Read Panasonic KX-TG1411CAM / KX-TG1411CAT / KX-TG1412CA1 / KX-TGA141RUM / KX-TGA141RUT Service Manual online
ORDER NO. KM40906942CE
Telephone Equipment
Model No.
KX-TG1411CAM
KX-TG1411CAT
KX-TG1412CA1
KX-TGA141RUM
KX-TGA141RUT
KX-TG1411CAT
KX-TG1412CA1
KX-TGA141RUM
KX-TGA141RUT
Digital Cordless Phone
M: Metic Grey Version
T: Titanium Black Version
(for Kazakhstan)
(for Tajikistan)
(for Uzbekistan)
(for Turkmenistan)
(for Kyrgyzstan)
T: Titanium Black Version
(for Kazakhstan)
(for Tajikistan)
(for Uzbekistan)
(for Turkmenistan)
(for Kyrgyzstan)
2
KX-TG1411CAM/KX-TG1411CAT/KX-TG1412CA1/KX-TGA141RUM/KX-TGA141RUT
3
KX-TG1411CAM/KX-TG1411CAT/KX-TG1412CA1/KX-TGA141RUM/KX-TGA141RUT
TABLE OF CONTENTS
PAGE
1 Safety Precautions----------------------------------------------- 4
1.1. For Service Technicians --------------------------------- 4
2 Warning -------------------------------------------------------------- 4
2.1. Battery Caution--------------------------------------------- 4
2.2. About Lead Free Solder (PbF: Pb free)-------------- 4
2.3. Discarding of P.C. Board--------------------------------- 5
2.2. About Lead Free Solder (PbF: Pb free)-------------- 4
2.3. Discarding of P.C. Board--------------------------------- 5
3 Specifications ----------------------------------------------------- 6
4 Technical Descriptions ----------------------------------------- 7
4 Technical Descriptions ----------------------------------------- 7
4.1. Block Diagram (Base Unit) ------------------------------ 7
4.2. Circuit Operation (Base Unit) --------------------------- 8
4.3. Block Diagram (Handset)-------------------------------10
4.4. Circuit Operation (Handset)----------------------------11
4.5. Circuit Operation (Charger Unit) ----------------------11
4.6. Signal Route -----------------------------------------------12
4.2. Circuit Operation (Base Unit) --------------------------- 8
4.3. Block Diagram (Handset)-------------------------------10
4.4. Circuit Operation (Handset)----------------------------11
4.5. Circuit Operation (Charger Unit) ----------------------11
4.6. Signal Route -----------------------------------------------12
5 Location of Controls and Components ------------------13
6 Installation Instructions ---------------------------------------13
7 Operating Instructions-----------------------------------------13
6 Installation Instructions ---------------------------------------13
7 Operating Instructions-----------------------------------------13
7.1. For Service Hint-------------------------------------------13
8 Test Mode ----------------------------------------------------------14
8.1. Engineering Mode ----------------------------------------14
9 Troubleshooting Guide ----------------------------------------18
9.1. Troubleshooting Flowchart -----------------------------18
9.2. Troubleshooting by Symptom (Base Unit and
9.2. Troubleshooting by Symptom (Base Unit and
Charger Unit) ----------------------------------------------24
9.3. Troubleshooting by Symptom (Handset) -----------27
10 Disassembly and Assembly Instructions ---------------29
10.1. Disassembly Instructions -------------------------------29
10.2. How to Replace the Handset LCD -------------------32
10.2. How to Replace the Handset LCD -------------------32
11 Measurements and Adjustments---------------------------33
11.1. Equipment Required -------------------------------------33
11.2. The Setting Method of JIG (Base Unit) -------------33
11.3. Adjustment Standard (Base Unit)---------------------35
11.4. Adjustment Standard (Charger Unit)-----------------36
11.5. The Setting Method of JIG (Handset) ---------------37
11.6. Adjustment Standard (Handset) ----------------------39
11.7. Things to Do after Replacing IC ----------------------40
11.8. RF Specification-------------------------------------------41
11.9. How to Check the Handset Speaker or
11.2. The Setting Method of JIG (Base Unit) -------------33
11.3. Adjustment Standard (Base Unit)---------------------35
11.4. Adjustment Standard (Charger Unit)-----------------36
11.5. The Setting Method of JIG (Handset) ---------------37
11.6. Adjustment Standard (Handset) ----------------------39
11.7. Things to Do after Replacing IC ----------------------40
11.8. RF Specification-------------------------------------------41
11.9. How to Check the Handset Speaker or
Receiver ----------------------------------------------------42
11.10. Frequency Table (MHz) ---------------------------------42
12 Miscellaneous ----------------------------------------------------43
12.1. Terminal Guide of the ICs, Transistors and
Diodes -------------------------------------------------------43
13 Schematic Diagram ---------------------------------------------44
13.1. For Schematic Diagram---------------------------------44
13.2. Schematic Diagram (Base Unit) ----------------------46
13.3. Schematic Diagram (Handset) ------------------------47
13.4. Schematic Diagram (Charger Unit) ------------------48
13.2. Schematic Diagram (Base Unit) ----------------------46
13.3. Schematic Diagram (Handset) ------------------------47
13.4. Schematic Diagram (Charger Unit) ------------------48
14 Printed Circuit Board-------------------------------------------49
14.1. Circuit Board (Base Unit) -------------------------------49
14.2. Circuit Board (Base Unit_Career) --------------------51
14.3. Circuit Board (Handset) ---------------------------------53
14.4. Circuit Board (Handset_Career) ----------------------55
14.5. Circuit Board (Charger Unit) ---------------------------57
14.2. Circuit Board (Base Unit_Career) --------------------51
14.3. Circuit Board (Handset) ---------------------------------53
14.4. Circuit Board (Handset_Career) ----------------------55
14.5. Circuit Board (Charger Unit) ---------------------------57
15 Exploded View and Replacement Parts List -----------58
15.1. Replacement Part List-----------------------------------59
4
KX-TG1411CAM/KX-TG1411CAT/KX-TG1412CA1/KX-TGA141RUM/KX-TGA141RUT
1 Safety Precautions
1.1.
For Service Technicians
• Repair service shall be provided in accordance with repair technology information such as service manual so as to pre-
vent fires, injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
• ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
2 Warning
2.1.
Battery Caution
1. Danger of explosion if battery is incorrectly replaced.
2. Replace only with the same or equivalent type recommended by the manufacturer.
2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufacture’s Instructions.
2.2.
About Lead Free Solder (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that con-
tains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
tains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50
°F ~70°F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with temper-
ature control and adjust it to 700
°F ± 20°F (370°C ± 10°C).
• Exercise care while using higher temperature soldering irons.: Do not heat the PCB for too long time in order to prevent solder
splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100
°F (600°C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
