BDV-HZ970W - Sony Audio Service Manual (repair manual)

Model
BDV-HZ970W
Pages
127
Size
10 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
bdv-hz970w-1-2-3.pdf
Date

View Sony BDV-HZ970W Service Manual online

SERVICE MANUAL
Sony Corporation
Published by Sony Techno Create Corporation
HBD-HZ970W/IZ1000W
SPECIFICATIONS
BLU-RAY DISC/DVD RECEIVER
9-889-896-02
2010H05-1
© 
2010.08
US Model
HBD-HZ970W
Canadian Model
AEP Model
UK Model
Australian Model
Chinese Model
Singapore Model
Taiwan Model
HBD-IZ1000W
Ver. 1.1  2010.08
Model Name Using Similar Mechanism
HBD-E370/E970W
Mechanism Type
BPX-5
Optical Pick-up Block Name
KEM-460AAA
•  HBD-HZ970W is the amplifi er, video, HDMI, BD/DVD/Super Audio CD/CD system, USB, LAN and tuner section in BDV-HZ970W.
•  HBD-IZ1000W is the amplifi er, video, HDMI, BD/DVD/Super Audio CD/CD system, USB, LAN and tuner section in BDV-IZ1000W.
Photo: HBD-HZ970W
Amplifier Section
U.S. models:
POWER OUTPUT AND TOTAL HARMONIC 
DISTORTION:
(FTC)
Front L + Front R:
With 3 ohms loads, both 
channels driven, from 
180 Hz - 20,000 Hz; rated 
60 W per channel 
minimum RMS power, 
with no more than 1% total 
harmonic distortion from 
250 milli watts to rated 
output.
Other models:
POWER OUTPUT (rated)
Front L + Front R:
105 W + 105 W (at 3 ohms, 
1 kHz, 1% THD)
POWER OUTPUT (reference) 
Front L/Front R/Center:
167 W (per channel at 3 
ohms, 1 kHz)
Subwoofer:
165 W (at 3 ohms, 80 Hz)
Inputs (Analog)
AUDIO (AUDIO IN)
Sensitivity: 450/250 mV
Inputs (Digital)
DIGITAL IN (SAT/CABLE COAX), DIGITAL IN 
(TV OPT)
Supported formats: LPCM 
2CH (up to 48 kHz), Dolby 
Digital, DTS
Video Section
Outputs
VIDEO: 1 Vp-p 75 ohms
COMPONENT:
Y: 1 Vp-p 75 ohms
P
B
/C
B
, P
R
/C
R
: 0.7 Vp-p 
75 ohms
HDMI Section
Connector
Type A (19pin)
Video inputs
HDMI (IN 1), HDMI (IN 
2): 
640 × 480p@60 Hz
720 × 480i@59.94/60 Hz
720 × 480p@59.94/60 Hz
1280 × 720p@59.94/60 Hz
1920 × 1080i@59.94/
60 Hz
1920 × 1080p@59.94/
60 Hz
720 × 576i@50 Hz
720 × 576p@50 Hz
1280 × 720p@50 Hz
1920 × 1080i@50 Hz
1920 × 1080p@50 Hz
1920 × 1080p@24 Hz
BD/DVD/Super Audio CD/CD System
Signal format system
US and Canadian models:
USB Section
 (USB) port:
Type A (For connecting 
USB memory, memory 
card reader, digital still 
camera, and digital video 
camera)
Maximum current:
500 mA
LAN Section
LAN (100) terminal
100BASE-TX Terminal
Tuner Section
System
PLL quartz-locked digital 
synthesizer
FM tuner section
Tuning range
87.5 MHz - 108.0 MHz 
(AEP, Russian, UK, Australian, 
Chinese, Singapore and 
Taiwan models: 
Antenna (aerial)
FM wire antenna (aerial)
Antenna (aerial) terminals 75 ohms, unbalanced
Intermediate frequency
10.7 MHz
General
Power requirements
US and Canadian models:
Power consumption
On: 110 W
Standby: 0.3 W (at the 
Power Saving mode) 
Dimensions (approx.)
430 mm × 83 mm × 355 
mm (17 in × 3 
3
/
8
 in × 
14 
1
/
8
 in) (w/h/d) incl. 
projecting parts such as the 
wireless transceiver slot;
430 mm × 83 mm × 384 
mm (17 in × 3 
3
/
8
 in × 
15 
1
/
4
 in) (w/h/d) incl. the 
wireless transceiver 
(EZW-RT10/RT10A)
Mass (approx.)
5.3 kg (11 lb 11 oz)
Design and specifications are subject to change 
without notice.
NTSC 
AEP, Russian, UK, Australian, 
Chinese, Singapore and 
Taiwan models: 
PAL/NTSC
50 kHz step 
US and Canadian models: 
100 kHz step)
120 V AC, 60 Hz
Other models: 
220 - 240 V AC, 50/60 Hz
Taiwan model:
120V AC, 50/60Hz
HBD-HZ970W/IZ1000W
2
SAFETY-RELATED  COMPONENT  WARNING!
COMPONENTS  IDENTIFIED  BY  MARK  
0  OR  DOTTED  LINE  
WITH  MARK  
0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 
 
