BDV-E370, BDV-E470, BDV-E570, BDV-E870, BDV-T57, HBD-E370, HBD-E470, HBD-E570, HBD-E870, HBD-T57 - Sony Audio Service Manual (repair manual). Page 115

HBD-E370/E470/E570/E870/T57

In this set, MB-134 board has been changed in the midway of production.
Discrimination, printed wiring board, schematic diagram and electrical 
parts list of changed MB-134 board are described in this supplement-1.
Refer to original service manual for other information.

  .................   1

2-1.  Printed Wiring Board 
 

- MB-134 Board (Component Side) - .............................   2

2-2.  Printed Wiring Board 
 

- MB-134 Board (Conductor Side) - ...............................   3

2-3.  Schematic Diagram - MB-134 Board (1/13) - ................   4
2-4.  Schematic Diagram - MB-134 Board (2/13) - ................   5
2-5.  Schematic Diagram - MB-134 Board (3/13) - ................   6
2-6.  Schematic Diagram - MB-134 Board (4/13) - ................   7

2-7.  Schematic Diagram - MB-134 Board (5/13) - ................   8
2-8.  Schematic Diagram - MB-134 Board (6/13) - ................   9
2-9.  Schematic Diagram - MB-134 Board (7/13) - ................   10
2-10.  Schematic Diagram - MB-134 Board (8/13) - ................   11
2-11.  Schematic Diagram - MB-134 Board (9/13) - ................   12
2-12.  Schematic Diagram - MB-134 Board (10/13) - ..............   13
2-13.  Schematic Diagram - MB-134 Board (11/13) - ..............   14
2-14.  Schematic Diagram - MB-134 Board (12/13) - ..............   15
2-15.  Schematic Diagram - MB-134 Board (13/13) - ..............   16

   ..............................   17

Note:
•  All capacitors are in μF unless otherwise noted. (p: pF) 50 

WV or less are not indicated except for electrolytics and 
tantalums.

•  All resistors are in Ω and 1/4 W or less unless otherwise 

specifi ed.

•      f  : Internal component.
•  C : Panel designation.

•  A : B+ Line.
•  Voltages are dc with respect to ground under no-signal 

conditions.

  no mark : BD PLAY
       

*

  : Impossible to measure

•  Voltages are taken with VOM (Input impedance 10 M

Ω).

  Voltage variations may be noted due to normal production 

tolerances.

•  Signal path.
  F 

: AUDIO

  E 

: VIDEO

  J 

: DISC PLAY

  L  : USB
  d 

: LAN

•  The voltage of CSP (chip size package) cannot be mea-

sured, becaise its lead layout is different from that of con-
ventional IC.

Note:
•  X : Parts extracted from the component side.
•  Y : Parts extracted from the conductor side.
•      f  : Internal component.
• 

 : Pattern from the side which enables seeing.

  (The other layers' patterns are not indicated.)

•  Indication of transistor.

 

 

•  Lead layouts

Note: 
The components identi-
fi

 ed by mark 0 or dotted 

line with mark 0 are criti-
cal for safety. 
Replace only with part 
number specifi ed.

Note: 
Les composants identifi és 
par une marque 0 sont 
critiques pour la sécurité. 
Ne les remplacer que par 
une piéce portant le nu-
méro spécifi é.

Caution:
Pattern face side:
(Conductor Side)
Parts face side: 
(Component Side)

Parts on the pattern face side seen 
from the pattern face are indicated.
Parts on the parts face side seen from 
the parts face are indicated.

•  MB-134 board is multi-layer printed board. However, the 

patterns of intermediate-layers have not been included in 
this diagrams.