Read Panasonic KX-TG8207UAB / KX-TG8207UAJ / KX-TG8207UAM / KX-TG8207UAW / KX-TG8208UAB / KX-TG8208UAW / KX-TGA820RUB / KX-TGA820RUJ / KX-TGA820RUM / KX-TGA820RUW / KX-TGA820UAB / KX-TGA820UAJ / KX-TGA820UAM / KX-TGA820UAW Service Manual online
ORDER NO. KM40708393CE
Telephone Equipment
KX-TG8207UAB
KX-TG8207UAJ
KX-TG8207UAM
KX-TG8207UAW
KX-TG8208UAB
KX-TG8208UAW
KX-TGA820RUB
KX-TGA820RUJ
KX-TGA820RUM
KX-TGA820RUW
KX-TGA820UAB
KX-TGA820UAJ
KX-TGA820UAM
KX-TGA820UAW
KX-TG8207UAJ
KX-TG8207UAM
KX-TG8207UAW
KX-TG8208UAB
KX-TG8208UAW
KX-TGA820RUB
KX-TGA820RUJ
KX-TGA820RUM
KX-TGA820RUW
KX-TGA820UAB
KX-TGA820UAJ
KX-TGA820UAM
KX-TGA820UAW
Digital Cordless Phone
Black Version
Ivory Version
Metic Gray Version
White Version
(for Ukraine)
Ivory Version
Metic Gray Version
White Version
(for Ukraine)
2
KX-TG8207UA/KX-TG8208UA/KX-TGA820RU/KX-TGA820UA
3
KX-TG8207UA/KX-TG8208UA/KX-TGA820RU/KX-TGA820UA
TABLE OF CONTENTS
PAGE
PAGE
1 Safety Precautions----------------------------------------------- 4
1.1. For Service Technicians --------------------------------- 4
2 Warning -------------------------------------------------------------- 4
2.1. Battery Caution--------------------------------------------- 4
2.2. About Lead Free Solder (Pbf: Pb free)--------------- 4
2.3. Discarding of P. C. Board-------------------------------- 5
2.2. About Lead Free Solder (Pbf: Pb free)--------------- 4
2.3. Discarding of P. C. Board-------------------------------- 5
3 Specifications ----------------------------------------------------- 6
4 Technical Descriptions ----------------------------------------- 7
4 Technical Descriptions ----------------------------------------- 7
4.1. Block Diagram (Base Unit) ------------------------------ 7
4.2. Circuit Operation (Base Unit) --------------------------- 8
4.3. Block Diagram (Handset)-------------------------------11
4.4. Circuit Operation (Handset)----------------------------12
4.5. Circuit Operation (Charger Unit) ----------------------13
4.6. Signal Route -----------------------------------------------14
4.2. Circuit Operation (Base Unit) --------------------------- 8
4.3. Block Diagram (Handset)-------------------------------11
4.4. Circuit Operation (Handset)----------------------------12
4.5. Circuit Operation (Charger Unit) ----------------------13
4.6. Signal Route -----------------------------------------------14
5 Location of Controls and Components ------------------15
5.1. Controls -----------------------------------------------------15
6 Installation Instructions ---------------------------------------15
6.1. Connections------------------------------------------------15
6.2. Battery-------------------------------------------------------16
6.2. Battery-------------------------------------------------------16
7 Operation Instructions-----------------------------------------17
7.1. Base Unit Settings----------------------------------------17
7.2. Handset Settings -----------------------------------------18
7.3. Registering a Handset to a Base Unit---------------19
7.4. Copying Phonebook Entries ---------------------------20
7.5. Dialling Mode (Tone/Pulse) ----------------------------20
7.6. Error Message---------------------------------------------20
7.7. Troubleshooting-------------------------------------------21
7.8. For Service Hint-------------------------------------------23
7.2. Handset Settings -----------------------------------------18
7.3. Registering a Handset to a Base Unit---------------19
7.4. Copying Phonebook Entries ---------------------------20
7.5. Dialling Mode (Tone/Pulse) ----------------------------20
7.6. Error Message---------------------------------------------20
7.7. Troubleshooting-------------------------------------------21
7.8. For Service Hint-------------------------------------------23
8 Service Mode -----------------------------------------------------24
8.1. Engineering Mode ----------------------------------------24
8.2. Copying Phonebook Items when Repairing -------28
8.3. How to Clear User Setting------------------------------30
8.2. Copying Phonebook Items when Repairing -------28
8.3. How to Clear User Setting------------------------------30
9 Troubleshooting Guide ----------------------------------------31
9.1. Troubleshooting Flowchart -----------------------------31
9.2. Troubleshooting by Symptom (Base Unit and
9.2. Troubleshooting by Symptom (Base Unit and
Charger Unit) ----------------------------------------------43
9.3. Troubleshooting by Symptom (Handset) -----------46
9.4. How to Replace the Flat Package IC----------------49
9.5. How to Replace the LLP (Leadless Leadframe