WHOSE  PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  
MANUAL  OR  IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
ATTENTION  AU  COMPOSANT  AYANT  RAPPORT  
À  LA  SÉCURITÉ!
LES  COMPOSANTS  IDENTIFIÉS  PAR  UNE  MARQUE  
0  SUR  
LES  DIAGRAMMES  SCHÉMATIQUES  ET  LA  LISTE  DES  
PIÈCES  SONT  CRITIQUES  POUR  LA  SÉCURITÉ  DE  FONC-
TIONNEMENT.  NE  REMPLACER  CES  COMPOSANTS  QUE  
PAR  DES  PIÈCES  SONY  DONT  LES  NUMÉROS  SONT  DON-
NÉS  DANS  CE  MANUEL  OU  DANS  LES  SUPPLÉMENTS  
PUBLIÉS  PAR  SONY.
•  This system incorporates with Dolby* Digital and Dolby Pro Logic (II) adaptive 
matrix surround decoder and the DTS** Digital Surround System. 
 
*  Manufactured under license from Dolby Laboratories. Dolby, Pro Logic, and 
the double-D symbol are trademarks of Dolby Laboratories.
 
** Manufactured under license under U.S. Patent #’s:
 
 
5,451,942; 5,956,674; 5,974,380; 5,978,762; 6,226,616; 6,487,535; 
7,212,872; 7,333,929; 7,392,195; 7,272,567 & other U.S. and worldwide 
patents issued & pending. DTS and the Symbol are registered trademarks, 
& DTS-HD, DTS-HD Master Audio, and the DTS logos are trademarks of 
DTS, Inc. Product includes software. © DTS, Inc. All Rights Reserved.
•  This system incorporates High-Defi nition Multimedia Interface (HDMI™) 
technology. HDMI, the HDMI logo and High-Defi nition Multimedia Interface are 
trademarks or registered trademarks of HDMI Licensing LLC.
•  Java and all Java-based trademarks and logos are trademarks or registered trade-
marks of Sun Microsystems, Inc. 
•  “BD-LIVE” and “BONUSVIEW” are trademarks of Blu-ray Disc Association.
•  “Blu-ray Disc” is a trademark.
•  “Blu-ray Disc,” “DVD+RW,” “DVD-RW,” “DVD+R,” “DVDR,” “DVD 
VIDEO,” and “CD” logos are trademarks.
•  “Blu-ray 3D” and “Blu-ray 3D” logo are trademarks of Blu-ray Disc Association.
•  “BRAVIA” is a trademark of Sony Corporation.
•  “AVCHD” and the “AVCHD” logo are trademarks of Matsushita Electric Indus-
trial Co., Ltd. and Sony Corporation.
•  “S-AIR” and its logo are trademarks of Sony Corporation.
• 
, “XMB,” and “xross media bar” are trademarks of Sony Corporation and Sony 
Computer Entertainment Inc.
•  “PLAYSTATION” is a trademark of Sony Computer Entertainment Inc.
•  DivX®, DivX Certifi ed® and associated logos are registered trademarks of 
DivX, Inc. and are used under license. (Except for U.S. models.)
•  Music and video recognition technology and related data are provided by 
Gracenote®. Gracenote is the industry standard in music recognition technology 
and related content delivery. For more information, please visit www.gracenote.
com. CD, DVD, Blu-ray Disc, and music and video-related data from Grace-
note, Inc., copyright © 2000-present Gracenote. Gracenote Software, copyright 
© 2000-present Gracenote. One or more patents owned by Gracenote apply to 
this product and service. See the Gracenote website for a nonexhaustive list of 
applicable Gracenote patents. Gracenote, CDDB, MusicID, MediaVOCS, the 
Gracenote logo and logotype, and the “Powered by Gracenote” logo are either 
registered trademarks or trademarks of Gracenote in the United States and/or 
other countries.
 
