Read Panasonic KX-TCD540RUM / KX-TCA154RUM / KX-TCD540RUT / KX-TCA154RUT Service Manual online
KX-TCD540RUM
KX-TCA154RUM
KX-TCD540RUT
KX-TCA154RUT
KX-TCA154RUM
KX-TCD540RUT
KX-TCA154RUT
Digital Cordless Answering System
Metic Grey Version
Titanium Black Version
(for Russia)
Telephone Equipment
ORDER NO. KM40311282C3
1
ABOUT LEAD FREE SOLDER (PbF: Pb free)
4
1.1.
Suggested PbF Solder
4
1.2.
How to recognize that Pb Free solder is used
5
2
FOR SERVICE TECHNICIANS
8
3
CAUTION
8
4
BATTERY
9
4.1.
Battery Installation
9
4.2.
Battery Charge
9
4.3.
Battery Information
10
4.4.
Replacing the Batteries
10
5
LOCATION OF CONTROLS
11
5.1.
Base Unit
11
5.2.
Cordless Handset
12
5.3.
Charger Unit
12
5.4.
Icons above SOFT KEYS
13
6
SETTINGS
14
6.1.
Connection
14
6.2.
Symbols Used for Operations
15
6.3.
Setting the Ringer Volume
17
6.4.
Settings Menu Chart
18
6.5.
PIN Code
19
6.6.
Reset the Settings
20
6.7.
Key Lock
21
6.8.
Recall Feature
21
6.9.
Dialling Pause for PBX line/long distance service users
22
6.10. Call Restriction
22
6.11. Call BAR On/Off (Call Prohibition On/Off)
23
6.12. Selecting the Display Language
24
6.13. Selecting the Dialing Mode (Tone/Pulse)
24
6.14. Automatic Route Selection
25
7
DISPLAY
26
7.1.
Display Icons
26
7.2.
Caller ID Service
27
7.3.
Before Requesting Help (Troubleshooting)
28
8
OPERATIONS
31
8.1.
Power ON/OFF
31
8.2.
Setting the Date and Time
31
8.3.
Redialling
32
8.4.
Phoneboo k
33
8.5.
Cordless Handset Registration to a Base Unit
44
8.6.
Base Unit Selection
46
9
ANSWERING SYSTEM
47
9.1.
Answering System ON/OFF
47
9.2.
Greeting Message
47
9.3.
Incoming/Memo Messages
47
9.4.
Answering System Direct Command
49
9.5.
Remote Operation from a Touch Tone Phone
50
10 DISASSEMBLY INSTRUCTIONS
51
10.1. Base Unit
51
10.2. Cordless Handset
52
10.3. Charger Unit
53
11 TROUBLESHOOTING GUIDE
54
11.1. Check Power
55
11.2. Check Battery Charge
56
11.3. Check Link
57
11.4. Check Cordless Handset Transmission
61
11.5. Check Cordless Handset Reception
61
11.6. Check Curl Cord Handset Transmission
61
11.7. Check Curl Cord Handset Reception
61
11.8. Check Caller ID
61
11.9. Bell Reception
62
11.10. Check DTMF Dial
62
11.11. Check TAM Operation
63
12 CHECK PROCEDURE (BASE UNIT)
64
12.1. Preparation
64
12.2. PC Setting
64
13 CHECK PROCEDURE (CORDLESS HANDSET)
65
13.1. Preparation
65
13.2. PC Setting
65
14 ADJUSTMENTS (BASE UNIT AND CHARGER UNIT)
66
14.1. Adjustment (Base Unit)
66
14.2. Adjustment Standard (Base Unit)
70
14.3. Adjustment (Charger Unit)
72
14.4. Adjustment Standard (Charger Unit)
72
15 ADJUSTMENTS (CORDLESS HANDSET)
73
15.1. Adjustment (Cordless Handset)
73
15.2. Adjustment Standard (Cordless Handset)
77
16 RF SPECIFICATION
78
16.1. Base Unit
78
16.2. Cordless Handset
78
CONTENTS
Page
Page
2
KX-TCD540RUM / KX-TCA154RUM / KX-TCD540RUT / KX-TCA154RUT
17 HOW TO CHECK THE CORDLESS HANDSET AND BASE UNIT
SPEAKER
78
18 HOW TO CHECK THE CORDLESS HANDSET RECEIVER
