KX-TG5521RUB, KX-TGA551RUB - Panasonic Telephone Service Manual (repair manual)

Model
KX-TG5521RUB KX-TGA551RUB
Pages
88
Size
2.92 MB
Type
PDF
Document
Service Manual
Brand
Device
Telephone / DIGITAL CORDLESS ANSWERING SYSTEM
File
kx-tg5521rub-kx-tga551rub.pdf
Date

View Panasonic KX-TG5521RUB / KX-TGA551RUB Service Manual online

ORDER NO. KM41007179CE
Telephone Equipment
Model No.
KX-TG5521RUB
KX-TGA551RUB
Digital Cordless Answering System
B: Piano Black Version
(for Russia)
(Handset)
KX-TGA551RUB
KX-TG5521RUB
(Base Unit)
AOH and Cer ID Compatible
(Charger Unit)
   Model No 
Base Unit 
Handset  Charger Unit  Expandable
KX-TG5521  1 (TG5521)  1 (TGA551) 
 
Up to 6
KX-TGA551* 
 
1 (TGA551) 
1
Configuration for each model
* KX-TGA551 is also an optional accessory, which contains 
  a handset and a charger.
2
KX-TG5521RUB/KX-TGA551RUB
WARNING
This service information is designed for experienced repair technicians only and is not designed for use by the general 
public. It does not contain warnings or cautions to advise non-technical individuals of potential dangers in attempting 
to service a product. Products powered by electricity should be serviced or repaired only by experienced professional 
technicians. Any attempt to service or repair the product or products dealt with in this service information by anyone 
else could result in serious injury or death.
IMPORTANT SAFETY NOTICE
There are special components used in this equipment which are important for safety. These parts are marked by 
in the Schematic Diagrams, Circuit Board Diagrams, Exploded Views and Replacement Parts List. It is essential that 
these critical parts should be replaced with manufacturer's specified parts to prevent shock, fire or other hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT INFORMATION ABOUT LEAD FREE, (PbF), SOLDERING
If lead free solder was used in the manufacture of this product, the printed circuit boards will be marked PbF.
Standard leaded, (Pb), solder can be used as usual on boards without the PbF mark.
When this mark does appear, please read and follow the special instructions described in this manual on the 
use of PbF and how it might be permissible to use Pb solder during service and repair work.
L When you note the serial number, write down all 11 digits. The serial number may be found on the bottom of the unit. 
L The illustrations in this Service Manual may vary sllightly from the actual product.
3
KX-TG5521RUB/KX-TGA551RUB
TABLE OF CONTENTS
PAGE
PAGE
1 Safety Precautions----------------------------------------------- 4
1.1. For Service Technicians --------------------------------- 4
2 Warning -------------------------------------------------------------- 4
2.1. Battery Caution--------------------------------------------- 4
2.2. About Lead Free Solder (Pbf: Pb free)--------------- 4
2.3. Discarding of P.C. Board--------------------------------- 5
3 Specifications ----------------------------------------------------- 6
4 Technical Descriptions 
----------------------------------------- 7
4.1. Block Diagram (Base Unit) ------------------------------ 7
4.2. Circuit Operation (Base Unit)--------------------------- 8
4.3. Block Diagram (Handset)-------------------------------11
4.4. Circuit Operation (Handset)----------------------------12
4.5. Circuit Operation (Charger Unit) ----------------------13
4.6. Signal Route -----------------------------------------------14
5 Location of Controls and Components ------------------16
6 Installation Instructions 
---------------------------------------16
7 Operating Instructions
-----------------------------------------16
7.1. For Service Hint-------------------------------------------16
8 Service Mode -----------------------------------------------------17
8.1. Engineering Mode ----------------------------------------17
8.2. Copying Phonebook Items when Repairing -------21
8.3. How to Clear User Setting------------------------------23
9 Troubleshooting Guide ----------------------------------------24
9.1. Troubleshooting Flowchart -----------------------------24
9.2. Troubleshooting by Symptom (Base Unit and
