hz
720 × 576p@50 Hz
1280 × 720p@50 Hz
1920 × 1080i@50 Hz
1920 × 1080p@50 Hz
1920 × 1080p@24 Hz
2):
640 × 480p@60 Hz
720 × [email protected]/60 Hz
720 × [email protected]/60 Hz
1280 × [email protected]/60 Hz
1920 × [email protected]/
60 Hz
1920 × [email protected]/
60 Hz
720 × 576i@50 Hz
720 × 576p@50 Hz
1280 × 720p@50 Hz
1920 × 1080i@50 Hz
1920 × 1080p@50 Hz
1920 × 1080p@24 Hz
BD/DVD/Super Audio CD/CD System
Signal format system
Signal format system
US and Canadian models:
USB Section
(USB) port:
Type A (For connecting
USB memory, memory
card reader, digital still
camera, and digital video
camera)
USB memory, memory
card reader, digital still
camera, and digital video
camera)
Maximum current:
500 mA
LAN Section
LAN (100) terminal
LAN (100) terminal
100BASE-TX Terminal
Tuner Section
System
System
PLL quartz-locked digital
synthesizer
synthesizer
FM tuner section
Tuning range
Tuning range
87.5 MHz - 108.0 MHz
(AEP, Russian, UK, Australian,
Chinese, Singapore and
Taiwan models:
(AEP, Russian, UK, Australian,
Chinese, Singapore and
Taiwan models:
Antenna (aerial)
FM wire antenna (aerial)
Antenna (aerial) terminals 75 ohms, unbalanced
Intermediate frequency
Intermediate frequency
10.7 MHz
General
Power requirements
Power requirements
US and Canadian models:
Power consumption
On: 110 W
Standby: 0.3 W (at the
Power Saving mode)
Standby: 0.3 W (at the
Power Saving mode)
Dimensions (approx.)
430 mm × 83 mm × 355
mm (17 in × 3
mm (17 in × 3
3
/
8
in ×
14
1
/
8
in) (w/h/d) incl.
projecting parts such as the
wireless transceiver slot;
430 mm × 83 mm × 384
mm (17 in × 3
wireless transceiver slot;
430 mm × 83 mm × 384
mm (17 in × 3
3
/
8
in ×
15
1
/
4
in) (w/h/d) incl. the
wireless transceiver
(EZW-RT10/RT10A)
(EZW-RT10/RT10A)
Mass (approx.)
5.3 kg (11 lb 11 oz)
Design and specifications are subject to change
without notice.
without notice.
NTSC
AEP, Russian, UK, Australian,
Chinese, Singapore and
Taiwan models:
AEP, Russian, UK, Australian,
Chinese, Singapore and
Taiwan models:
PAL/NTSC
50 kHz step
US and Canadian models:
100 kHz step)
US and Canadian models:
100 kHz step)
120 V AC, 60 Hz
Other models:
220 - 240 V AC, 50/60 Hz
220 - 240 V AC, 50/60 Hz
Taiwan model:
120V AC, 50/60Hz
120V AC, 50/60Hz
HBD-HZ970W/IZ1000W
2
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE
0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
• This system incorporates with Dolby* Digital and Dolby Pro Logic (II) adaptive
matrix surround decoder and the DTS** Digital Surround System.
* Manufactured under license from Dolby Laboratories. Dolby, Pro Logic, and
the double-D symbol are trademarks of Dolby Laboratories.
** Manufactured under license under U.S. Patent #’s:
5,451,942; 5,956,674; 5,974,380; 5,978,762; 6,226,616; 6,487,535;
7,212,872; 7,333,929; 7,392,195; 7,272,567 & other U.S. and worldwide
patents issued & pending. DTS and the Symbol are registered trademarks,
& DTS-HD, DTS-HD Master Audio, and the DTS logos are trademarks of
DTS, Inc. Product includes software. © DTS, Inc. All Rights Reserved.
7,212,872; 7,333,929; 7,392,195; 7,272,567 & other U.S. and worldwide
patents issued & pending. DTS and the Symbol are registered trademarks,
& DTS-HD, DTS-HD Master Audio, and the DTS logos are trademarks of
DTS, Inc. Product includes software. © DTS, Inc. All Rights Reserved.
• This system incorporates High-Defi nition Multimedia Interface (HDMI™)
technology. HDMI, the HDMI logo and High-Defi nition Multimedia Interface are
trademarks or registered trademarks of HDMI Licensing LLC.
trademarks or registered trademarks of HDMI Licensing LLC.
