KX-TG6451CAT, KX-TGA641RUT - Panasonic Telephone Service Manual (repair manual)

Model
KX-TG6451CAT KX-TGA641RUT
Pages
94
Size
3.14 MB
Type
PDF
Document
Service Manual
Brand
Device
Telephone / DIGITAL CORDLESS PHONE
File
kx-tg6451cat-kx-tga641rut.pdf
Date

View Panasonic KX-TG6451CAT / KX-TGA641RUT Service Manual online

ORDER NO. KM40906961CE
Telephone Equipment
Model No.
KX-TG6451CAT
KX-TGA641RUT
Digital Cordless Phone
T: Titanium Black Version
(for Kazakhstan)
(for Tajikistan)
(for Uzbekistan)
(for Turkmenistan)
(for Kyrgyzstan)
2
KX-TG6451CAT/KX-TGA641RUT
3
KX-TG6451CAT/KX-TGA641RUT
TABLE OF CONTENTS
PAGE
PAGE
1 Safety Precautions----------------------------------------------- 4
1.1. For Service Technicians --------------------------------- 4
2 Warning -------------------------------------------------------------- 4
2.1. Battery Caution--------------------------------------------- 4
2.2. About Lead Free Solder (Pbf: Pb free)--------------- 4
2.3. Discarding of P. C. Board-------------------------------- 5
3 Specifications ----------------------------------------------------- 6
4 Technical Descriptions 
----------------------------------------- 7
4.1. Block Diagram (Base Unit) ------------------------------ 7
4.2. Circuit Operation (Base Unit) --------------------------- 8
4.3. Block Diagram (Cordless Handset) ------------------ 11
4.4. Circuit Operation (Cordless Handset) ---------------12
4.5. Circuit Operation (Charger Unit) ----------------------13
4.6. Signal Route -----------------------------------------------14
5 Location of Controls and Components ------------------17
6 Installation Instructions 
---------------------------------------17
7 Operating Instructions
-----------------------------------------17
7.1. For Service Hint-------------------------------------------17
8 Service Mode -----------------------------------------------------18
8.1. Engineering Mode ----------------------------------------18
8.2. Copying Phonebook Items when Repairing -------22
8.3. How to Clear User Setting------------------------------24
9 Troubleshooting Guide ----------------------------------------25
9.1. Troubleshooting Flowchart -----------------------------25
9.2. Troubleshooting by Symptom (Base Unit and
Charger Unit) ----------------------------------------------37
9.3. Troubleshooting by Symptom (Cordless
Handset) ----------------------------------------------------41
10 Disassembly and Assembly Instructions ---------------45
10.1. Disassembly Instructions -------------------------------45
10.2. Assembly Instructions -----------------------------------49
11 Measurements and Adjustments---------------------------51
11.1. Equipment Required -------------------------------------51
11.2. The Setting Method of JIG (Base Unit) -------------51
11.3. Adjustment Standard (Base Unit)---------------------53
11.4. Adjustment Standard (Charger Unit)-----------------54
11.5. The Setting Method of JIG (Cordless
Handset) ----------------------------------------------------55
11.6. Adjustment Standard (Cordless Handset)----------57
11.7. Things to Do after Replacing IC or X'tal ------------58
11.8. RF Specification-------------------------------------------60
11.9. How to Check the Cordless Handset Speaker
or Receiver -------------------------------------------------61
11.10. Frequency Table (MHz) ---------------------------------61
12 Miscellaneous ----------------------------------------------------62
