BDV-B1 - Sony Audio Service Manual (repair manual)

Model
BDV-B1
Pages
40
Size
10.9 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
bdv-b1-1-2.pdf
Date

View Sony BDV-B1 Service Manual online

SERVICE MANUAL
Sony Corporation
Published by Sony Techno Create Corporation
HBD-B1
SPECIFICATIONS
BLU-RAY DISC/DVD RECEIVER
9-893-220-01
2011F05-1
© 
2011.06
Russian Model
Ver. 1.0  2011.06
•  HBD-B1 is main unit in BDV-B1.
Model Name Using Similar Mechanism
NEW
Mechanism Type
VBP02
Optical Pick-up Block Name
TRV-BD412VH04R
General
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Design and specifications are subject to  
change without notice.
HBD-B1
2
SAFETY-RELATED  COMPONENT  WARNING!
COMPONENTS  IDENTIFIED  BY  MARK  
0  OR  DOTTED  LINE  
WITH  MARK  
0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 
 
WHOSE  PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  
MANUAL  OR  IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
CAUTION
Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous radia-
tion exposure.
NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 
Never reuse a disconnected chip component.
• 
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE  CIRCUIT  BOARD  REPAIRING
• 
Keep the temperature of soldering iron around 270 °C during 
repairing.
• 
Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).
• 
Be careful not to apply force on the conductor when soldering 
or unsoldering.
      
      
Blu-ray Disc™, Blu-ray™, Blu-ray 3D™,  
BD-Live™, BONUSVIEW™ and the logos are 
trademarks of the Blu-ray Disc Association.
“DVD Logo” is a trademark of DVD Format/
Logo Licensing Corporation.
Java is a trademark of Oracle and/or its 
affiliates.
This system incorporates High-Definition 
Multimedia Interface (HDMI™) technology. 
HDMI, the HDMI logo and High-Definition 
Multimedia Interface are trademarks or 
registered trademarks of HDMI Licensing 
LLC in the United States and other countries.
Manufactured under license from Dolby 
Laboratories. Dolby and the double-D symbol 
are trademarks of Dolby Laboratories.
Manufactured under license under U. S. Patent 
#’s: 5,451,942; 5,956,674; 5,974,380; 5,978,762; 
6,226,616; 6,487,535; 7,392,195; 7,272,567; 
7,333,929; 7,212,872 & other U.S. and worldwide 
patents issued & pending. DTS and the Symbol 
are registered trademarks, & DTS-HD, DTS-
HD Master Audio | Essential and the DTS 
logos are trademarks of DTS, Inc. Product 
includes software. © DTS, Inc. All Rights 
Reserved.
 “x.v.Color” is a trademark of Sony 
Corporation.
“AVCHD” and the “AVCHD” logo are 
trademarks of Panasonic Corporation and 
Sony Corporation.
DivX®, DivX Certified® and associated logos 
are  trademark of DivX, Inc., and are used 
under license.
MPEG-4 VISUAL
THIS PRODUCT IS LICENSED UNDER 
THE MPEG-4 VISUAL PATENT 
PORTFOLIO LICENSE FOR THE 
PERSONAL AND NON-COMMERCIAL 
USE OF A CONSUMER FOR DECODING 
VIDEO IN COMPLIANCE WITH THE 
MPEG-4 VISUAL STANDARD (“MPEG-
4 VIDEO”) THAT WAS ENCODED BY A 
CONSUMER ENGAGED IN A PERSONAL 
AND NON-COMMERCIAL ACTIVITY 
AND/OR WAS OBTAINED FROM A 
VIDEO PROVIDER LICENSED BY MPEG 
LA TO PROVIDE MPEG-4 VIDEO.
NO LICENSE IS GRANTED OR SHALL 
BE IMPLIED FOR ANY OTHER 
USE. ADDITIONAL INFORMATION 
INCLUDING THAT RELATING TO 
PROMOTIONAL, INTERNAL AND 
COMMERCIAL USES AND LICENSING 
MAY BE OBTAINED FROM MPEG LA, 
LLC. SEE HTTP://WWW.MPEGLA.COM
MPEG-4 AVC and VC-1
THIS PRODUCT IS LICENSED UNDER 
THE AVC PATENT PORTFOLIO LICENSE 
AND VC-1 PATENT PORTFOLIO LICENSE 
FOR THE PERSONAL AND NON-
COMMERCIAL USE OF A CONSUMER 
TO DECODE VIDEO IN COMPLIANCE 
WITH THE AVC STANDARD (“AVC 
VIDEO”) AND/OR THE VC-1 STANDARD 
(“VC-1 VIDEO”) THAT WAS ENCODED 
BY A CONSUMER ENGAGED IN A 
PERSONAL AND NON-COMMERCIAL 
ACTIVITY AND/OR WAS OBTAINED 
FROM A VIDEO PROVIDER LICENSED 
TO PROVIDE AVC VIDEO AND/OR VC-1 
VIDEO. NO LICENSE IS GRANTED OR 
SHALL BE IMPLIED FOR ANY OTHER 
USE.
ADDITIONAL INFORMATION MAY BE 
OBTAINED FROM MPEG LA, L.L.C. SEE 
HTTP://WWW. MPEGLA.COM
MPEG Layer-3 audio coding technology and 
patents licensed from Fraunhofer IIS and 
Thomson.
Windows Media is either a registered 
trademark or trademark of Microsoft 
Corporation in the United States and/or other 
countries.
This product contains technology subject to 
certain intellectual property rights of Microsoft. 
Use or distribution of this technology outside 
of this product is prohibited without the 
appropriate license(s) from Microsoft.
All other trademarks are trademarks of their 
respective owners.
 
