AIR-SA15TI, AIR-SA20PK - Sony Audio Service Manual (repair manual). Page 12

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AIR-SA15Ti
AIR-SA15Ti
12
12
For Schematic Diagrams.

Note:
•  All capacitors are in μF unless otherwise noted. (p: pF) 50 
WV or less are not indicated except for electrolytics and 
tantalums.
•  All resistors are in Ω and 1/4 W or less unless otherwise 
specifi ed.
•      f : 
internal 
component.
• 
C : panel designation.
THIS  NOTE  IS  COMMON  FOR  PRINTED  WIRING  BOARDS  AND  SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
• 
A : B+ Line.
• 
B : B– Line.
•  Voltages and waveforms are dc with respect to ground 
under no-signal (detuned) conditions.
  no mark : TUNER
•  Voltages are taken with VOM (Input impedance 10 M
Ω).
  Voltage variations may be noted due to normal production 
tolerances.
•  Waveforms are taken with a oscilloscope.
  Voltage variations may be noted due to normal production 
tolerances.
•  Circled numbers refer to waveforms.
• Signal path.
 
F : 
TUNER
 
f 
: iPod (AUDIO)
 
E 
: iPod (VIDEO)
• Abbreviation
 CND : 
Canadian 
model
For Printed Wiring Boards.

Note:
• 
X : Parts extracted from the component side.
• 
Y : parts extracted from the conductor side.
•      f  : internal component.
• 
 : Pattern from the side which enables seeing.
  (The other layers' patterns are not indicated.)
•  Indication of transistor.
 
C
B
These are omitted. 
E
Q
 
C E
B
These are omitted. 

Caution:
Pattern face side: 
(SIDE B)
Parts face side:
(SIDE A)
Parts on the pattern face side seen from 
the pattern face are indicated.
Parts on the parts face side seen from 
the parts face are indicated.

Note: 
The components identi-
fi
 ed by mark 
0 or dotted 
line with mark 
0 are criti-
cal for safety. 
Replace only with part 
number specifi ed.

Note: 
Les composants identifi és 
par une marque 
0 sont 
critiques pour la sécurité. 
Ne les remplacer que par 
une piéce portant le nu-
méro spécifi é.

Caution:
Pattern face side:
(Conductor Side)
Parts face side: 
(Component Side)
Parts on the pattern face side seen from 
the pattern face are indicated.
Parts on the parts face side seen from 
the parts face are indicated.
•  MAIN, TX-IF, LED, LED-L and LED-R boards are multi-layer 
printed boards.
  However, the patterns of intermediate-layers have not been 
included in diagrams.
•  Circuit Boards Location

IC401 RB (Xout)
100 mV/DIV, 100 ns/DIV
200 ns
0.3 Vp-p

IC901  (OSC)
100 mV/DIV, 2 
μs/DIV
2.7
μs
0.1 Vp-p
• Waveforms
– MAIN Board –
POWER board
MAIN board
LED-R board
LED board
TX-IF board
LED-L board
Ver. 1.1
• IC Block Diagrams
– MAIN Board –
IC301   R5523N001B-TR-F
1
EN
2
GND
3
FLG
4 IN
5 OUT
GATE
CONTROL
UVLO
THERMAL
SHUTDOWN
CURRENT
LIMIT
FLAG
DELAY
IC303   NJM2244M-TE2
2
SW1
3
VIN2
4
SW2
1
VIN1
8 GND
7 VOUT
6 V+
5 VIN3 (MUTE)
BIAS
75
Ω
DRIVER
IC305   BD33KA5WFP-E2
IC901   PT6315
THERMAL
SHUT DOWN
OVER CURRENT
PROTECT
VDD
VCC
2
GND
3
NC
5
OUT
4
CTL
1
–
+
VREF
DRIVER
5
OSC
OSC
DATA
SELECTOR
6
DOUT
7
DIN
8
CLK
9
STB
10
KEY1
11
KEY2
SERIAL
INTERFACE
DISPLAY MEMORY
24 BITS x 12 WORDS
24-BIT OUTPUT
LATCH
12-BIT SHIFT
REGISTER
SEGMENT
DRIVER
TIMING GENERATOR
KEY SCAN
COMMAND
DECODER
DIMMING
CIRCUIT
KEY DATA MEMORY
(2 x 16 BITS)
4-BIT LATCH
1
LED1
2
LED2
3
LED3
4
LED4
24
16
16
12
4
8
8
4
8
27 SEG14/KS14
29 SEG16/KS16
30 VEE
28 SEG15/KS15
8
31 SEG17/GRID12
33 SEG19/GRID10
32 SEG18/GRID11
23 SEG10/KS10
24 SEG11/KS11
25 SEG12/KS12
26 SEG13/KS13
22
SEG9/KS9
21
SEG8/KS8
20
SEG7/KS7
19
SEG6/KS6
18
SEG5/KS5
17
SEG4/KS4
16
SEG3/KS3
15
SEG2/KS2
14
SEG1/KS1
MULTIPLEXED
DRIVER
34
SEG20/GRID9
35
SEG21/GRID8
36
SEG22/GRID7
37
SEG23/GRID6
39
GRID4
40
GRID3
41
GRID2
42
GRID1
43
VDD
44
VSS
13
VDD
12
VSS
38
SEG24/GRID5
GRID
DRIVER
Display
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