Charger Unit) ----------------------------------------------36
9.3. Troubleshooting by Symptom (Handset) -----------40
10 Disassembly and Assembly Instructions ---------------44
10.1. Disassembly Instructions -------------------------------44
10.2. How to Replace the Handset LCD -------------------48
11 Measurements and Adjustments---------------------------49
11.1. Equipment Required -------------------------------------49
11.2. The Setting Method of JIG (Base Unit) -------------49
11.3. Adjustment Standard (Base Unit)---------------------51
11.4. Adjustment Standard (Charger Unit)-----------------52
11.5. The Setting Method of JIG (Handset) ---------------53
11.6. Adjustment Standard (Handset) ----------------------55
11.7. Things to Do after Replacing IC or X'tal ------------56
11.8. RF Specification-------------------------------------------58
11.9. How to Check the Handset Speaker or
Receiver ----------------------------------------------------59
11.10. Frequency Table (MHz) ---------------------------------59
12 Miscellaneous ----------------------------------------------------60
12.1. How to Replace the Flat Package IC ----------------60
12.2. How to Replace the Shield Case ---------------------62
12.3. Terminal Guide of the ICs, Transistors, Diodes
and Electrolytic Capacitors-----------------------------64
13 Schematic Diagram ---------------------------------------------65
13.1. For Schematic Diagram---------------------------------65
13.2. Schematic Diagram (Base Unit) ----------------------66
13.3. Schematic Diagram (Base Unit_Operation) -------68
13.4. Schematic Diagram (Handset) ------------------------70
13.5. Schematic Diagram (Charger Unit) ------------------72
14 Printed Circuit Board-------------------------------------------73
14.1. Circuit Board (Base Unit_Main)-----------------------73
14.2. Circuit Board (Base Unit_Operation) ----------------75
14.3. Circuit Board (Handset) ---------------------------------77
14.4. Circuit Board (Charger Unit) ---------------------------79
15 Exploded View and Replacement Parts List ----------- 80
15.1. Cabinet and Electrical Parts (Base Unit) ----------- 80
15.2. Cabinet and Electrical Parts (Handset)------------- 81
15.3. Cabinet and Electrical Parts (Charger Unit) ------- 82
15.4. Accessories------------------------------------------------ 83
15.5. Replacement Part List ---------------------------------- 84
4
KX-TG5521RUB/KX-TGA551RUB
1 Safety Precautions
1.1.
For Service Technicians
• Repair service shall be provided in accordance with repair technology information such as service manual so as to
prevent fires, injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled. 
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
• ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
2 Warning
2.1.
Battery Caution
1. Danger of explosion if battery is incorrectly replaced.
2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufacture’s Instructions.
2.2.
About Lead Free Solder (Pbf: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50 
°F ~ 70 °F (30 °C ~ 40 °C) higher than Pb solder. Please use a soldering iron with 
temperature control and adjust it to 700 
°F ± 20 °F (370 °C ± 10 °C). 
• Exercise care while using higher temperature soldering irons.: 
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 
°F (600 °C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
Component
Component 
pin
solder
Remove all of the
excess solder
(Slice View)
5
KX-TG5521RUB/KX-TGA551RUB
2.2.1.
Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufacturer’s
specific instructions for the melting points of their products and any precautions for using their product with other materials. 
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
2.3.
Discarding of P.C. Board
When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.
0.3 mm X 100 g
0.6 mm X 100 g
1.0 mm X 100 g
6
KX-TG5521RUB/KX-TGA551RUB
3 Specifications
Note:
• Design and specifications are subject to change without notice.
Note for Service:
• Operation range: Up to 300 m outdoors, Up to 50 m indoors, depending on the condition.
