Read Sony AWP-ZP3 / CX-LZP3 Service Manual online
1
Ver. 1.2 2005.04
Model Name Using Similar Mechanism
NEW
CD Mechanism Type
CDM80BV-F4BD81
Base Unit Name
BU-F4BD81B
Optical Pick-up Name
KSM-215CFP
SERVICE MANUAL
AEP Model
UK Model
E Model
Australian Model
CX-LZP3
Amplifier section
AEP, UK model:
DIN power output (rated):
DIN power output (rated):
16 + 16 W
(6 ohms at 1 kHz, DIN)
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
20 + 20 W
(6 ohms at 1 kHz, 10%
THD)
(6 ohms at 1 kHz, 10%
THD)
Music power output (reference):
40 + 40 watts (6 ohms at
1 kHz, 10% THD)
1 kHz, 10% THD)
Other models:
The following measured at 110 – 120, 220 – 240 V AC,
50/60 Hz
DIN power output (rated):
The following measured at 110 – 120, 220 – 240 V AC,
50/60 Hz
DIN power output (rated):
16 + 16 W
(6 ohms at 1 kHz, DIN)
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
20 + 20 W
(6 ohms at 1 kHz, 10 %
THD)
(6 ohms at 1 kHz, 10 %
THD)
SPECIFICATIONS
Inputs
MD (RCA pin jacks):
MD (RCA pin jacks):
Sensitivity 500 mV,
impedance 47 kilohms
impedance 47 kilohms
Outputs
PHONES (stereo mini jack):
PHONES (stereo mini jack):
Accepts headphones with
an impedance of 8 ohms or
more
an impedance of 8 ohms or
more
SPEAKERS:
Accepts impedance of
6 ohms
6 ohms
CD player section
System
Compact disc and digital
audio system
audio system
Laser
Semiconductor laser
(
(
λ=780 nm)
Emission duration:
continuous
continuous
Frequency response
2 Hz – 20 kHz
Sony Corporation
Personal Audio Group
Published by Sony Engineering Corporation
9-877-756-03
2005D04-1
© 2005.04
COMPACT DISC RECEIVER
• CX-LZP3 is compact disc receiver
in AWP-ZP3.
– Continued on next page –
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CX-LZP3
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270°C during
• Keep the temperature of soldering iron around 270°C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40
• Unleaded solder melts at a temperature about 40
°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to about
350
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to about
350
°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may also
be added to ordinary solder.
be added to ordinary solder.
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range
Tuning range
87.5 – 108.0 MHz
(50-kHz step)
(50-kHz step)
Antenna
FM lead antenna
Antenna terminals
75 ohms unbalanced
Intermediate frequency 10.7 MHz
AM tuner section
Tuning range
AEP, UK model:
Tuning range
AEP, UK model:
531 – 1,602 kHz
(with the tuning interval
set at 9 kHz)
(with the tuning interval
set at 9 kHz)
Other models:
530 – 1,710 kHz
(with the tuning interval
set at 10 kHz)
531 – 1,602 kHz
(with the tuning interval
set at 9 kHz)
(with the tuning interval
set at 10 kHz)
531 – 1,602 kHz
(with the tuning interval
set at 9 kHz)
Antenna
AM loop antenna, external
antenna terminal
antenna terminal
Intermediate frequency 450 kHz
General
Power requirements
AEP, UK model:
AEP, UK model:
230 V AC, 50/60 Hz
Australian model:
230 – 240 V AC, 50/60 Hz
Korean model:
220 V AC, 60 Hz
Other models:
110 – 120, 220 – 240 V
AC, 50/60 Hz
Adjustable with voltage
selector
AC, 50/60 Hz
Adjustable with voltage
selector
Power consumption
AEP, UK, Korean model:
AEP, UK, Korean model:
40 W
0.3 W (in Power Saving
mode)
0.3 W (in Power Saving
mode)
Other models:
45 W
Dimensions (w/h/d)
Approx. 108
× 224.8 ×
327.1 mm
Mass
Approx. 4.2 kg
Design and specifications are subject to change
without notice.
without notice.
Ver. 1.1
3
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
other than those specified herein may result in hazardous
radiation exposure.
CX-LZP3
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
of emitting radiation exceeding the limit for
Class 1.
This appliance is
classified as a CLASS 1
LASER product. This
marking is located on the
rear exterior.
classified as a CLASS 1
LASER product. This
marking is located on the
rear exterior.
PLAYABLE DISCS
You can play back the following discs on this system. Other discs
cannot be played back.
You can play back the following discs on this system. Other discs
cannot be played back.