9.4. How to Replace the Flat Package IC----------------49
9.5. How to Replace the LLP (Leadless Leadframe
Package) IC------------------------------------------------51
10 Disassembly and Assembly Instructions ---------------53
10.1. Disassembly Instructions -------------------------------53
10.2. Assembly Instructions -----------------------------------57
10.2. Assembly Instructions -----------------------------------57
11 Measurements and Adjustments---------------------------58
11.1. The Setting Method of JIG (Base Unit) -------------58
11.2. Adjustment Standard (Base Unit)---------------------60
11.3. Adjustment Standard (Charger Unit)-----------------61
11.4. The Setting Method of JIG (Handset) ---------------62
11.5. Adjustment Standard (Handset) ----------------------64
11.6. Things to Do after Replacing IC or X'tal ------------65
11.7. RF Specification-------------------------------------------67
11.8. How to Check the Handset Speaker or
11.2. Adjustment Standard (Base Unit)---------------------60
11.3. Adjustment Standard (Charger Unit)-----------------61
11.4. The Setting Method of JIG (Handset) ---------------62
11.5. Adjustment Standard (Handset) ----------------------64
11.6. Things to Do after Replacing IC or X'tal ------------65
11.7. RF Specification-------------------------------------------67
11.8. How to Check the Handset Speaker or
Receiver ----------------------------------------------------68
11.9. Frequency Table (MHz) ---------------------------------68
12 Schematic Diagram ---------------------------------------------69
12.1. For Schematic Diagram---------------------------------69
12.2. Schematic Diagram (Base Unit) ----------------------70
12.3. Schematic Diagram (Handset) ------------------------72
12.2. Schematic Diagram (Base Unit) ----------------------70
12.3. Schematic Diagram (Handset) ------------------------72
12.4. Schematic Diagram (Charger Unit)------------------ 74
13 Printed Circuit Board ------------------------------------------ 75
13.1. Circuit Board (Base Unit)------------------------------- 75
13.2. Circuit Board (Handset) -------------------------------- 77
13.3. Circuit Board (Charger Unit)--------------------------- 79
13.2. Circuit Board (Handset) -------------------------------- 77
13.3. Circuit Board (Charger Unit)--------------------------- 79
14 Appendix Information of Schematic Diagram --------- 80
14.1. CPU Data (Base Unit) ---------------------------------- 80
14.2. CPU Data (Handset) ------------------------------------ 82
14.3. Terminal Guide of the ICs, Transistors and
14.2. CPU Data (Handset) ------------------------------------ 82
14.3. Terminal Guide of the ICs, Transistors and
Diodes ------------------------------------------------------ 84
15 Exploded View and Replacement Parts List ----------- 85
15.1. Cabinet and Electrical Parts (Base Unit) ----------- 85
15.2. Cabinet and Electrical Parts (Handset)------------- 86
15.3. Cabinet and Electrical Parts (Charger Unit) ------- 87
15.4. Accessories and Packing Materials ----------------- 88
15.5. Replacement Part List ---------------------------------- 91
15.2. Cabinet and Electrical Parts (Handset)------------- 86
15.3. Cabinet and Electrical Parts (Charger Unit) ------- 87
15.4. Accessories and Packing Materials ----------------- 88
15.5. Replacement Part List ---------------------------------- 91
4
KX-TG8207UA/KX-TG8208UA/KX-TGA820RU/KX-TGA820UA
1 Safety Precautions
1.1.
For Service Technicians
• Repair service shall be provided in accordance with repair technology information such as service manual so as to
prevent fires, injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the leadwire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
2. If a lead wire assembly is supplied as a repair part, the leadwire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
• ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
2 Warning
2.1.
Battery Caution
1. Danger of explosion if battery is incorrectly replaced.
2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufacture’s Instructions.
2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufacture’s Instructions.
2.2.
About Lead Free Solder (Pbf: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that con-
tains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
tains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50
°F ~ 70 °F (30 °C ~ 40 °C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700
°F ± 20 °F (370 °C ± 10 °C).
• Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100
°F (600 °C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