• Java and all Java-based trademarks and logos are trademarks or registered trade-
marks of Sun Microsystems, Inc.
• “BD-LIVE” and “BONUSVIEW” are trademarks of Blu-ray Disc Association.
• “Blu-ray Disc” is a trademark.
• “Blu-ray Disc,” “DVD+RW,” “DVD-RW,” “DVD+R,” “DVDR,” “DVD
• “Blu-ray Disc” is a trademark.
• “Blu-ray Disc,” “DVD+RW,” “DVD-RW,” “DVD+R,” “DVDR,” “DVD
VIDEO,” and “CD” logos are trademarks.
• “Blu-ray 3D” and “Blu-ray 3D” logo are trademarks of Blu-ray Disc Association.
• “BRAVIA” is a trademark of Sony Corporation.
• “AVCHD” and the “AVCHD” logo are trademarks of Matsushita Electric Indus-
• “BRAVIA” is a trademark of Sony Corporation.
• “AVCHD” and the “AVCHD” logo are trademarks of Matsushita Electric Indus-
trial Co., Ltd. and Sony Corporation.
• “S-AIR” and its logo are trademarks of Sony Corporation.
•
•
, “XMB,” and “xross media bar” are trademarks of Sony Corporation and Sony
Computer Entertainment Inc.
• “PLAYSTATION” is a trademark of Sony Computer Entertainment Inc.
• DivX®, DivX Certifi ed® and associated logos are registered trademarks of
• DivX®, DivX Certifi ed® and associated logos are registered trademarks of
DivX, Inc. and are used under license. (Except for U.S. models.)
• Music and video recognition technology and related data are provided by
Gracenote®. Gracenote is the industry standard in music recognition technology
and related content delivery. For more information, please visit www.gracenote.
com. CD, DVD, Blu-ray Disc, and music and video-related data from Grace-
note, Inc., copyright © 2000-present Gracenote. Gracenote Software, copyright
© 2000-present Gracenote. One or more patents owned by Gracenote apply to
this product and service. See the Gracenote website for a nonexhaustive list of
applicable Gracenote patents. Gracenote, CDDB, MusicID, MediaVOCS, the
Gracenote logo and logotype, and the “Powered by Gracenote” logo are either
registered trademarks or trademarks of Gracenote in the United States and/or
other countries.
and related content delivery. For more information, please visit www.gracenote.
com. CD, DVD, Blu-ray Disc, and music and video-related data from Grace-
note, Inc., copyright © 2000-present Gracenote. Gracenote Software, copyright
© 2000-present Gracenote. One or more patents owned by Gracenote apply to
this product and service. See the Gracenote website for a nonexhaustive list of
applicable Gracenote patents. Gracenote, CDDB, MusicID, MediaVOCS, the
Gracenote logo and logotype, and the “Powered by Gracenote” logo are either
registered trademarks or trademarks of Gracenote in the United States and/or
other countries.
• “PhotoTV HD” and the “PhotoTV HD” logo are trademarks of Sony Corporation.
• MPEG Layer-3 audio coding technology and patents licensed from Fraunhofer
IIS and Thomson.
• iPod is a trademark of Apple Inc., registered in the U.S. and other countries.
• “Made for iPod” means that an electronic accessory has been designed to connect
• “Made for iPod” means that an electronic accessory has been designed to connect
specifi cally to iPod and has been certifi ed by the developer to meet Apple perfor-
mance standards.
mance standards.
• Apple is not responsible for the operation of this device or its compliance with
safety and regulatory standards.
• Windows Media is either a registered trademark or trademark of Microsoft Cor-
poration in the United States and/or other countries.
• DLNA®, the DLNA Logo and DLNA CERTIFIED. are trademarks, service
marks, or certifi cation marks of the Digital Living Network Alliance.
• Other system and product names are generally trademarks or registered trade-
marks of the manufacturers. ™ and ® marks are not indicated in this document.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
SAFETY CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
1.5 k
Ω
0.15
μF
AC
voltmeter
(0.75 V)
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Parts on Set
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
This appliance is classified as a
CLASS 3R LASER product.
Visible and invisible laser radiation
is emitted when the laser protective
housing is opened, so be sure to
avoid direct eye exposure.
CLASS 3R LASER product.
Visible and invisible laser radiation
is emitted when the laser protective
housing is opened, so be sure to
avoid direct eye exposure.
