KX-TG7125RUS, KX-TG7125RUT, KX-TGA711RUS, KX-TGA711RUT - Panasonic Telephone Service Manual (repair manual)

Model
KX-TG7125RUS KX-TG7125RUT KX-TGA711RUS KX-TGA711RUT
Pages
98
Size
2.37 MB
Type
PDF
Document
Service Manual
Brand
Device
Telephone / TELEPHONE EQUIPMENT
File
kx-tg7125rus-kx-tg7125rut-kx-tga711rus-kx-tga711ru.pdf
Date

View Panasonic KX-TG7125RUS / KX-TG7125RUT / KX-TGA711RUS / KX-TGA711RUT Service Manual online

ORDER NO. KM40605066CE
Telephone Equipment
KX-TG7125RUS
KX-TG7125RUT
KX-TGA711RUS
KX-TGA711RUT
Digital Cordless Answering System
Silver Version
Titanium Black Version
(for Russia)
2
KX-TG7125RUS/KX-TG7125RUT/KX-TGA711RUS/KX-TGA711RUT
3
KX-TG7125RUS/KX-TG7125RUT/KX-TGA711RUS/KX-TGA711RUT
TABLE OF CONTENTS
PAGE
PAGE
1 Safety Precaution ------------------------------------------------ 4
1.1. For Service Technicians --------------------------------- 4
2 Warning -------------------------------------------------------------- 4
2.1. Battery Caution--------------------------------------------- 4
2.2. About Lead Free Solder (Pbf: Pb free)--------------- 4
3 Specifications ----------------------------------------------------- 6
4 Technical Descriptions 
----------------------------------------- 7
4.1. Block Diagram (Base Unit) ------------------------------ 7
4.2. Circuit Operation (Base Unit)--------------------------- 8
4.3. Block Diagram (Handset)-------------------------------11
4.4. Circuit Operation (Handset)----------------------------12
4.5. Circuit Operation (Charger Unit) ----------------------13
4.6. Signal Route -----------------------------------------------14
5 Location of Controls and Components ------------------16
5.1. Controls -----------------------------------------------------16
6 Installation Instructions ---------------------------------------16
6.1. Connections------------------------------------------------16
6.2. Battery-------------------------------------------------------17
7 Operation Instructions-----------------------------------------18
7.1. Base Unit Settings----------------------------------------18
7.2. Handset Settings -----------------------------------------19
7.3. Registering a Handset to the Base Unit ------------20
7.4. For Service Hint-------------------------------------------21
8 Service Mode -----------------------------------------------------22
8.1. Engineering Mode ----------------------------------------22
9 Troubleshooting Guide ----------------------------------------34
9.1. Troubleshooting Flowchart -----------------------------34
9.2. Troubleshooting by Symptom (Base Unit and
Charger Unit) ----------------------------------------------43
9.3. Troubleshooting by Symptom (Handset) -----------47
9.4. How to Replace the Flat Package IC ----------------50
9.5. How to Replace the IC Package LLP----------------52
10 Disassembly and Assembly Instructions ---------------54
10.1. Disassembly Instructions -------------------------------54
10.2. How to Replace the Handset LCD -------------------57
11 Measurements and Adjustments---------------------------58
11.1. The Setting Method of JIG (Base Unit) -------------58
11.2. Adjustment Standard (Base Unit)---------------------60
11.3. Adjustment Standard (Charger Unit)-----------------61
11.4. The Setting Method of JIG (Handset) ---------------62
11.5. Adjustment Standard (Handset) ----------------------64
11.6. Things to Do after Replacing IC ----------------------65
11.7. RF Specification-------------------------------------------66
11.8. How to Check the Handset Speaker of
Receiver ----------------------------------------------------67
11.9. Frequency Table (MHz) ---------------------------------67
12 Schematic Diagram ---------------------------------------------69
12.1. For Schematic Diagram---------------------------------69
12.2. Schematic Diagram (Base Unit) ----------------------70
12.3. Schematic Diagram (Base Unit_Operation) -------72
12.4. Schematic Diagram (Handset) ------------------------74
12.5. Schematic Diagram (Charger Unit) ------------------76
13 Printed Circuit Board-------------------------------------------77
13.1. Circuit Board (Base Unit_MAIN) ----------------------77
13.2. Circuit Board (Base Unit_Operation) ----------------79
13.3. Circuit Board (Handset) ---------------------------------81
13.4. Circuit Board (Charger Unit) ---------------------------83
14 Appendix Information of Schematic Diagram ---------84
14.1. CPU Data (Base Unit) ---------------------------------- 84
14.2. CPU Data (Handset) ------------------------------------ 86
14.3. Terminal Guide of the ICs, Transistors and
Diodes ------------------------------------------------------ 88
15 Exploded View and Replacement Parts List ----------- 89
15.1. Cabinet and Electric Parts (Base Unit) ------------- 89
15.2. Cabinet and Electric Parts (Handset) --------------- 90
15.3. Cabinet and Electric Parts (Charger Unit) --------- 91
15.4. Accessories and Packing Materials ----------------- 92
15.5. Replacement Part List ---------------------------------- 94
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KX-TG7125RUS/KX-TG7125RUT/KX-TGA711RUS/KX-TGA711RUT
1 Safety Precaution
1.1.