List of playable discs
Format of discs
Disc logo
Audio CDs
CD-R/CD-RW
(audio data/MP3 files)
(audio data/MP3 files)
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TABLE OF CONTENTS
CX-LZP3
1. SERVICE POSITIONS
1-1. CDM Service Position ........................................................ 5
2. GENERAL
Main Unit ................................................................................ 6
Remote Control ....................................................................... 7
Remote Control ....................................................................... 7
3. DISASSEMBLY
3-1. Case (Top) ........................................................................... 9
3-2. Front Panel Section ............................................................. 9
3-3. Rear Panel Section ............................................................ 10
3-4. Main Board ....................................................................... 10
3-5. Mechanism Deck ............................................................... 11
3-6. PT Board ........................................................................... 11
3-7. USB Board ........................................................................ 12
3-8. Chassis (Top) ..................................................................... 12
3-9. Lever (Loading R/L) ......................................................... 13
3-10. Disc Stop Lever, Disc Sensor Lever .................................. 14
3-11. Driver Board ...................................................................... 14
3-12. BD Board .......................................................................... 15
3-13. Optical Pick-up ................................................................. 15
3-14. Base Unit ........................................................................... 16
3-15. Lever (BU Lock) ............................................................... 16
3-16. Close Lever ....................................................................... 17
3-17. DIR Lever, Gear (IDL-B) .................................................. 17
3-18. Gear (IDL-C) ..................................................................... 18
3-2. Front Panel Section ............................................................. 9
3-3. Rear Panel Section ............................................................ 10
3-4. Main Board ....................................................................... 10
3-5. Mechanism Deck ............................................................... 11
3-6. PT Board ........................................................................... 11
3-7. USB Board ........................................................................ 12
3-8. Chassis (Top) ..................................................................... 12
3-9. Lever (Loading R/L) ......................................................... 13
3-10. Disc Stop Lever, Disc Sensor Lever .................................. 14
3-11. Driver Board ...................................................................... 14
3-12. BD Board .......................................................................... 15
3-13. Optical Pick-up ................................................................. 15
3-14. Base Unit ........................................................................... 16
3-15. Lever (BU Lock) ............................................................... 16
3-16. Close Lever ....................................................................... 17
3-17. DIR Lever, Gear (IDL-B) .................................................. 17
3-18. Gear (IDL-C) ..................................................................... 18
4. TEST MODE
...................................................................... 19
5. ELECTRICAL ADJUSTMENT
.................................... 20
6. DIAGRAMS
6-1. IC Pin Description ............................................................. 21
6-2. Block Diagram –CD Section– ........................................... 27
6-3. Block Diagram –Main Section– ........................................ 28
6-4. Note for Printed Wiring Boards and
6-2. Block Diagram –CD Section– ........................................... 27
6-3. Block Diagram –Main Section– ........................................ 28
6-4. Note for Printed Wiring Boards and
Schematic Diagrams .......................................................... 29
6-5. Circuit Boards Location .................................................... 29
6-6. Waveforms ......................................................................... 29
6-7. Printed Wiring Board –CD Section– ................................. 30
6-8. Schematic Diagram –CD Section– .................................... 31
6-9. Schematic Diagram –Main Section (1/2)– ........................ 32
6-10. Schematic Diagram –Main Section (2/2)– ........................ 33
6-11. Printed Wiring Boards –Main Section– ............................ 34
6-12. Printed Wiring Board –Driver Section– ............................ 35
6-13. Schematic Diagram –Driver Section– ............................... 35
6-14. Printed Wiring Board –USB (A) Section– ........................ 36
6-15. Schematic Diagram –USB (A) Section– ........................... 37
6-16. Printed Wiring Board –Front Section– .............................. 38
6-17. Schematic Diagram –Front Section– ................................ 39
6-18. Printed Wiring Board –Power Section– ............................ 40
6-19. Schematic Diagram –Power Section– ............................... 41
6-20. IC Block Diagrams ............................................................ 42
6-6. Waveforms ......................................................................... 29
6-7. Printed Wiring Board –CD Section– ................................. 30
6-8. Schematic Diagram –CD Section– .................................... 31
6-9. Schematic Diagram –Main Section (1/2)– ........................ 32
6-10. Schematic Diagram –Main Section (2/2)– ........................ 33
6-11. Printed Wiring Boards –Main Section– ............................ 34
6-12. Printed Wiring Board –Driver Section– ............................ 35
6-13. Schematic Diagram –Driver Section– ............................... 35
6-14. Printed Wiring Board –USB (A) Section– ........................ 36
6-15. Schematic Diagram –USB (A) Section– ........................... 37
6-16. Printed Wiring Board –Front Section– .............................. 38
6-17. Schematic Diagram –Front Section– ................................ 39
6-18. Printed Wiring Board –Power Section– ............................ 40
6-19. Schematic Diagram –Power Section– ............................... 41
6-20. IC Block Diagrams ............................................................ 42
7. EXPLODED VIEWS
7-1. Rear Panel Section ............................................................ 44
7-2. Front Panel Section ........................................................... 45
7-3. Main Board Section .......................................................... 46
7-4. CD Mechanism Deck (1) Section ..................................... 47
7-5. CD Mechanism Deck (2) Section ..................................... 48
7-6. CD Mechanism Deck (3) Section ..................................... 49
7-7. Base Unit Section .............................................................. 50
7-2. Front Panel Section ........................................................... 45
7-3. Main Board Section .......................................................... 46
7-4. CD Mechanism Deck (1) Section ..................................... 47
7-5. CD Mechanism Deck (2) Section ..................................... 48
7-6. CD Mechanism Deck (3) Section ..................................... 49
7-7. Base Unit Section .............................................................. 50
8. ELECTRICAL PARTS LIST
......................................... 51