This appliance is 
classified as a CLASS 1 
LASER product. This 
marking is located on the rear of the unit.
HBD-B1
3
1. 
SERVICING  NOTES
  .............................................   4
2. DISASSEMBLY
2-1. Disassembly 
Flow 
...........................................................   6
2-2. Stand 
Base 
Assy 
..............................................................   6
2-3.  Panel Center Assy (TPA1) ..............................................   7
2-4. FRONT 
Board 
.................................................................   7
2-5. Panel 
Front 
Assy 
.............................................................   8
2-6.  Audio Deck Assembly (VBP02) .....................................   9
2-7.  Case Assembly (Speaker Unit) (Rch) (SP2) ...................   9
2-8.  Case Assembly (Speaker Unit) (Lch) (SP1) ...................   10
2-9. JACK 
Board 
....................................................................  10
2-10.  Chassis (Front) Block .....................................................   11
2-11. AMP+SMPS Board.........................................................  12
2-12.  Chassis (Main) Block ......................................................   12
2-13. MAIN Board ...................................................................   13
3. ELECTRICAL 
 
ADJUSTMENT 
 ..........................   14
4. DIAGRAMS
4-1.  Schematic Diagram - MAIN Board (1/10) - ...................   16
4-2.  Schematic Diagram - MAIN Board (2/10) - ...................   17
4-3.  Schematic Diagram - MAIN Board (3/10) - ...................   18
4-4.  Schematic Diagram - MAIN Board (4/10) - ...................   19
TABLE  OF  CONTENTS
4-5.  Schematic Diagram - MAIN Board (5/10) - ...................   20
4-6.  Schematic Diagram - MAIN Board (6/10) - ...................   21
4-7.  Schematic Diagram - MAIN Board (7/10) - ...................   22
4-8.  Schematic Diagram - MAIN Board (8/10) - ...................   23
4-9.  Schematic Diagram - MAIN Board (9/10) - ...................   24
4-10.  Schematic Diagram - MAIN Board (10/10) - .................   25
4-11.  Printed Wiring Board - MAIN Board - ...........................   26
4-12.  Printed Wiring Boards - FRONT, JACK Boards - ..........   27
4-13.  Schematic Diagram - JACK Board - ..............................   28
4-14.  Schematic Diagram - FRONT Board - ...........................   29
4-15.  Schematic Diagram - AMP+SMPS Board (1/4) - ...........   30
4-16.  Schematic Diagram - AMP+SMPS Board (2/4) - ...........   31
4-17.  Schematic Diagram - AMP+SMPS Board (3/4) - ...........   32
4-18.  Schematic Diagram - AMP+SMPS Board (4/4) - ...........   33
4-19.  Printed Wiring Board - AMP+SMPS Board - .................   34
5. 
EXPLODED  VIEWS
5-1.  Front Panel Section .........................................................   35
5-2. Speaker 
Section 
...............................................................  36
5-3.  Rear Case Section ...........................................................   37
5-4.  Mechanism Deck Section (VBP02) ................................   38
6. 
ELECTRICAL  PARTS  LIST
  ..............................   39
HBD-B1
4
SECTION  1
SERVICING  NOTES
NOTES  ON  HANDLING  THE OPTICAL  PICK-UP  
BLOCK  OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.
NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.
UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 
the lead free mark due to their particular size)
 : LEAD  FREE  MARK
Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 
than ordinary solder.
 
Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.
 
Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 
the heated tip is applied for too long, so be careful!
• Strong 
viscosity
 
Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.
•  Usable with ordinary solder
 
It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.
CAPACITOR  ELECTRICAL  DISCHARGE  PROCESSING
When checking the board, the electrical discharge is necessary for 
the electric shock prevention.
Connect the resistor to both ends of respective capacitors.
• AMP+SMPS 
board
 
C900, C952, C953, C962
– AMP+SMPS Board (Conductor Side) –
C962
C952
C900
C953
Connect resistor 
(about 100 
:/2 W) 
for 2 seconds.
Connect resistor 
(about 100 
:/10 W) 
for 2 seconds.
Connect resistor 
(about 100 
:/10 W) 
for 2 seconds.
Connect resistor 
(about 1 k
:/10 W) 
for 3 seconds.
NOTE  THE  PARTS  ON  THE  EACH  BOARDS  REPAIR-
ING
The mount parts on each boards installed in this set cannot ex-
change with single excluding a part of parts.
Refer to ELECTRICAL PARTS LIST (page 39) for parts that can 
be exchanged.
When the each mount parts that have not been described to ELEC-
TRICAL PARTS LIST are damaged, exchange the entire mounted 
board.
Printed wiring board and schematic diagram have been described 
to this service manual is for the reference.

Download Sony BDV-B1 Service Manual (Repair Manual)

Here you can view online and download Sony BDV-B1 Service Manual in PDF. Usually contens schematics / circuit diagrams, wiring diagrams, block diagrams, printed wiring boards, exploded views, parts list, disassembly / assembly, pcb. This Service Manual can help you recover, restore, fix, disassemble and repair Sony BDV-B1 Audio.