Read Panasonic KX-TG1107UAS / KX-TG1107UAT / KX-TG1108UAS / KX-TG1108UAT / KX-TGA110UAS / KX-TGA110UAT Service Manual online
KX-TG1107UAS
KX-TG1107UAT
KX-TG1108UAS
KX-TG1108UAT
KX-TGA110UAS
KX-TGA110UAT
KX-TG1107UAT
KX-TG1108UAS
KX-TG1108UAT
KX-TGA110UAS
KX-TGA110UAT
Digital Cordless Phone
Silver Version
Titanium Black Version
(for Ukraine)
Telephone Equipment
ORDER NO. KM40603007CE
1
ABOUT LEAD FREE SOLDER (PbF: Pb free)
4
1.1.
Suggested PbF Solder
4
1.2.
How to recognize that Pb Free solder is used
5
2
FOR SERVICE TECHNICIANS
5
3
CAUTION
5
4
OPERATING INSTRUCTIONS
6
4.1.
Battery
6
4.2.
Location of Controls
7
4.3.
Connections
8
4.4.
Guide to Settings
9
4.5.
For Service Hint
11
5
DISASSEMBLY INSTRUCTIONS
12
5.1.
Base Unit
12
5.2.
Handset
13
5.3.
Charger Unit
14
6
ASSEMBLY INSTRUCTIONS
15
6.1.
Warning When Constructing the Base Unit
15
6.2.
How to Replace the Handset LCD
16
7
TROUBLESHOOTING GUIDE
17
7.1.
Check Power
18
7.2.
Check Battery Charge
19
7.3.
Check Link
20
7.4.
Check Handset Transmission
22
7.5.
Check Handset Reception
22
7.6.
Check Caller ID
22
7.7.
Bell Reception
22
8
TROUBLESHOOTING BY SYMPTOM (BASE UNIT AND
CHARGER UNIT)
23
8.1.
Check Point (Base Unit)
23
8.2.
The Setting Method of JIG (Base Unit)
28
8.3.
Adjustment Standard (Base Unit)
30
8.4.
Check Point (Charger Unit)
32
8.5.
Adjustment Standard (Charger Unit)
32
9
TROUBLESHOOTING BY SYMPTOM (HANDSET)
33
9.1.
Check Point (Handset)
33
9.2.
The Setting Method of JIG (Handset)
36
9.3.
Adjustment Standard (Handset)
38
10 THINGS TO DO AFTER REPLACING IC
39
10.1. Base Unit
39
10.2. Handset
39
11 RF SPECIFICATION
40
11.1. Base Unit
40
11.2. Handset
40
12 HOW TO CHECK THE HANDSET SPEAKER
40
13 FREQUENCY TABLE (MHz)
41
14 BLOCK DIAGRAM (BASE UNIT)
42
15 CIRCUIT OPERATION (BASE UNIT)
43
15.1. Outline
43
15.2. Power Supply Circuit
44
15.3. Telephone Line Interface
45
15.4. Transmitter/Receiver
45
15.5. Pulse Dialling
45
16 BLOCK DIAGRAM (HANDSET)
46
17 CIRCUIT OPERATION (HANDSET)
47
17.1. Outline
47
17.2. Power Supply Circuit/Reset Circuit
47
17.3. Charge Circuit
47
17.4. Battery Low/Power Down Detector
47
18 CIRCUIT OPERATION (CHARGER UNIT)
48
18.1. Power Supply Circuit
48
19 SIGNAL ROUTE
49
20 CPU DATA (BASE UNIT)
50
20.1. IC2 (BBIC)
50
21 CPU DATA (HANDSET)
52
21.1. IC4 (BBIC)
52
22 ENGINEERING MODE
54
22.1. Base Unit
54
22.2. Handset
56
23 EEPROM LAYOUT (BASE UNIT)
58
23.1. Scope
58
23.2. Introduction
58
23.3. EEPROM Layout
58
24 EEPROM LAYOUT (HANDSET)
61
24.1. Scope
61
Note:
Because CONTENTS 4 is the extract from the Operating Instructions of this model, it is subject to change without notice. You can
download and refer to the original Operating Instructions on TSN Server for further information.
download and refer to the original Operating Instructions on TSN Server for further information.
CONTENTS
Page
Page
2
KX-TG1107UAS / KX-TG1107U AT / KX-TG1108U AS / KX-TG1108U AT / KX-TGA110UAS / KX-TGA110UAT
24.2. Introduction
61
24.3. EEPROM contents
61
25 HOW TO REPLACE THE FLAT PACKAGE IC
64
25.1. PREPARATION
64
25.2. FLAT PACKAGE IC REMOVAL PROCEDURE
64
25.3. FLAT PACKAGE IC INSTALLATION PROCEDURE
65
25.4. BRIDGE MODIFICATION PROCEDURE
65
26 CABINET AND ELECTRICAL PARTS (BASE UNIT)
66
27 CABINET AND ELECTRICAL PARTS (HANDSET)
67
28 CABINET AND ELECTRICAL PARTS (CHARGER UNIT)
68
29 ACCESSORIES AND PACKING MATERIALS
69
29.1. KX-TG1107UAS/UAT
69
29.2. KX-TG1108UAS/UAT
70
30 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
71
30.1. Base Unit
71
30.2. Handset
71
30.3. Charger Unit
71
31 REPLACEMENT PARTS LIST
72
31.1. Base Unit
72
31.2. Handset
73
31.3. Charger Unit
74
31.4. Accessories and Packing Materials
74
31.5. Fixtures and Tools
75
32 FOR SCHEMATIC DIAGRAM
77
32.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT))
77
32.2. Handset (SCHEMATIC DIAGRAM (HANDSET))
77
32.3. Charger Unit (SCHEMATIC DIAGRAM (CHARGER UNIT))
77
33 SCHEMATIC DIAGRAM (BASE UNIT)
78
34 SCHEMATIC DIAGRAM (HANDSET)
80
35 SCHEMATIC DIAGRAM (CHARGER UNIT)
82
36 CIRCUIT BOARD (BASE UNIT)
83
36.1. Component View
83
36.2. Flow Solder Side View
84
37 CIRCUIT BOARD (HANDSET)
85
37.1. Component View
85
37.2. Flow Solder Side View
86
38 CIRCUIT BOARD (CHARGER UNIT)
87
38.1. Component View
87
38.2. Flow Solder Side View
87
3
KX-TG1107UAS / KX-TG1107U AT / KX-TG1108U AS / KX-TG1108U AT / KX-TGA110UAS / KX-TGA110UAT
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
work we suggest using the same type of solder.
Caution
•
•
•
• PbF solder has a melting point that is 50°F ~70°F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C).
•
•
•
• Exercise care while using higher temperature soldering irons.: Do not heat the PCB for too long time in order to prevent
solder splash or damage to the PCB.
•
•
•
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).
•
•
•
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
1.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials. The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and
1.0 mm.
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials. The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and
1.0 mm.
4
KX-TG1107UAS / KX-TG1107U AT / KX-TG1108U AS / KX-TG1108U AT / KX-TGA110UAS / KX-TGA110UAT