This marking is located on the laser
protective housing inside the
enclosure.
protective housing inside the
enclosure.
This appliance is classified as a
CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT
MARKING is located on the laser
protective housing inside the
enclosure.
CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT
MARKING is located on the laser
protective housing inside the
enclosure.
Ver. 1.1
HBD-HZ970W/IZ1000W
3
NOTES ON CHIP COMPONENT REPLACEMENT
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
• Keep the temperature of soldering iron around 270 °C during
• Keep the temperature of soldering iron around 270 °C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
1.
SERVICING NOTES
............................................. 4
2. DISASSEMBLY
2-1. Disassembly
Flow
........................................................... 11
2-2. Case
(T)
........................................................................... 11
2-3. Top Plate (Metal) ............................................................ 12
2-4. Front Panel Block ........................................................... 12
2-5. MB-135
2-4. Front Panel Block ........................................................... 12
2-5. MB-135
Board
................................................................ 13
2-6. POWER
Board
................................................................ 13
2-7. S-AIR-CONNECT
Board
............................................... 14
2-8. MAIN
Board
................................................................... 14
2-9. Bracket
(Main)
................................................................ 15
2-10. LINE_FILTER Board ..................................................... 15
2-11. AMP Board ..................................................................... 16
2-12. IO-AV Board ................................................................... 16
2-13. BD Drive (BPX-5) .......................................................... 17
2-14. Optical Pick-up Block (KEM-460AAA),
Wire
2-11. AMP Board ..................................................................... 16
2-12. IO-AV Board ................................................................... 16
2-13. BD Drive (BPX-5) .......................................................... 17
2-14. Optical Pick-up Block (KEM-460AAA),
Wire
(Flat
Type)
..............................................................
18
3.
TEST MODE
............................................................ 19
4.
ELECTRICAL CHECK
......................................... 27
5. DIAGRAMS
5-1. Block Diagram - SERVO Section - ................................ 28
5-2. Block Diagram - MEMORY Section - ............................ 29
5-3. Block Diagram - AUDIO INPUT Section - .................... 30
5-4. Block Diagram - DSP Section - ...................................... 31
5-5. Block Diagram - HDMI Section - ................................... 32
5-6. Block Diagram - AUDIO OUTPUT Section - ................ 33
5-7. Block Diagram - REGULATOR Section - ...................... 34
5-8. Block
5-2. Block Diagram - MEMORY Section - ............................ 29
5-3. Block Diagram - AUDIO INPUT Section - .................... 30
5-4. Block Diagram - DSP Section - ...................................... 31
5-5. Block Diagram - HDMI Section - ................................... 32
5-6. Block Diagram - AUDIO OUTPUT Section - ................ 33
5-7. Block Diagram - REGULATOR Section - ...................... 34
5-8. Block
Diagram
- PANEL, POWER SUPPLY Section - ........................... 35
5-9. Schematic Diagram - MB-135 Board (1/13) - ................ 37
5-10. Schematic Diagram - MB-135 Board (2/13) - ................ 38
5-11. Schematic Diagram - MB-135 Board (3/13) - ................ 39
5-12. Schematic Diagram - MB-135 Board (4/13) - ................ 40
5-13. Schematic Diagram - MB-135 Board (5/13) - ................ 41
5-14. Schematic Diagram - MB-135 Board (6/13) - ................ 42
5-15. Schematic Diagram - MB-135 Board (7/13) - ................ 43
5-16. Schematic Diagram - MB-135 Board (8/13) - ................ 44
5-17. Schematic Diagram - MB-135 Board (9/13) - ................ 45
5-18. Schematic Diagram - MB-135 Board (10/13) - .............. 46
5-10. Schematic Diagram - MB-135 Board (2/13) - ................ 38
5-11. Schematic Diagram - MB-135 Board (3/13) - ................ 39
5-12. Schematic Diagram - MB-135 Board (4/13) - ................ 40
5-13. Schematic Diagram - MB-135 Board (5/13) - ................ 41
5-14. Schematic Diagram - MB-135 Board (6/13) - ................ 42
5-15. Schematic Diagram - MB-135 Board (7/13) - ................ 43
5-16. Schematic Diagram - MB-135 Board (8/13) - ................ 44