• Analog telephone connection: Telephone Line
 Standard:
DECT (Digital Enhanced Cordless 
Telecommunications),
GAP (Generic Access Profile)
 Number of channels:
120 Duplex Channels
 Frequency range:
1.88 GHz to 1.90 GHz
 Duplex procedure:
TDMA (Time Division Multiple Access)
 Channel spacing:
1,728 kHz
 Bit rate:
1,152 kbit/s
 Modulation:
GFSK (Gaussian Frequency Shift Keying)
 RF transmission power:
Approx. 10 m W (average power per channel) 
   Power source (AC Adaptor):
220–240 V AC, 50/60 Hz
   Power consumption
Base unit: PQLV219CEW
Base unit:
Charger: PQLV219CEW
Standby: Approx. 0.5 W
Maximum: Approx. 3.8 W
Charger:
Standby: Approx. 0.2 W
Maximum: Approx. 3.0 W
   Operating conditions:
0
°C–40 °C, 20 %–80 % relative air humidity (dry) 
   Dimensions:
Base unit:
 Approx. 127 mm x 117 mm x 50 mm
Handset: Approx. 47 mm x 25 mm x 148 mm
Charger: Approx. 72 mm x 79 mm x 52 mm
   Mass (weight):
Base unit:
 Approx. 170 
g
Handset: Approx. 115 
g
Charger: Approx. 55 
g
 Voice coding:
ADPCM 32 kbit/s
7
KX-TG5521RUB/KX-TGA551RUB
4 Technical Descriptions
4.1.
Block Diagram (Base Unit)
Analog
Front
End
To TEL_LINE
Bridge
Rect
 D3 D
3
Hook Switch
Q3 ,Q4 ,Q5Q
3
 ,
Q
4
 ,
Q
5
Audio
Bell/Caller ID
Interface
CPU
18
16
23
20
21
19
24
BELL
HOOK
Off-Hook Line Voltage
25
A/D
D/A
ADPCM
Codec Filter
DSP
Speech Encoding
Speech Decoding
BMC
Burst Encoding
Burst Decoding
RF
PLL 
5
3
77
75
9
10
EEPROM
SCL
SDA
57
58
44
To AC Adaptor
Limit
Resistor
Charge
Detector
CHARGE 
CONTACT
(Optional)
IC2IC
2
Q9Q
9
Q8Q
8
2.4V
Reg.
1.8V
Reg.
3.0 V
2.4 V
1.8 V
BBIC
IC401
IC7 
KX-TG5521 BLOCK DIAGRAM 
(BASE UNIT)
MOD/DEMOD
Charge
Pump
43
2.5V
XTAL
X1X
1
10.368
MHz
IC801
RX
n
RX
p
TX
p
TX
n
P
on
PSEL
V
DD
-PADRV
4
3
6
7
TX
on
RX
on
D801
6
72
ANT1
ANT2
9
8
ANT1
ANT2
RF PA
ANT1
ANT2
78
73
74
80
L1
L2
DCP
DCM
2
FLASH MEMORY
IC421
42
3.0V
54 
55
56 
53
TAM-CSn
SPI-DI 
SPI-DO
SPICLK
IC3IC
3
8
KX-TG5521RUB/KX-TGA551RUB
4.2.
Circuit Operation (Base Unit)
4.2.1.
Outline
Base Unit consists of the following ICs as shown in Block Diagram (Base Unit) (P.7).
• DECT BBIC (Base Band IC): IC7
- Handling all the audio, signal and data processing needed in a DECT base unit
- Controlling the DECT specific physical layer and radio section (Burst Module Controller section)
- ADPCM code filter for speech encoding and speech decoding (DSP section)
- Echo-cancellation and Echo-suppression (DSP section)
- Any tones (tone, sidetone, ringing tone, etc.) generation (DSP section)
- DTMF receiver (DSP section)
- Clock Generation for RF Module
- ADC, DAC, timer, and power control circuitry
- PLL Oscillator
- Detector 
- Compress/Expander
- First Mixer
- All interfaces (ex: RF Power Amp, EEPROM, LED, Analog Front End, etc.)
• RF Power Amp.: IC801
- Amplifier for transmission and reception
• EEPROM: IC401
- Temporary operating parameters (for RF, etc.)
• FLASH MEMORY: IC421
- Voice Prompt (TAM) D/L Area
- ICM/OGM Recording Area
• Additionally,
- Power Supply Circuit (+3.0 V, +2.4 V, +1.8 V output)
- Crystal Circuit (10.368 MHz)
- Charge Circuit
- Telephone Line Interface Circuit
9
KX-TG5521RUB/KX-TGA551RUB
4.2.2.
