Read Sharp DV-700 (serv.man3) Service Manual online
DV-700S
DV-760S/H
DV-760S/H
11-6. IC501 IX1614GE
FLASH
Symbol
Type
Name and function
Byte selection address: When the device is in the x8 mode, the low or high order byte is
DQ
15
/A
-1
Input
selected. It is not used in the x16 mode.
(If BYTE# is high, DQ
(If BYTE# is high, DQ
15
/A
-1
input circuit does not operate.)
A
0
-A
12
Input
Word selection address: Selection of one word of 16k byte block. These addresses are
latched during data wiring operation.
latched during data wiring operation.
A
13
-A
17
Input
Block selection address: Selection of 1/32 erase block. These addresses are latched
during data writing, erasing and lock block operation.
Low order byte data input/output: Command user interface writing cycle data and command
during data writing, erasing and lock block operation.
Low order byte data input/output: Command user interface writing cycle data and command
DQ
0
-DQ
7
Input/Output
input. Various data read memory identifier and status data output Chip nonselection or output
disable: Float state
disable: Float state
DQ
8
-DQ
15
Input/Output
High order byte data input/output: The function is the same as that of low order byte data
input/output. Operative only in x16 mode. x8 mode: Float state DQ
input/output. Operative only in x16 mode. x8 mode: Float state DQ
15
/A
-1
is address.
CE#
Input
Chip enable: Device control logic, input buffer, decoder and sense amp. are activated.
Chip becomes active only when CE# is “Low”.
Reset/Power down: If RP# is set to “Low”, the control circuit is initialized when power is turned
on. Hence, the RP#pin is set to “Low”. When power is turned on or off or in case of fluctuation it
Chip becomes active only when CE# is “Low”.
Reset/Power down: If RP# is set to “Low”, the control circuit is initialized when power is turned
on. Hence, the RP#pin is set to “Low”. When power is turned on or off or in case of fluctuation it
RP#
Input
is kept at “Low” so as to protect data from noise. When RP# is in “Low” state, the device is in
deep power down state. 480 ns is required to recover from the deep power down state. If the RP#
pin becomes “Low”, the whole chip operation is interrupted and reset. After recovery the device is set
to array read state.
deep power down state. 480 ns is required to recover from the deep power down state. If the RP#
pin becomes “Low”, the whole chip operation is interrupted and reset. After recovery the device is set
to array read state.
OE#
Input
Output enable: When OE# is set to “Low”, data is output from the DQ pin. When OE# is
set to “High”, the DQ pin is set to float state.
Write enable: Command user interface, data Q register and address Q latch access is controlled.
set to “High”, the DQ pin is set to float state.
Write enable: Command user interface, data Q register and address Q latch access is controlled.
WE#
Input
In “Low” state WE# becomes active. At rise edge the address and data are fetched.
Ready/busy: The state of internal write state machine is output. In “Low” state it is indicated that the
Ready/busy: The state of internal write state machine is output. In “Low” state it is indicated that the
RY/BY#
Output
write state machine is in operation. If the write state machine waits for next operation instruction, erase
is suspended or it is in deep power down state, the RY/BY# pin is in float state.
Byte enable: When BYTE# is set to “Low”, the device is set to the x8 mode. At this time the
is suspended or it is in deep power down state, the RY/BY# pin is in float state.
Byte enable: When BYTE# is set to “Low”, the device is set to the x8 mode. At this time the
BYTE#
Input
DQ
8
-DQ
15
pin becomes float state. Address A
-1
selects high order/low order byte.
When BYTE# is “High”, the device is set to the x16 mode. The A
-1
input circuit is disabled.
Vpp
Write/erase power supply: 5.0
±
0.5V is applied during writing/erasing.
Vcc
Device power supply: 5.0
±
0.5V
GND
Ground
NC
Nonconnection
• Block Diagram
ID
Register
CSR
ESRs
DQ
8-15
DQ
0-7
OUTPUT MULTIPLEXER
Program Erase
Voltage Switch
BYTE#
CUI
WSM
16-KBYTE
Block 31
16-KBYTE
Block 30
16-KBYTE
Block 1
16-KBYTE
Block 0
CE#
OE#
WE#
RP#
RY/BY#
V
PP
V
CC
GND
Y GATING/SENSING
X-DECODER
Y-DECODER
Input
Buffer
ADDRESS
QUEUE
LATCHES
ADDRESS
COUNTER
COUNTER
A
-1.0~17
Output
Buffer
Output
Buffer
Input
Buffer
Input
Buffer
I/O Logic
DATA
QUEUE
REGISTER
Register
Data
Comparator
11-7
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