Read Sharp LC-22DV200E Service Manual online
3. REMOVAL AND INSTALLATION OF
3. When IC starts moving back and forth easily after
FLAT PACKAGE IC
desoldering completely, pickup the corner of the IC using
tweezers and remove the IC by moving with the IC
tweezers and remove the IC by moving with the IC
REMOVAL
desoldering machine. (Refer to Fig. 3-3.)
1. Put Masking Tape (cotton tape) around the Flat Package
NOTE
IC to protect other parts from any damage.
(Refer to Fig. 3-1.)
(Refer to Fig. 3-1.)
Some ICs on the PCB are affixed with glue, so be
careful not to break or damage the foil of each IC
careful not to break or damage the foil of each IC
NOTE
leads or solder lands under the IC when removing it.
Masking is carried out on all the parts located within
10 mm distance from IC leads.
10 mm distance from IC leads.
DISASSEMBLY INSTRUCTIONS
Fig. 3-1
Masking Tape
(Cotton Tape)
IC
Blower type IC
desoldering machine
Tweezers
B3-1
2. Heat the IC leads using a blower type IC desoldering
machine. (Refer to Fig. 3-2.)
NOTE
Do not rotate or move the IC back and forth , until IC
4. Peel off the Masking Tape.
can move back and forth easily after desoldering the
leads completely.
leads completely.
5. Absorb the solder left on the pattern using the Braided
Shield Wire. (Refer to Fig. 3-4.)
NOTE
Do not move the Braided Shield Wire in the vertical
direction towards the IC pattern.
direction towards the IC pattern.
Blower type IC
desoldering machine
IC
Fig. 3-2
IC
Fig. 3-3
Fig. 3-4
IC pattern
Braided Shield Wire
Soldering Iron
B3-1
Click on the first or last page to see other LC-22DV200E service manuals if exist.