•  “PhotoTV HD” and the “PhotoTV HD” logo are trademarks of Sony Corporation.
•  MPEG Layer-3 audio coding technology and patents licensed from Fraunhofer 
IIS and Thomson.
•  iPod is a trademark of Apple Inc., registered in the U.S. and other countries.
•  “Made for iPod” means that an electronic accessory has been designed to connect 
specifi cally to iPod and has been certifi ed by the developer to meet Apple perfor-
mance standards.
•  Apple is not responsible for the operation of this device or its compliance with 
safety and regulatory standards.
•  Windows Media is either a registered trademark or trademark of Microsoft Cor-
poration in the United States and/or other countries.
•  DLNA®, the DLNA Logo and DLNA CERTIFIED. are trademarks, service 
marks, or certifi cation marks of the Digital Living Network Alliance.
•  Other system and product names are generally trademarks or registered trade-
marks of the manufacturers. ™ and ® marks are not indicated in this document.
CAUTION
Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous radia-
tion exposure.
SAFETY  CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, 
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE  TEST
The AC leakage from any exposed metal part to earth ground and 
from all exposed metal parts to any exposed metal part having a 
return to chassis, must not exceed 0.5 mA (500 microamperes.). 
Leakage current can be measured by any one of three methods.
1.  A commercial leakage tester, such as the Simpson 229 or RCA 
WT-540A. Follow the manufacturers’ instructions to use these 
instruments.
2.  A battery-operated AC milliammeter. The Data Precision 245 
digital multimeter is suitable for this job.
3.  Measuring the voltage drop across a resistor by means of a 
VOM or battery-operated AC voltmeter. The “limit” indication 
is 0.75 V, so analog meters must have an accurate low-voltage 
scale. The Simpson 250 and Sanwa SH-63Trd are examples 
of a passive VOM that is suitable. Nearly all battery operated 
digital multimeters that have a 2 V AC range are suitable. (See 
Fig. A)
1.5 k
Ω
0.15 
μF
AC
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Earth Ground
Fig. A.  Using an AC voltmeter to check AC leakage.
This appliance is classified as a 
CLASS 3R LASER product. 
Visible and invisible laser radiation 
is emitted when the laser protective 
housing is opened, so be sure to 
avoid direct eye exposure.
This marking is located on the laser 
protective housing inside the 
enclosure.
This appliance is classified as a 
CLASS 1 LASER product. The 
CLASS 1 LASER PRODUCT 
MARKING is located on the laser 
protective housing inside the 
enclosure.
Ver. 1.1
HBD-HZ970W/IZ1000W
3
NOTES  ON  CHIP  COMPONENT  REPLACEMENT
•  Never reuse a disconnected chip component.
•  Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE  CIRCUIT  BOARD  REPAIRING
•  Keep the temperature of soldering iron around 270 °C during 
repairing.
•  Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).
•  Be careful not to apply force on the conductor when soldering 
or unsoldering.
1. 
SERVICING  NOTES
  .............................................   4
2. DISASSEMBLY
 