5-17. Schematic Diagram - MB-135 Board (9/13) - ................ 45
5-18. Schematic Diagram - MB-135 Board (10/13) - .............. 46
TABLE OF CONTENTS
5-19. Schematic Diagram - MB-135 Board (11/13) - .............. 47
5-20. Schematic Diagram - MB-135 Board (12/13) - .............. 48
5-21. Schematic Diagram - MB-135 Board (13/13) - .............. 49
5-22. Printed Wiring Board
5-20. Schematic Diagram - MB-135 Board (12/13) - .............. 48
5-21. Schematic Diagram - MB-135 Board (13/13) - .............. 49
5-22. Printed Wiring Board
- MB-135 Board (Component Side) - ............................. 50
5-23. Printed Wiring Board
- MB-135 Board (Conductor Side) - ............................... 51
5-24. Printed Wiring Board - IO-AV Board - ........................... 52
5-25. Schematic Diagram - IO-AV Board - .............................. 53
5-26. Printed Wiring Board
5-25. Schematic Diagram - IO-AV Board - .............................. 53
5-26. Printed Wiring Board
- MAIN Board (Component Side) - ................................ 54
5-27. Printed Wiring Board
- MAIN Board (Conductor Side) - .................................. 55
5-28. Schematic Diagram - MAIN Board (1/10) - ................... 56
5-29. Schematic Diagram - MAIN Board (2/10) - ................... 57
5-30. Schematic Diagram - MAIN Board (3/10) - ................... 58
5-31. Schematic Diagram - MAIN Board (4/10) - ................... 59
5-32. Schematic Diagram - MAIN Board (5/10) - ................... 60
5-33. Schematic Diagram - MAIN Board (6/10) - ................... 61
5-34. Schematic Diagram - MAIN Board (7/10) - ................... 62
5-35. Schematic Diagram - MAIN Board (8/10) - ................... 63
5-36. Schematic Diagram - MAIN Board (9/10) - ................... 64
5-37. Schematic Diagram - MAIN Board (10/10) - ................. 65
5-38. Printed Wiring Boards - CONNECT Section - ............... 66
5-39. Schematic Diagram - CONNECT Section - ................... 67
5-40. Printed Wiring Board - FL Board - ................................. 68
5-41. Schematic Diagram - FL Board - .................................... 69
5-42. Printed Wiring Board - POWER Board - ........................ 70
5-43. Schematic Diagram - POWER Board - .......................... 71
5-44. Schematic Diagram - AMP Board (1/2) - ....................... 72
5-45. Schematic Diagram - AMP Board (2/2) - ....................... 73
5-46. Printed Wiring Board - AMP Board - ............................. 74
5-29. Schematic Diagram - MAIN Board (2/10) - ................... 57
5-30. Schematic Diagram - MAIN Board (3/10) - ................... 58
5-31. Schematic Diagram - MAIN Board (4/10) - ................... 59
5-32. Schematic Diagram - MAIN Board (5/10) - ................... 60
5-33. Schematic Diagram - MAIN Board (6/10) - ................... 61
5-34. Schematic Diagram - MAIN Board (7/10) - ................... 62
5-35. Schematic Diagram - MAIN Board (8/10) - ................... 63
5-36. Schematic Diagram - MAIN Board (9/10) - ................... 64
5-37. Schematic Diagram - MAIN Board (10/10) - ................. 65
5-38. Printed Wiring Boards - CONNECT Section - ............... 66
5-39. Schematic Diagram - CONNECT Section - ................... 67
5-40. Printed Wiring Board - FL Board - ................................. 68
5-41. Schematic Diagram - FL Board - .................................... 69
5-42. Printed Wiring Board - POWER Board - ........................ 70
5-43. Schematic Diagram - POWER Board - .......................... 71
5-44. Schematic Diagram - AMP Board (1/2) - ....................... 72
5-45. Schematic Diagram - AMP Board (2/2) - ....................... 73
5-46. Printed Wiring Board - AMP Board - ............................. 74
6.
EXPLODED VIEWS
6-1. Case
Section
....................................................................
110
6-2. Front Panel Section ......................................................... 111
6-3. MB-135 Board Section ................................................... 112
6-4. MAIN Board Section ...................................................... 113
6-5. AMP Board Section ........................................................ 114
6-6. Back Panel Section ......................................................... 115
6-7. BD Drive Section (BPX-5) ............................................. 116
6-3. MB-135 Board Section ................................................... 112
6-4. MAIN Board Section ...................................................... 113
6-5. AMP Board Section ........................................................ 114
6-6. Back Panel Section ......................................................... 115
6-7. BD Drive Section (BPX-5) ............................................. 116
7.