79
19 FREQUENCY TABLE (MHz)
80
20 BLOCK DIAGRAM (BASE UNIT)
81
21 CIRCUIT OPERATION (BASE UNIT)
82
21.1. Outline
82
21.2. Power Supply Circuit
83
21.3. Telephone Line Interface
84
21.4. Transmitter/Receiver
84
21.5. Pulse Dialing
84
22 BLOCK DIAGRAM (CORDLESS HANDSET)
85
23 CIRCUIT OPERATION (CORDLESS HANDSET)
86
23.1. Outline
86
23.2. Power Supply Circuit/Reset Circuit
86
23.3. Charge Circuit
86
23.4. Battery Low/Powe r Down Detector
86
23.5. Speakerphone and Headset Jack
86
24 CIRCUIT OPERATION (CHARGER UNIT)
87
24.1. Power Supply Circuit
87
25 SIGNAL ROUTE
88
26 CPU DATA (BASE UNIT)
90
26.1. IC2 (BBIC)
90
27 CPU DATA (CORDLESS HANDSET)
92
27.1. IC1 (BBIC)
92
28 EEPROM LAYOUT (BASE UNIT)
94
28.1. Scope
94
28.2. Introduction
94
28.3. EEPROM Layout
94
29 EEPROM LAYOUT (CORDLESS HANDSET)
99
29.1. Scope
99
29.2. Introduction
99
29.3. EEPROM contents
99
30 HOW TO REPLACE FLAT PACKAGE IC
101
30.1. Preparation
101
30.2. Procedure
101
30.3. Modification Procedure of Bridge
101
31 CABINET AND ELECTRICAL PARTS LOCATION (BASE UNIT)
102
32 CABINET AND ELECTRICAL PARTS LOCATION (CORDLESS
HANDSET)
103
33 CABINET AND ELECTRICAL PARTS LOCATION (CHARGER
UNIT)
104
34 ACCESSORIES AND PACKING MATERIALS
105
34.1. KX-TCD540RUM/RUT
105
34.2. KX-TCA154RUM/RUT
106
35 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
107
35.1. Base Unit
107
35.2. Cordless Handset
107
35.3. Charger Unit
107
36 REPLACEMENT PARTS LIST
108
36.1. Base Unit
108
36.2. Cordless Handset
111
36.3. Charger Unit
113
36.4. Accessories and Packing Materials
113
36.5. Fixtures and Tools
113
37 FOR SCHEMATIC DIAGRAM
114
37.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT))
114
37.2. Cordless Handset (SCHEMATIC DIAGRAM (CORDLESS
HANDSET))
114
37.3. Memo
115
38 SCHEMATIC DIAGRAM (BASE UNIT)
116
38.1. Main
116
38.2. Operation
118
38.3. Memo
119
39 SCHEMATIC DIAGRAM (CORDLESS HANDSET)
120
40 SCHEMATIC DIAGRAM (CHARGER UNIT)
122
41 CIRCUIT BOARD (BASE UNIT)
123
41.1. Main
123
41.2. Operation
125
42 CIRCUIT BOARD (CORDLESS HANDSET)
127
42.1. Component View
127
42.2. Flow Solder Side View
128
43 CIRCUIT BOARD (CHARGER UNIT)
129
43.1. Component View
129
43.2. Flow Solder Side View
129
3
KX-TCD540RUM / KX-TCA154RUM / KX-TCD540RUT / KX-TCA154RUT
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
•
•
•
•
PbF solder has a melting point that is 50°F ~70°F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
•
•
•
•
PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).
•
•
•
•
If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
and be sure that any remaining is melted prior to applying the Pb solder.
•
•
•
•
When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
opposite side (See the figure below).
1.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufac
turer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
4
KX-TCD540RUM / KX-TCA154RUM / KX-TCD540RUT / KX-TCA154RUT