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1-21-2
E9B30EL
Ref. No.
Mark
Description
Part No.
Code
MAIN CBA
MAIN CBA + POWER SW CBA + FUNCTION CBA + FRONT JACK CBA +
9HS1VSA14839
BP
SENSOR CBA
Consists of the following
MAIN CBA
----------
POWER SW CBA
----------
FUNCTION CBA
----------
FRONT JACK CBA
----------
SENSOR CBA
9HS1VSA11699
AB
Ref. No.
Mark
Description
Part No.
Code
DVD MECHANISM & DVD MAIN CBA ASSEMBLY
A,C
DVD MECHANISM & DVD MAIN CBA ASSEMBLY
9HSN78SCCEN
BT
B
DVD MECHANISM & DVD MAIN CBA ASSEMBLY
9HSN78SDCBN
BT
Ref. No.
Mark
Description
Part No.
Code
MAIN CBA + POWER SW CBA + FUNCTION CBA + FRONT JACK CBA +
SENSOR CBA
SENSOR CBA
MAIN CBA
----------
Consists of the following
CAPACITORS
C251
ELECTROLYTIC CAP. 10
µ
F/16V M H7
9HSE1CMAVSL100
AB
C252
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V
9HSHD1JZ30F104
AA
C253
CHIP CERAMIC CAP.(1608) B K 1000pF/50V
9HSHD1JK30B102
AA
C254
ELECTROLYTIC CAP. 1
µ
F/50V M H7
9HSE1JMAVSL1R0
AB
C301
CHIP CERAMIC CAP.(1608) B K 0.022
µ
F/50V
9HSHD1JK30B223
AB
C302
ELECTROLYTIC CAP. 1
µ
F/50V M H7
9HSE1JMAVSL1R0
AB
C303
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V
9HSHD1JZ30F104
AA
C305
ELECTROLYTIC CAP. 1
µ
F/50V M H7
9HSE1JMAVSL1R0
AB
C306
CHIP CERAMIC CAP.(1608) B K 0.047
µ
F/50V
9HSHD1JK30B473
AA
C307
CHIP CERAMIC CAP.(1608) B K 0.022
µ
F/50V
9HSHD1JK30B223
AB
C308
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V
9HSHD1JZ30F104
AA
C311
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V
9HSHD1JZ30F104
AA
C312
ELECTROLYTIC CAP. 10
µ
F/16V M H7
9HSE1CMAVSL100
AB
C313
ELECTROLYTIC CAP. 1
µ
F/50V M H7
9HSE1JMASSL1R0
AC
C314
CHIP CERAMIC CAP.(1608) B K 0.01
µ
F/50V
9HSHD1JK30B103
AA
C315
CHIP CERAMIC CAP.(1608) B K 0.047
µ
F/50V
9HSHD1JK30B473
AA
C316
ELECTROLYTIC CAP. 1
µ
F/50V M H7
9HSE1JMAVSL1R0
AB
C317
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V
9HSHD1JZ30F104
AA
C322
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V
9HSHD1JZ30F104
AA
C324
CHIP CERAMIC CAP.(1608) B K 0.01
µ
F/50V
9HSHD1JK30B103
AA
C325
CHIP CERAMIC CAP. B K 8200pF/50V
9HSHD1JK30B822
AA
C326
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V
9HSHD1JZ30F104
AA
C328
ELECTROLYTIC CAP. 47
µ
F/6.3V M H7
9HSE0KMAVSL470
AB
C329
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V
9HSHD1JZ30F104
AA
C330
ELECTROLYTIC CAP. 100
µ
F/16V M
9HSE1CMASDL101
AC
C331
ELECTROLYTIC CAP. 220
µ
F/6.3V M
9HSE0KMASDL221
AB
C333
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V
9HSHD1JZ30F104
AA
C334
ELECTROLYTIC CAP. 1
µ
F/50V M H7
9HSE1JMAVSL1R0
AB
C335
ELECTROLYTIC CAP. 100
µ
F/6.3V H7
9HSE0KMAVSL101
AB
C336
CHIP CERAMIC CAP. CH J 220pF/50V
9HSHD1JJ3CH221
AA
C337
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V
9HSHD1JZ30F104
AA
C339
CHIP CERAMIC CAP. CH J 120pF/50V
9HSHD1JJ3CH121
AA
C340
ELECTROLYTIC CAP. 1
µ
F/50V M H7
9HSE1JMAVSL1R0
AB
C341
CHIP CERAMIC CAP.(1608) CH D 10pF/50V
9HSHD1JD3CH100
AA
C342
CHIP CERAMIC CAP.(1608) CH J 1000pF/50V
9HSHD1JJ3CH102
AA
C343
ELECTROLYTIC CAP. 10
µ
F/16V M H7
9HSE1CMAVSL100
AB
C344
ELECTROLYTIC CAP. 4.7
µ
F/25V M NP H7
9HSP1EMAVSB4R7
AB
C345
ELECTROLYTIC CAP. 0.47
µ
F/50V M H7
9HSE1JMAVSLR47
AC
C347
CHIP CERAMIC CAP.(1608) B K 0.1
µ
F/25V
9HSHD1EK30B104
AB
C349
ELECTROLYTIC CAP. 0.47
µ
F/50V M H7
9HSE1JMAVSLR47
AC
C350
CERAMIC CAP.(AX) F Z 0.1
µ
F/50V
9HSCA1JZTFZ104
AB
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