12.1. How to Replace the Flat Package IC----------------62
12.2. How to Replace the Shield Case ---------------------64
12.3. How to Replace the LLP (Leadless Leadframe
Package) IC------------------------------------------------66
12.4. Terminal Guide of the ICs, Transistors and
Diodes -------------------------------------------------------68
13 Schematic Diagram ---------------------------------------------69
13.1. For Schematic Diagram---------------------------------69
13.2. Schematic Diagram (Base Unit_Main) --------------70
13.3. Schematic Diagram (Base Unit_RF Part) ----------72
13.4. Schematic Diagram (Base Unit_Operation) -------73
13.5. Schematic Diagram (Cordless Handset) -----------74
13.6. Schematic Diagram (Charger Unit) ------------------76
14 Printed Circuit Board ------------------------------------------ 77
14.1. Circuit Board (Base Unit_Main) ---------------------- 77
14.2. Circuit Board (Base Unit_Operation)---------------- 79
14.3. Circuit Board (Cordless Handset)-------------------- 81
14.4. Circuit Board (Charger Unit)--------------------------- 83
15 Exploded View and Replacement Parts List ----------- 84
15.1. Cabinet and Electrical Parts (Base Unit) ----------- 84
15.2. Cabinet and Electrical Parts (Cordless
Handset)---------------------------------------------------- 85
15.3. Cabinet and Electrical Parts (Charger Unit) ------- 86
15.4. Accessories and Packing Materials ----------------- 87
15.5. Replacement Parts List--------------------------------- 89
4
KX-TG6451CAT/KX-TGA641RUT
1 Safety Precautions
1.1.
For Service Technicians
• Repair service shall be provided in accordance with repair technology information such as service manual so as to
prevent fires, injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled. 
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced. 
3. FASTON terminals shall be plugged straight in and unplugged straight out. 
• ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
2 Warning
2.1.
Battery Caution
1. Danger of explosion if battery is incorrectly replaced.
2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufacturer's Instructions.
2.2.
About Lead Free Solder (Pbf: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that con-
tains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50 
°F ~ 70 ° F (30 °C ~ 40 °C) higher than Pb solder. Please use a soldering iron with tem-
perature control and adjust it to 700 
°F ± 20 ° F (370 °C ± 10 °C).
• Exercise care while using higher temperature soldering irons.: 
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 
°F (600 °C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
5
KX-TG6451CAT/KX-TGA641RUT
2.2.1.
Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufac-
turer’s specific instructions for the melting points of their products and any precautions for using their product with other materi-
als. 
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
2.3.
Discarding of P. C. Board
When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.
6
KX-TG6451CAT/KX-TGA641RUT
3 Specifications
Note:
• Design and specifications are subject to change without notice.
Note for Service:
• Operation range: Up to 300 m outdoors, Up to 50 m indoors, depending on the condition.
• Analog telephone connection: Telephone Line
7
KX-TG6451CAT/KX-TGA641RUT
4 Technical Descriptions
4.1.
Block Diagram (Base Unit)
T
E
L Line
D101
Q
111/Q115
RLY
T
ra
n
si
st
o
r
RLY
T
ra
n
si
st
o
r
RLY
T
ra
n
si
st
o
r
RLY
T
ra
n
si
st
o
r
-
+
~
~
-
+
~
~
Hook
 