ELECTRICAL PARTS LIST
.............................. 117
HBD-HZ970W/IZ1000W
4
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
Part No.
Description
Layer
J-6090-199-A
BLX-104
Single Layer
J-6090-200-A
BLX-204
Dual Layer
J-2501-307-A
CD (HLX-A1)
J-2501-305-A
HLX-513
Single Layer (NTSC)
J-2501-306-A
HLX-514
Dual Layer (NTSC)
J-6090-077-A
HLX-506
Single Layer (PAL)
J-6090-078-A
HLX-507
Dual Layer (PAL)
TEST DISC
Note: Refer to the service manual of BDP-BX1/S350 (Part No. 9-883-
989-1[]) (page 1-3 to 1-14E) for the use of BLX-104/204.
Operation and Display:
1. BLX-104
Procedure:
1. Select
Procedure:
1. Select
23.976Hz/1080p.
2. Play “4.Motion picture”.
3. Check whether player can play back or not.
4. Check each outputs.
Video:
Composite/S
3. Check whether player can play back or not.
4. Check each outputs.
Video:
Composite/S
Video/component/HDMI.
Audio:
Speaker
Speaker
out.
* When 1080/24p monitor is nothing, 1080i (59.94Hz or 50Hz)
can use instead of 1080/24p.
However this is temporary correspondence.
2. BLX-204
Procedure:
1. Select 1080i (59.94Hz or 50Hz).
2. Play “4.Motion picture”.
3. Check whether player can play back or not (Check the picture
Procedure:
1. Select 1080i (59.94Hz or 50Hz).
2. Play “4.Motion picture”.
3. Check whether player can play back or not (Check the picture
and sound output).
3. CD (HLX-A1)
Procedure:
Check whether player can play back or not (Check the sound out-
put).
Procedure:
Check whether player can play back or not (Check the sound out-
put).
4. HLX-513/514 (NTSC), HLX-506/507 (PAL)
Procedure:
1. After displayed Main Menu, select “1.Video Signal”.
2. Play “1.Color bar 100%” (Check the picture and sound out-
Procedure:
1. After displayed Main Menu, select “1.Video Signal”.
2. Play “1.Color bar 100%” (Check the picture and sound out-
put).
3. Return to Menu.
4. Play “Demonstration 4:3” or “Demonstration 16:9” (Check the
4. Play “Demonstration 4:3” or “Demonstration 16:9” (Check the
picture and sound output).
NOTE THE IC101, IC104, IC105, IC204, IC205, IC307,
IC311, IC501 AND IC502 ON THE MB-135 BOARD
REPLACING
IC101, IC104, IC105, IC204, IC205, IC307, IC311, IC501 and
IC502 on the MB-135 board cannot exchange with single. When
these parts are damaged, exchange the entire mounted board.
IC311, IC501 AND IC502 ON THE MB-135 BOARD
REPLACING
IC101, IC104, IC105, IC204, IC205, IC307, IC311, IC501 and
IC502 on the MB-135 board cannot exchange with single. When
these parts are damaged, exchange the entire mounted board.
NOTE THE IC403, IC404, IC3800, IC3804, IC3805,
IC3807 AND IC3812 ON THE MAIN BOARD REPLAC-
ING
IC403, IC404, IC3800, IC3804, IC3805, IC3807 and IC3812 on
the MAIN board cannot exchange with single. When these parts
are damaged, exchange the entire mounted board.
IC3807 AND IC3812 ON THE MAIN BOARD REPLAC-
ING
IC403, IC404, IC3800, IC3804, IC3805, IC3807 and IC3812 on
the MAIN board cannot exchange with single. When these parts
are damaged, exchange the entire mounted board.
RELEASING THE DISC TRAY LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
Releasing Procedure:
1. Press the [
1. Press the [
?/1
] button to turn on the system.
2. Press the [FUNCTION] button to select “BD/DVD”.
3. Press the [
3. Press the [
x
] and [
Z
] buttons simultaneously and hold down
unit “DEMO OFF” displayed on the fluorescent indicator tube
(around 5 seconds).
(around 5 seconds).
Note: When “DEMO ON” is displayed, the disc tray lock is not released
by turning power on/off with the [?/1] button.
ABOUT THE LENS CLEANING
Do not do the lens cleaning with the cotton bud etc. It causes the
trouble.
Do not do the lens cleaning with the cotton bud etc. It causes the
trouble.