Power Supply Circuit
The power is supplied to the DECT BBIC, RF Module, EEPROM and Charge Contact from AC Adaptor (+6.5 V) as shown in
Fig.101. The power supply is as follows;
• DECT BBIC (IC7): 
DC Jack (+6.5 V) 
→ IC2 → IC7
DC Jack (+6.5 V) 
→ IC2 → Q9 → IC7
DC Jack (+6.5 V) 
→ IC2 → Q8 → IC7
• RF Power Amp. (IC801): 
DC Jack (+6.5 V) 
→ IC2 → IC801 (Power AMP)
• EEPROM (IC401): 
DC Jack (+6.5 V) 
→ IC2 → IC7→ IC401
• FLASH MEMORY (IC421): 
DC Jack (+6.5 V) 
→ IC2→ IC7→ IC421
• Charge Contact (TP16): 
DC Jack (+6.5 V) 
→ R56 → R55 → D22→ TP16
<Fig.101>
AC Adaptor 
DCP
IC2
Q9
IC7 
IC401
IC421
RF Power Amp. (IC801)
6.5 V 
1.8 V 
3.0 V 
2.5 V 
Q8
2.4 V 
TP16
D22
R55
R56
DC
Jack
3.0 V 
3.0 V 
DCM
1
2
3
On
DC 
S
1.8 V
Reset
(IC7_61pin)
Off
10
KX-TG5521RUB/KX-TGA551RUB
4.2.3.
Telephone Line Interface
<Function>
• Bell signal detection
• Clip signal detection
• ON/OFF hook circuit
Bell & Clip (: Calling Line Identification Presentation: Caller ID) signal detection:
In the standby mode, Q3 is open to cut the DC loop current and decrease the ring load.
When ring voltage appears at the L1T (A) and L1R (B) leads (when the telephone rings), the AC ring voltage is transferred as
follows;
• B 
→ L2 → C4 → R6 → R33 → IC7 Pin 21 (CID INp) 
• A 
→ L1 → C3 → R4 → R35 → IC7 Pin 20 (CID INn)
ON/OFF hook circuit:
In the standby mode, Q3 is open, and connected as to cut the DC loop current and to cut the voice signal. The unit is
consequently in an on-hook condition
When IC7 detects a ring signal or press the TALK Key onto the handset, Q4 turns on and then Q3 turns on, thus providing an
off-hook condition (DC current flows through the circuit) and the following signal flow makes the loop current.
• B 
→ L2 →D3 → Q3 → Q5 → R21 → R22 → D3 → L1 →A [OFF HOOK]
4.2.4.
Transmitter/Receiver
• Audio Circuits and DTMF tone signal circuits.
Base Unit and Handset mainly consist of RF Module and DECT BBIC. 
Base Unit and Handset transmit/receive voice signal and data signal through the antenna on carrier frequency.
Signal Path:
*Refer to Signal Route (P.14).
4.2.4.1.
Transmitter Block
The voice signal input from the TEL LINE interface goes to RF Power Amp. (IC801) through DECT BBIC (IC7) as shown in
Block Diagram (Base Unit) (P.7)
The voice signal passes through the analog part of IC7 where it is amplified and converted to a digital audio stream signal. The
burst switch controller processes this stream performing encryption and scrambling, adding the various other fields to produce
the GAP (Generic Access Profile) standard DECT frame, assigning to a time slot and channel etc.
In IC7, the carrier frequency is changing, and frequency modulated RF signal is generated.In IC801,RF signal is amplified, and
radiated from antenna. Handset detects the voice signal or data signal in the circuit same as the following explanation of
Receiver Block.
4.2.4.2.
Receiver Block
The signal of 1900 MHz band (1881.792 MHz ~ 1897.344 MHz) which is input from antenna is input to IC7 as shown in Block
Diagram (Base Unit)
 (P.7).
In IC7, the signal of 1900 MHz band is downconverted to 864 kHz signal and demodulated, as GAP (Generic Access Profile)
standard DECT frames. It passes through the decoding section burst switch controller where it separates out the frame
information and performs de-encryption and de-scrambling as required. It then goes to the DSP section where it is turned back
into analog audio. This is amplified by the analog front end, and goes to the TEL LINE Interface.
4.2.5.
Pulse Dialling
During pulse dialling the hookswitch (Q3, Q4) is used to generate the pulses using the HOOK control signal, which is set high
during pulses. To force the line impedance low during the “pause” intervals between dial pulses, the PULSE_DIAL signal turns
on Q2.

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