SW
Hook
_C
T
R
L
Puls
e
Q
112/Q114
Q
131
LSRp
Side
T
one 
Ci
rcu
it
 
TP
1
0
TP
9
MI
C
h
P3_6
P2_1
Fil
te
r
-
+
~
~
-
+
~
~
Ringer
IC
CIDINp
CIDINn
R
ingi
ng
Fil
te
r
D161
IC101
IC301
IC304
IC801
RF PA
3.75V
3.5V
Q
351
1.8V
2.5V
IC303
VDD/AVD
L
D
O_
CT
RL
RF_SUPPLY
4.3V
D138
BAT
Key
 sw
itch 
Ma
tr
ix
 
P5_5-0
P1_5-2
,P2_
0
LED
LED1-4
Q
6
01-Q
604
LC
D
 M
odule
Serial
EEPRO
M
TA
M
 I
C
IC201
X
511
X
tal
(10.368Mhz)
XT
AL1
XT
AL2
IC501
Hands
et
Spea
k
e
r
Mi
c
LCD_CS,LCD_CD,L
CD_RESET
Q6
0
5
-Q6
0
7
SPI_CLK,SPI_DO
CP_
VOUT
1
3.0V
2.5V
SCL2,SDA2
EEP_
W
P
SCL2,SDA2
P5_6
SPI_DI
P5_7
SPI_CLK,SPI_DO
KEY
5-0
RO
W
4
-0
G
P
IO
 3-0
IC561
P4_7-5
BB
IC
BXT
AL
CL
K
CLK(10.2
68M
Hz
)
T
A
M
_
RESE
T
RST
2.5V
1.8V
2.5V
P3_0
PC
M
_
CLK,DI,DO,FSC
PC
M
_
CLK,DI,DO,FSC
PC
M
_
CLK,D
I,DO,FSC
VDDAVD.
VDDIO
VDD
LC
D
 bac
kl
ight
3.5V_PD
3.5V_PD
VCC
SPI2_CLK,DI,DO
,EN
SPI2_CLK,DI,DO
,EN
IC
IC301
3.5V
Q
351
2.5V
IC303
3.5V_PD
IC
IC301
3.5V
Q
351
2.5V
IC303
Q
341
3.5V_PD
PC102
Ringer
DET
Q
331
PO
W
E
R_F
AIL
INT
1
DC
6.5V
Q
162
Q
608
3.2V_PD
3.2V_PD
VDDPA
22
24
29
85
27
26
30
30,20
54,89
19
12,91
42,45,50
10
9
61
82,7
5-71
57-60
,86
45-43
65,6
4
52
63
84
67,6
8
83
56
41
81-78
17-14
RX
o
n
RX
n
RX
p
VDD-PADRV
Tx
on
PSEL
Pon
TX
n
TX
p
BPF
ANT
1
ANT
2
ANT
1
ANT
2
D
A
801
D
A
802
6
5
3
2
95
97
98
93
94
100
92
RFP0
RFP1
RF_RX
n
RF_RX
p
VDD-PADR
RF_T
X
p
RF_T
X
n
RFP4
RFP3
RFP2
RFP0n
VCC
KX-TG6451 BLOCK DIAGRAM (BASE UNIT)
8
KX-TG6451CAT/KX-TGA641RUT
4.2.
Circuit Operation (Base Unit)
4.2.1.
Outline
Base unit consists of the following ICs as shown in Block Diagram (Base Unit) (P.7).
• DECT BBIC (Base Band IC): IC501
- Handling all the audio, signal and data processing needed in a US DECT base unit
- Controlling the US DECT specific physical layer and radio section (Burst Module Controller section)
- ADPCM code filter for speech encoding and speech decoding (DSP section)
- Echo-cancellation and Echo-suppression (DSP section)
- Any tones (tone, sidetone, ringing tone, etc.) generation (DSP section)
- DTMF receiver (DSP section)
- Clock Generation for RF Module
- ADC, DAC, timer, and power control circuitry
- All interfaces (ex: RF module, EEPROM, LED, Analog Front End, etc.)
- RF Tranceiver (LNA Mixer IF Filter, Modulator/Demodulator, PLL, Vco)
• EEPROM: IC561
- Temporary operating parameters (for RF, etc.)
• FLASH MEMORY: IC541
- Voice Prompt (TAM) D/L Area
- ICM/OGM/MEMO Recording Area
• TAM Companion: IC201
- Voice data compression and decompression
- Speaker Amp
• Additionally,
- Power Supply Circuit (+4.0 V, +3.3 V, +2.5 V, +1.8 V output)
- Crystal Circuit (10.368 MHz)
- Telephone Line Interface Circuit
9
KX-TG6451CAT/KX-TGA641RUT
4.2.2.
Power Supply Circuit
The power is supplied to the BBIC,TAM Companion,Power AMP,LCD module,EEPROM,Flash Memory,LED,LCD backlight from
AC Adaptor(+6.5V) as shown in Fig 1.
When power line failure, the power is supplied to BBIC,TAM companion,EEPROM from telephone line instead of AC Adaptor
through D138 and Q341.
• BBIC (IC501) 
• TAM Companion (IC201) 
AC adaptor 
