BDV-E300, BDV-E801, BDV-T10, BDV-T11, HCD-E300, HCD-E301, HCD-E801, HCD-T10, HCD-T11 - Sony Audio Service Manual (repair manual). Page 29

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HCD-E300/E801/T10/T11
HCD-E300/E801/T10/T11
29
29
For Schematic Diagrams.
Note:
•  All capacitors are in μF unless otherwise noted. (p: pF) 50 
WV or less are not indicated except for electrolytics and 
tantalums.
•  All resistors are in Ω and 1/4 W or less unless otherwise 
specifi ed.
•      f  : Internal component.
•  2 : Nonfl ammable resistor.
•  5 : Fusible resistor.
•  C : Panel designation.
THIS  NOTE  IS  COMMON  FOR  PRINTED  WIRING  BOARDS  AND  SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
•  A : B+ Line.
•  B : B– Line.
•  Voltages and waveforms are dc with respect to ground 
under no-signal conditions.
  – MB-124 and VIDEO boards –
  no mark : BD PLAY
       
*
  : Impossible to measure
  – Other boards –
  no mark : TUNER
       
*
  : Impossible to measure
•  Voltages are taken with VOM (Input impedance 10 M
Ω).
  Voltage variations may be noted due to normal production 
tolerances.
•  Waveforms are taken with a oscilloscope.
  Voltage variations may be noted due to normal production 
tolerances.
•  Circled numbers refer to waveforms.
• Signal path.
  F : 
AUDIO
  E : 
VIDEO
  J : 
BD/DVD
  L : 
USB
  d : 
LAN
  f : 
TUNER
  N : 
MIC
•  The voltage and waveform of CSP (chip size package) 
cannot be measured, because its lead layout is different 
from that of conventional IC.
• Abbreviation
 AUS : 
Australian 
model
 CND : 
Canadian 
model
 E32  : 
Latin 
American 
model
 MX  : 
Mexican 
model
 RU  : 
Russian 
model
  SP1  : Hong Kong, Singapore, Malaysia, Indonesian 
   
  and Philippines models
 TW  : 
Taiwan 
model
For Printed Wiring Boards.
Note:
•  X : Parts extracted from the component side.
•  Y : Parts extracted from the conductor side.
•      f  : Internal component.
• 
 : Pattern from the side which enables seeing.
  (The other layers’ patterns are not indicated.)
Caution:
Pattern face side: 
(SIDE B)
Parts face side:
(SIDE A)
Parts on the pattern face side seen 
from the pattern face are indicated.
Parts on the parts face side seen from 
the parts face are indicated.
Caution:
Pattern face side:
(Conductor Side)
Parts face side: 
(Component Side)
Parts on the pattern face side seen 
from the pattern face are indicated.
Parts on the parts face side seen from 
the parts face are indicated.
•  DSP and MB-124 boards are multi-layer printed board. 
However, the patterns of intermediate-layers have not 
been included in this diagrams.
•  Indication of transistor.
 
C
B
These are omitted. 
E
Q
 
B
These are omitted.
C E
Q
• Lead layouts
surface 
CSP (Chip Size Package) 
Lead layout of conventional IC 
• Abbreviation
 AUS : 
Australian 
model
 CND : 
Canadian 
model
 E32  : 
Latin 
American 
model
 MX  : 
Mexican 
model
 RU  : 
Russian 
model
  SP1  : Hong Kong, Singapore, Malaysia, Indonesian 
   
  and Philippines models
 TW  : 
Taiwan 
model
•  Circuit Boards Location
Ver. 1.1
Note: 
The components identi-
fi
 ed by mark 0 or dotted 
line with mark 0 are criti-
cal for safety. 
Replace only with part 
number specifi ed.
Note: 
Les composants identifi és 
par une marque 0 sont 
critiques pour la sécurité. 
Ne les remplacer que par 
une pièce portant le nu-
méro spécifi é.
AUDIO board
TUNER (FM/AM) (US, CND)
TUNER (FM) (except US, CND)
CONNECT board
VIDEO board
DSP board
MB-124 board
MAIN board
POWER board
KEY board
FL board
REG board
• Abbreviation
 CND : 
Canadian 
model
Page of 124
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