Read Panasonic KX-TCD825RUS / KX-TCD825RUT / KX-TCA181RUS / KX-TCA181RUT Service Manual online
KX-TCD825RUS
KX-TCD825RUT
KX-TCA181RUS
KX-TCA181RUT
KX-TCD825RUT
KX-TCA181RUS
KX-TCA181RUT
Digital Cordless Answering System
Silver Version
Titanium Black Version
(for Russia)
Telephone Equipment
ORDER NO. KM40509870CE
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
4
1.1. Suggested PbF Solder
4
1.2. How to recognize that Pb Free solder is used
5
2 FOR SERVICE TECHNICIANS
5
3 CAUTION
5
4 OPERATING INSTRUCTIONS
6
4.1. Battery
6
4.2. Location ofControls
7
4.3. Connections
8
4.4. Guide to Settings
9
4.5. For Service Hint
11
5 DISASSEMBLY INSTRUCTIONS
12
5.1. Base Unit
12
5.2. Handset
13
5.3. Charger Unit
15
6 ASSEMBLY INSTRUCTIONS
16
6.1. Fix the LCD to the Main P.C.Board (Handset)
16
7 TROUBLESHOOTING FLOWCHART
17
7.1. Check Power
18
7.2. Check Battery Charge
19
7.3. Check Link
20
7.4. Check Handset Transmission
24
7.5. Check Handset Reception
24
7.6. Check Caller ID
24
7.7. Bell Reception
25
7.8. Check TAM Operation
25
8 TROUBLESHOOTING BY SYMPTOM (BASE UNIT AND
CHARGER UNIT)
26
8.1. Check Point (Base Unit)
26
8.2. The Setting Method ofJIG (Base Unit)
30
8.3. Adjustment Standard (Base Unit)
32
8.4. Check Point (Charger Unit)
34
8.5. Adjustment Standard (Charger Unit)
34
9 TROUBLESHOOTING BY SYMPTOM (HANDSET)
35
9.1. Check Point (Handset)
35
9.2. The Setting Method ofJIG (Handset)
39
9.3. Adjustment Standard (Handset)
41
10 THINGS TO DO AFTER REPLACING IC
42
10.1. Base Unit
42
10.2. Handset
42
11 RF SPECIFICATION
43
11.1. Base Unit
43
11.2. Handset
43
12 HOW TO CHECK THE HANDSET SPEAKER OR RECEIVER 44
13 FREQUENCY TABLE (MHz)
44
14 BLOCK DIAGRAM (BASE UNIT)
45
15 CIRCUIT OPERATION (BASE UNIT)
46
15.1. Outline
46
15.2. Power Supply Circuit
47
15.3. Telephone Line Interface
48
15.4. Transmitter/Receiver
48
15.5. Pulse Dialling
48
16 BLOCK DIAGRAM (HANDSET)
49
17 CIRCUIT OPERATION (HANDSET)
50
17.1. Outline
50
17.2. Power Supply Circuit/Reset Circuit
50
17.3. Charge Circuit
50
17.4. Battery Low/Power Down Detector
51
17.5. Speakerphone
51
18 CIRCUIT OPERATION (CHARGER UNIT)
52
18.1. Power Supply Circuit
52
19 SIGNAL ROUTE
53
20 CPU DATA (BASE UNIT)
55
20.1. IC8 (BBIC)
55
21 CPU DATA (HANDSET)
57
21.1. IC1 (BBIC)
57
22 ENGINEERING MODE
60
22.1. Base Unit
60
22.2. Handset
63
23 EEPROM LAYOUT (BASE UNIT)
65
23.1. Scope
65
23.2. Introduction
65
23.3. EEPROM Layout
65
24 FLASH LAYOUT (HANDSET)
70
Note:
Because CONTENTS 4 is the extract from the Operating Instructions of this model, it is subject to change without notice. You can
download and refer to the original Operating Instructions on TSN Server for further information.
download and refer to the original Operating Instructions on TSN Server for further information.
CONTENTS
Page
Page
2
KX-TCD825RUS / KX-TCD825R UT / KX-TCA181RUS / KX-TCA181RUT
24.1. Scope
70
24.2. Introduction
70
24.3. FLASH contents
70
25 HOW TO REPLACE THE FLAT PACKAGE IC
73
25.1. PREPARATION
73
25.2. FLAT PACKAGE IC REMOVAL PROCEDURE
73
25.3. FLAT PACKAGE IC INSTALLATION PROCEDURE
74
25.4. BRIDGE MODIFICATION PROCEDURE
74
26 CABINET AND ELECTRICAL PARTS (BASE UNIT)
75
27 CABINET AND ELECTRICAL PARTS (HANDSET)
76
28 CABINET AND ELECTRICAL PARTS (CHARGER UNIT)
77
29 ACCESSORIES AND PACKING MATERIALS
78
29.1. KX-TCD825RUS/RUT
78
29.2. KX-TCA181RUS/RUT
79
30 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
80
30.1. Base Unit
80
30.2. Handset
80
30.3. Charger Unit
81
31 REPLACEMENT PARTS LIST
82
31.1. Base Unit
82
31.2. Handset
84
31.3. Charger Unit
87
31.4. Accessories and Packing Materials
87
31.5. Fixtures and Tools
87
32 FOR SCHEMATIC DIAGRAM
89
32.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT))
89
32.2. Handset (SCHEMATIC DIAGRAM (HANDSET))
89
32.3. Charger Unit (SCHEMATIC DIAGRAM (CHARGER UNIT))
89
33 SCHEMATIC DIAGRAM (BASE UNIT)
90
34 SCHEMATIC DIAGRAM (BASE UNIT_OPERATION)
92
35 SCHEMATIC DIAGRAM (HANDSET)
94
36 SCHEMATIC DIAGRAM (HANDSET_OPERATION)
96
37 SCHEMATIC DIAGRAM (CHARGER UNIT)
97
38 CIRCUIT BOARD (BASE UNIT)
99
38.1. Component View
99
38.2. Flow Solder Side View
100
39 CIRCUIT BOARD (BASE UNIT_OPERATION)
101
39.1. Component View
101
39.2. Flow Solder Side View
102
40 CIRCUIT BOARD (HANDSET)
103
40.1. Component View
103
40.2. Flow Solder Side View
104
41 CIRCUIT BOARD (HANDSET_OPERATION)
105
41.1. Component View
105
41.2. Flow Solder Side View
106
42 CIRCUIT BOARD (CHARGER UNIT)
107
42.1. Component View
107
42.2. Flow Solder Side View
107
3
KX-TCD825RUS / KX-TCD825R UT / KX-TCA181RUS / KX-TCA181RUT
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type ofsolder although, with some precautions, standard Pb solder can also be used.
work we suggest using the same type ofsolder although, with some precautions, standard Pb solder can also be used.
Caution
•
•
•
• PbF solder has a melting point that is 50°F ~ 70°F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case ofusing high temperature soldering iron, please
be careful not to heat too long.
be careful not to heat too long.
•
•
•
• PbF solder will tend to splash ifit is heated much higher than its melting point, approximately 1100°F (600°C).
•
•
•
• Ifyou must use Pb solder on a PCB manufactured using PbF solder, remove as much ofthe original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
•
•
•
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
1.1.
Suggested PbF Solder
There are several types ofPbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
4
KX-TCD825RUS / KX-TCD825R UT / KX-TCA181RUS / KX-TCA181RUT