→ F301 → D301→ IC301 → D353 → IC201 (VDDPA 3.2V)
• RF Power AMP (IC801) 
AC adaptor 
→ F301 → D301→ IC304 → Q608 → IC801 (VCC)
• EEPROM (IC561) 
• Flash memory (IC541)
AC adaptor 
→ F301 → D301→ IC301 → D311 → IC501 (BAT:CP_VOUT1) → IC541 (VDD 3.0V)
• LCD module
AC adaptor 
→ F301 → D301→ IC301 → D311 → IC501 (BAT:CP_VOUT1) → CN1 → LCD module (VDD 3.0V)
• LED
AC adaptor 
→ F301 → D301→ IC301 → D311 → IC501 (BAT:CP_VOUT1) → CN1 → LED (3.0V)
• LCD backlight
AC adaptor 
→ F301 → D301 → IC301→ CN2 → LCD backlight (3.5V)
<Fig.1>
10
KX-TG6451CAT/KX-TGA641RUT
4.2.3.
Telephone Line Interface
Function
• Bell signal detection
• CLIP signal detection
• ON/OFF hook and pulse dial circuit
Bell & CLIP (Calling Line Identification Presentation: Caller ID) signal detection:
In standby mode,Q111/Q115 is open to cut the DC Loop current and decrease the ring load.
When ringing voltage appears at the TIP and RING, AC ring voltages transferred as followings;
CLIP signal detection
TIP 
→ C181 → R182 → R185 → IC501(26)(BBIC-CIDINn)
RING 
→ C191 → R192 → R195 → IC501(27)(BBIC-CIDINp)
Bell signal detection
TIP 
→ C181 → R182 → C184 → R186 → C187 → IC501(30)(BBIC-RINGING)
When power line failure (Because this case is no power to IC501)
TIP 
→ C164 → D161(2) → D161(1) →  IC101(1:5) → R167 → RINGERP
RING 
← D161(3) ← D161(4) ← Q162(c:e) ← IC101(2:8) ← RINGERM
ON/OFF hook circuit
ON hook:
Q111/Q115 is open to cut the DC loop current and voice signal, caused by the following control:
Hook switch (between hook2-4 and hook2-6) is opened and IC501(29)(Hook CTRL) is Low, (and Q114 is open), then Q112 is
OFF,so Q111/115 is OPEN
OFF hook:
Q111/Q115 is ON to make the DC loop current and be possible to transfer voice signal, caused by the following control:
Hook switch (between hook2-4 and hook2-6) make and IC501(29)(Hook CTRL) is High. (and Q114 is open), then Q112 is ON.
4.2.4.
Audio signal Flow (Out line)
The audio signal from Mic (for SP-phone and Corded Handset) is converted from Analog to digital in TAM companion IC(IC201),
then is transfered to BBIC(IC501) through PCM interface.
In BBIC(IC501), these data is converted to Analog, then send out tel line through tel line interface.
On the other hand, the audio signal from tel line is converted from Analog to digital in BBIC(IC501), then is transfered to TAM
companion IC(IC201) through PCM interface.
In TAM companion IC(IC201) ,these data is converted to Analog, then sound out from speaker.
Refer to the fig.2.
<Fig.2>
4.2.5.
RF cuircuit
BBIC(IC501) inclueds the RF transceiver circuit. (LNA,Mixer, IF filter, modulator/Demodulator,PLL, VCO etc).
This RF transceiver is interfaced  with Power-AMP(IC801) and Antenna circuit.
4.2.6.
Pulse Dialling
During pulse dialling the hookswitch (Q3, Q4) is used to generate the pulses using the HOOK control signal, which is set high
during pulses. To force the line impedance low during the “pause” intervals between dial pulses, the PULSE_DIAL signal turns
on Q2.

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