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7 HOW TO REPLACE FLAT PACKAGE IC
7.1. Preparation
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SOLDER
Sparkle Solder 115A-1, 115B-1 or Almit Solder KR-19, KR-19RMA
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Soldering iron
Recommended power consumption will be between 30 W to 40 W.
Temperature of Copper Rod 662 ± 50°F (350 ± 10°C)
(An expert may handle between 60 ~ 80 W iron, but beginner might damage foil by overheating.)
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Flux
HI115 Specific gravity 0.863
(Original flux will be replaced daily.)
7.2. Procedure
1. Temporary fix FLAT PACKAGE IC by soldering on two marked 2 pins.
*Most important matter is accurate setting of IC to the corresponding soldering foil.
2. Apply flux for all pins of FLAT PACKAGE IC.
3. Solder employing specified solder to direction of arrow, as sliding the soldering iron.
7.3. Modification Procedure of Bridge
1. Re-solder slightly on bridged portion.
2. Remove remained solder along pins employing soldering iron as shown in below figure.
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KX-TS2362RUW
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