For Service Technicians
ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover the plastic parts boxes with aluminum foil and ground them.
2. Ground the soldering irons.
3. Use a conductive mat on the worktable.
4. Do not touch IC or LSI pins with bare fingers.
2 Warning
2.1.
Battery Caution
1. Danger of explosion if battery is incorrectly replaced.
2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufacture’s Instructions.
2.2.
About Lead Free Solder (Pbf: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that con-
tains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50 
°F ~ 70 °F (30 °C ~ 40 °C) higher than Pb solder. Please use a soldering iron with 
temperature control and adjust it to 700 
°F ± 20 °F (370 °C ± 10 °C). 
• Exercise care while using higher temperature soldering irons.: 
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 
°F (600 °C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
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KX-TG7125RUS/KX-TG7125RUT/KX-TGA711RUS/KX-TGA711RUT
2.2.1.
Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufacturer’s
specific instructions for the melting points of their products and any precautions for using their product with other materials. 
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
2.2.2.
How to Recognize that Pb Free Solder is Used
(Example: Handset P.C.B.)
(Component View)
Note:
The location of the “PbF” mark is subject to change without notice.
PbF
C26
C39
11
0
16
17
11
32
27
26
IC1
IC3
IC4
1
80
20
21
40
61
41
60
1
4
8
5
A
Marked
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KX-TG7125RUS/KX-TG7125RUT/KX-TGA711RUS/KX-TGA711RUT
3 Specifications
Note:
• Specifications are subject to change.
Note for Service:
• Operation range: Up to 300 m outdoors, Up to 50 m indoors
• Analog telephone connection: Telephone Line
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KX-TG7125RUS/KX-TG7125RUT/KX-TGA711RUS/KX-TGA711RUT
4 Technical Descriptions
4.1.
Block Diagram (Base Unit)
Analog
Front
End
To TEL_LINE
A
B
CN1
Bridge
Rect
 D3 D3
Hook Switch
Q
4
,Q
5
Audio
Bell/Caller ID
Interface
Analog
Switch
CPU
59
54
61
52
60
56
55
BELL
HOOK
Off-Hook Line Voltage
64 ADCO
D/A
A/D
ADPCM
Codec Filter
DSP
Speech Decoding
Speech Encoding
BMC
Burst Decoding
Burst Encoding
RF
Interface
18
19
TXDA
RXDA
15
21
20
22
RSSI
SYCL
SYDA
SYEN
ANT1
ANT2
RF Module
18
16
2
31
8
21
14
13
12
12
13
XTAL
X
1
10.368
MHz
EEPROM
SCL
SDA
6
5
To AC Adaptor
CN2
Limit
Resistor
CHARGE
CONTACT
VUNREG
3.3V
Reg.
IC
1
2.5V
Reg.
Q
9
1.8V
Reg.
Q
8
3.3V
2.5V
1.8V
BBIC
IC5
FLASH
MEMORY
(TAM)
TAM Companion IC
RESET
CS
CS
10
11
12
13
14
SCK
SI
SO
9
39
40
38
36
37
62
10
11
23
12
IC9
IC8
IC7
IC10
KX-TG7125  BLOCK DIAGRAM 
(BASE UNIT)
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KX-TG7125RUS/KX-TG7125RUT/KX-TGA711RUS/KX-TGA711RUT
4.2.
Circuit Operation (Base Unit)
4.2.1.
Outline
Base Unit consists of the following ICs as shown in Block Diagram (Base Unit) (P.7).
• DECT BBIC (Base Band IC): IC7
- Handling all the audio, signal and data processing needed in a DECT base unit
- Controlling the DECT specific physical layer and radio section (Burst Module Controller section)
- ADPCM code filter for speech encoding and speech decoding (DSP section)
- Echo-cancellation and Echo-suppression (DSP section)
- Any tones (tone, sidetone, ringing tone, etc.) generation (DSP section)
- DTMF receiver (DSP section)
- Clock Generation for RF Module
- ADC, DAC, timer, and power control circuitry
- All interfaces (ex: RF module, EEPROM, LED, Analog Front End, etc.)
• RF Module: IC10
- PLL Oscillator
- Detector
- Compress/Expander
- First Mixer
- Amplifier for transmission and reception
• EEPROM: IC5
- Temporary operating parameters (for RF, etc.)