2-1. Disassembly 
Flow 
...........................................................  11
2-2. Case 
(T) 
...........................................................................  11
2-3.  Top Plate (Metal) ............................................................   12
2-4.  Front Panel Block ...........................................................   12
2-5. MB-135 
Board 
................................................................  13
2-6. POWER 
Board 
................................................................  13
2-7. S-AIR-CONNECT 
Board 
...............................................  14
2-8. MAIN 
Board 
...................................................................  14
2-9. Bracket 
(Main) 
................................................................  15
2-10. LINE_FILTER Board .....................................................   15
2-11. AMP Board .....................................................................  16
2-12. IO-AV Board ...................................................................   16
2-13.  BD Drive (BPX-5) ..........................................................   17
2-14.  Optical Pick-up Block (KEM-460AAA), 
 Wire 
(Flat 
Type) 
..............................................................  
18
3. 
TEST  MODE 
 ............................................................   19
4. 
ELECTRICAL  CHECK 
 .........................................   27
5. DIAGRAMS
5-1.  Block Diagram - SERVO Section - ................................   28
5-2.  Block Diagram - MEMORY Section - ............................   29
5-3.  Block Diagram - AUDIO INPUT Section - ....................   30
5-4.  Block Diagram - DSP Section - ......................................   31
5-5.  Block Diagram - HDMI Section - ...................................   32
5-6.  Block Diagram - AUDIO OUTPUT Section - ................   33
5-7.  Block Diagram - REGULATOR Section - ......................   34
5-8. Block 
Diagram 
 
- PANEL, POWER SUPPLY Section - ...........................   35
5-9.  Schematic Diagram - MB-135 Board (1/13) - ................   37
5-10.  Schematic Diagram - MB-135 Board (2/13) - ................   38
5-11.  Schematic Diagram - MB-135 Board (3/13) - ................   39
5-12.  Schematic Diagram - MB-135 Board (4/13) - ................   40
5-13.  Schematic Diagram - MB-135 Board (5/13) - ................   41
5-14.  Schematic Diagram - MB-135 Board (6/13) - ................   42
5-15.  Schematic Diagram - MB-135 Board (7/13) - ................   43
5-16.  Schematic Diagram - MB-135 Board (8/13) - ................   44
5-17.  Schematic Diagram - MB-135 Board (9/13) - ................   45
5-18.  Schematic Diagram - MB-135 Board (10/13) - ..............   46
TABLE  OF  CONTENTS
5-19.  Schematic Diagram - MB-135 Board (11/13) - ..............   47
5-20.  Schematic Diagram - MB-135 Board (12/13) - ..............   48
5-21.  Schematic Diagram - MB-135 Board (13/13) - ..............   49
5-22. Printed Wiring Board 
 
- MB-135 Board (Component Side) - .............................   50
5-23. Printed Wiring Board 
 
- MB-135 Board (Conductor Side) - ...............................   51
5-24.  Printed Wiring Board - IO-AV Board - ...........................   52
5-25.  Schematic Diagram - IO-AV Board - ..............................   53
5-26. Printed Wiring Board 
 
- MAIN Board (Component Side) - ................................   54
5-27. Printed Wiring Board 
 
- MAIN Board (Conductor Side) - ..................................   55
5-28.  Schematic Diagram - MAIN Board (1/10) - ...................   56
5-29.  Schematic Diagram - MAIN Board (2/10) - ...................   57
5-30.  Schematic Diagram - MAIN Board (3/10) - ...................   58
5-31.  Schematic Diagram - MAIN Board (4/10) - ...................   59
5-32.  Schematic Diagram - MAIN Board (5/10) - ...................   60
5-33.  Schematic Diagram - MAIN Board (6/10) - ...................   61
5-34.  Schematic Diagram - MAIN Board (7/10) - ...................   62
5-35.  Schematic Diagram - MAIN Board (8/10) - ...................   63
5-36.  Schematic Diagram - MAIN Board (9/10) - ...................   64
5-37.  Schematic Diagram - MAIN Board (10/10) - .................   65
5-38.  Printed Wiring Boards - CONNECT Section - ...............   66
5-39.  Schematic Diagram - CONNECT Section - ...................   67
5-40.  Printed Wiring Board - FL Board - .................................   68
5-41.  Schematic Diagram - FL Board - ....................................   69
5-42.  Printed Wiring Board - POWER Board - ........................   70
5-43.  Schematic Diagram - POWER Board - ..........................   71
5-44.  Schematic Diagram - AMP Board (1/2) - .......................   72
5-45.  Schematic Diagram - AMP Board (2/2) - .......................   73
5-46.  Printed Wiring Board - AMP Board - .............................   74
6. 
EXPLODED  VIEWS
6-1. Case 
Section 
....................................................................  
110
6-2.  Front Panel Section .........................................................  111
6-3.  MB-135 Board Section ...................................................  112
6-4.  MAIN Board Section ......................................................  113
6-5.  AMP Board Section ........................................................  114
6-6.  Back Panel Section .........................................................  115
6-7.  BD Drive Section (BPX-5) .............................................  116
7. 
ELECTRICAL  PARTS  LIST
  ..............................  117
HBD-HZ970W/IZ1000W
4
SECTION  1
SERVICING  NOTES
NOTES  ON  HANDLING  THE OPTICAL  PICK-UP  
BLOCK  OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.
NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.
UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 
the lead free mark due to their particular size)
 : LEAD  FREE  MARK
Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 
than ordinary solder.
 
Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.
 
Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 
the heated tip is applied for too long, so be careful!
• Strong 
viscosity
 
Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.
•  Usable with ordinary solder
 
It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.
Part No.
Description
Layer
J-6090-199-A
BLX-104
Single Layer
J-6090-200-A
BLX-204
Dual Layer
J-2501-307-A
CD (HLX-A1)
J-2501-305-A
HLX-513
Single Layer (NTSC)
J-2501-306-A
HLX-514
Dual Layer (NTSC)
J-6090-077-A
HLX-506
Single Layer (PAL)
J-6090-078-A
HLX-507
Dual Layer (PAL)
TEST  DISC
Note: Refer to the service manual of BDP-BX1/S350 (Part No. 9-883-
989-1[]) (page 1-3 to 1-14E) for the use of BLX-104/204.
Operation and Display:
1. BLX-104
Procedure:
1. Select 
23.976Hz/1080p.
2.  Play “4.Motion picture”.
3.  Check whether player can play back or not.
4.  Check each outputs.
 Video:
 Composite/S 
Video/component/HDMI.
 Audio:
 Speaker 
out.
*  When 1080/24p monitor is nothing, 1080i (59.94Hz or 50Hz) 
can use instead of 1080/24p.
 
However this is temporary correspondence.
2. BLX-204
Procedure:
1.  Select 1080i (59.94Hz or 50Hz).
2.  Play “4.Motion picture”.
3.  Check whether player can play back or not (Check the picture 
and sound output).
3. CD (HLX-A1)
Procedure:
Check whether player can play back or not (Check the sound out-
put).
4.  HLX-513/514 (NTSC), HLX-506/507 (PAL)
Procedure:
1.  After displayed Main Menu, select “1.Video Signal”.
2.  Play “1.Color bar 100%” (Check the picture and sound out-
put).
3.  Return to Menu.
4.  Play “Demonstration 4:3” or “Demonstration 16:9” (Check the 
picture and sound output).
NOTE  THE  IC101,  IC104,  IC105,  IC204,  IC205,  IC307,  
IC311,  IC501  AND  IC502  ON  THE  MB-135  BOARD  
REPLACING
IC101, IC104, IC105, IC204, IC205, IC307, IC311, IC501 and 
IC502 on the MB-135 board cannot exchange with single. When 
these parts are damaged, exchange the entire mounted board.
NOTE  THE  IC403,  IC404,  IC3800,  IC3804,  IC3805,  
IC3807  AND  IC3812  ON  THE  MAIN  BOARD  REPLAC-
ING
IC403, IC404, IC3800, IC3804, IC3805, IC3807 and IC3812 on 
the MAIN board cannot exchange with single. When these parts 
are damaged, exchange the entire mounted board.
RELEASING  THE  DISC  TRAY  LOCK
The disc tray lock function for the antitheft of an demonstration 
disc in the store is equipped.
Releasing Procedure:
1.  Press the [
?/1
] button to turn on the system.
2.  Press the [FUNCTION] button to select “BD/DVD”.
3.  Press the [
x
] and [
Z
] buttons simultaneously and hold down 
unit “DEMO OFF” displayed on the fluorescent indicator tube 
(around 5 seconds).
Note: When “DEMO ON” is displayed, the disc tray lock is not released 
by turning power on/off with the [?/1] button.
ABOUT  THE  LENS  CLEANING
Do not do the lens cleaning with the cotton bud etc. It causes the 
trouble. 

Download Sony BDV-HZ970W Service Manual (Repair Manual)

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