• FLASH MEMORY: IC9
- Voice Prompt (TAM) D/L Area
- ICM/OGM/MEMO Recording Area
• TAM Companion: IC8
- Voice data compression and decompression
- Speaker Amp
- LED  Driver
• Additionally,
- Power Supply Circuit (+3.3 V, +2.5 V, +1.8 V output)
- Crystal Circuit (10.368 MHz)
- Charge Circuit
- Telephone Line Interface Circuit
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KX-TG7125RUS/KX-TG7125RUT/KX-TGA711RUS/KX-TGA711RUT
4.2.2.
Power Supply Circuit
The power is supplied to the DECT BBIC, RF Module, EEPROM and Charge Contact from AC Adaptor (+6.5 V) as shown in
Fig.101. The power supply is as follows;
• DECT BBIC (IC7): 
CN2 (+6.5 V) 
→ IC1 → Q9 → IC7
CN2 (+6.5 V) 
→ IC1 → Q8 → IC7
• RF Module (IC10): 
CN2 (+6.5 V) 
→ IC1 → Q9 → IC10 (PLL)
CN2 (+6.5 V) 
→ IC1 → Q10 → IC10 (Power AMP)
• EEPROM (IC5): 
CN2 (+6.5 V) 
→ IC1 → Q9 → IC5
• FLASH MEMORY (IC9): 
CN2 (+6.5 V) 
→ IC1 → IC9
• TAM Companion (IC8): 
CN2 (+6.5 V) 
→ IC1 → Q9 → IC8
CN2 (+6.5 V) 
→ IC1 → Q8 → IC8
• Charge Contact (TP16): 
CN2 (+6.5 V) 
→ R55, R56 → TP16
<Fig.101>
4.2.3.
Telephone Line Interface
<Function>
• Bell signal detection
• Clip signal detection
• ON/OFF hook circuit
Bell & Clip (: Calling Line Identification Presentation: Caller ID) signal detection:
In the standby mode, Q3 is open to cut the DC loop current and decrease the ring load.
When ring voltage appears at the L1T (A) and L1R (B) leads (when the telephone rings), the AC ring voltage is transferred as
follows;
• A 
→ C4 → R6 → R33 → IC7 Pin 60 (CID INp) 
• B 
→ C3 → R4 → R35 → IC7 Pin 52 (CID INn)
ON/OFF hook circuit:
In the standby mode, Q3 is open, and connected as to cut the DC loop current and to cut the voice signal. The unit is conse-
quently in an on-hook condition
When IC7 detects a ring signal or press the TALK Key onto the handset, Q4 turns on and then Q3 turns on, thus providing an
off-hook condition (DC current flows through the circuit) and the following signal flow makes the loop current.
• A 
→ D3 → Q3 → Q5 → R21 → R22 → D3 → B [OFF HOOK]
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KX-TG7125RUS/KX-TG7125RUT/KX-TGA711RUS/KX-TGA711RUT
4.2.4.
Transmitter/Receiver
• Audio Circuits and DTMF tone signal circuits.
Base Unit and Handset mainly consist of RF Module and DECT BBIC. 
Base Unit and Handset transmit/receive voice signal and data signal through the antenna on carrier frequency.
Signal Path:
*Refer to Signal Route (P.14).
4.2.4.1.
Transmitter Block
The voice signal input from the TEL LINE interface goes to RF Module (IC10) through DECT BBIC (IC7) as shown in Block Dia-
gram (Base Unit) 
(P.7)
The voice signal passes through the analog part of IC7 where it is amplified and converted to a digital audio stream signal. The
burst switch controller processes this stream performing encryption and scrambling, adding the various other fields to produce
the GAP (Generic Access Profile) standard DECT frame, assigning to a time slot and channel etc.
In IC10, the carrier frequency is changing, and frequency modulated RF signal is generated and amplified, and radiated from
antenna. Handset detects the voice signal or data signal in the circuit same as the following explanation of Receiver Block.
4.2.4.2.
Receiver Block
The signal of 1900 MHz band (1881.792 MHz ~ 1897.344 MHz) which is input from antenna is input to IC10 as shown in Block
Diagram (Base Unit)
 (P.7).
In IC10, the signal of 1900 MHz band is downconverted to 864 kHz signal and demodulated, and goes to IC7 as GAP (Generic
Access Profile) standard DECT frames. It passes through the decoding section burst switch controller where it separates out the
frame information and performs de-encryption and de-scrambling as required. It then goes to the DSP section where it is turned
back into analog audio. This is amplified by the analog front end, and goes to the TEL LINE Interface.
4.2.5.
Pulse Dialing Section
During pulse dialing the hookswitch (Q3,Q4) is used to generate the pulses using the HOOK control signal, which is set high
during pulses. To force the line impedance low during the “pause” intervals between dial pulses, the PULSE_DIAL signal turns
on Q2

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