Read Panasonic KX-TCD465UA / KX-TCD467UA / KX-A146UA Service Manual online
KX-TCD465UA
KX-TCD467UA
KX-A146UA
KX-TCD467UA
KX-A146UA
Digital Cordless Answering System
UAF - Metic Blue Version
UAS - New Silver Version
UAT - Titanium Black Version
(for Ukraine)
Telephone Equipment
ORDER NO. KM40405443C3
1
ABOUT LEAD FREE SOLDER (PbF: Pb free)
4
1.1.
Suggested PbF Solder
4
1.2.
How to recognize that Pb Free solder is used
5
2
FOR SERVICE TECHNICIANS
7
3
CAUTION
7
4
BATTERY
8
4.1.
Battery Installation
8
4.2.
Battery Charge
8
4.3.
Battery Life
9
4.4.
Replacing the Batteries
9
5
LOCATION OF CONTROLS
10
5.1.
Base Unit
10
5.2.
Handset
10
6
SETTINGS
11
6.1.
Connections
11
6.2.
Ringer Volume
12
6.3.
PIN Code
13
6.4.
Reset
14
6.5.
Key Lock
15
6.6.
R button to use the recall feature
15
6.7.
Pause button for PBX (line/long distance service users)
15
6.8.
Setting Call Restriction
16
6.9.
Cancelling a Restricted Number
16
6.10. Setting Call BAR
16
6.11. Selecting the Display Language
17
6.12. Setting Dialling Mode (Tone/Pulse)
17
6.13. Setting Flash Time
17
6.14. Automatic Route Selection
17
7
DISPLAY
20
7.1.
Handset Display
20
7.2.
Caller ID Display
20
7.3.
Before Requesting Help (Troubleshooting)
21
8
OPERATIONS
23
8.1.
Turning the Power On/Off
23
8.2.
Setting the Time and Date
23
8.3.
Redialling
23
8.4.
Phonebook
24
8.5.
Hot Key (Quick Dial)
25
8.6.
Registering a Handset to a Base Unit
26
8.7.
Selecting a Base Unit
27
8.8.
Answering System
28
9
DISASSEMBLY INSTRUCTIONS
31
9.1.
Base Unit
31
9.2.
Handset
32
9.3.
Charger Unit
33
10 ASSEMBLY INSTRUCTIONS
34
10.1. Warning When Constructing the Base Unit
34
10.2. Processing of Ringer/Charge Terminal Lead
35
11 TROUBLESHOOTING GUIDE
36
11.1. Check Power
37
11.2. Check Battery Charge
38
11.3. Check Link
39
11.4. Check Handset Transmission
41
11.5. Check Handset Reception
41
11.6. Check Caller ID
41
11.7. TAM Voice Prompt Problems
42
11.8. Bell Reception
43
12 CHECK PROCEDURE (BASE UNIT)
44
12.1. Preparation
44
12.2. PC Setting
44
12.3. TAM Voice Prompt Download
45
13 CHECK PROCEDURE (HANDSET)
46
13.1. Preparation
46
13.2. PC Setting
46
14 ADJUSTMENTS (BASE UNIT AND CHARGER UNIT)
47
14.1. Adjustment (Base Unit)
47
14.2. Adjustment Standard (Base Unit)
50
14.3. Adjustment (Charger Unit)
52
14.4. Adjustment Standard (Charger Unit)
52
15 ADJUSTMENTS (HANDSET)
53
15.1. Adjustment (Handset)
53
15.2. Adjustment Standard (Handset)
56
Note:
Because CONTENTS 5 to 8 are the extracts from the Operating Instructions of this model, they are subject to change without
notice. Please refer to the original Operating Instructions for further information.
notice. Please refer to the original Operating Instructions for further information.
CONTENTS
Page
Page
2
KX-TCD465UA / KX-TCD467U A / KX-A146UA
16 RF SPECIFICATION
57
16.1. Base Unit
57
16.2. Handset
57
17 HOW TO CHECK THE HANDSET SPEAKER OR RECEIVER 57
18 FREQUENCY TABLE (MHz)
58
19 BLOCK DIAGRAM (BASE UNIT)
59
20 CIRCUIT OPERATION (BASE UNIT)
60
20.1. Outline
60
20.2. Power Supply Circuit
61
20.3. Telephone Line Interface
62
20.4. Transmitter/Receiver
62
20.5. Pulse Dialing
62
21 BLOCK DIAGRAM (HANDSET)
63
22 CIRCUIT OPERATION (HANDSET)
64
22.1. Outline
64
22.2. Power Supply Circuit/Reset Circuit
64
22.3. Charge Circuit
64
22.4. Battery Low/Power Down Detector
64
22.5. Speakerphone
64
23 CIRCUIT OPERATION (CHARGER UNIT)
65
23.1. Power Supply Circuit
65
24 SIGNAL ROUTE
66
25 CPU DATA (BASE UNIT)
67
25.1. IC2 (BBIC)
67
26 CPU DATA (HANDSET)
70
26.1. IC1 (BBIC)
70
27 EEPROM LAYOUT (BASE UNIT)
72
27.1. Scope
72
27.2. Introduction
72
27.3. EEPROM Layout
72
28 EEPROM LAYOUT (HANDSET)
76
28.1. Scope
76
28.2. Introduction
76
28.3. EEPROM contents
76
29 HOW TO REPLACE FLAT PACKAGE IC
79
29.1. Preparation
79
29.2. Procedure
79
29.3. Modification Procedure of Bridge
79
30 CABINET AND ELECTRICAL PARTS LOCATION (BASE UNIT)
80
31 CABINET AND ELECTRICAL PARTS LOCATION (HANDSET) 81
32 CABINET AND ELECTRICAL PARTS LOCATION (CHARGER
UNIT)
82
33 ACCESSORIES AND PACKING MATERIALS
83
33.1. KX-TCD465UAF/UAS/UAT
83
33.2. KX-TCD467UAF/UAS/UAT
84
33.3. KX-A146UAF/UAS/UAT
85
34 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
86
34.1. Base Unit
86
34.2. Handset
86
34.3. Charger Unit
86
35 REPLACEMENT PARTS LIST
87
35.1. Base Unit
87
35.2. Handset
89
35.3. Charger Unit
90
35.4. Accessories and Packing Materials
90
35.5. Fixtures and Tools
91
35.6. Memo
92
36 FOR SCHEMATIC DIAGRAM
93
36.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT))
93
36.2. Handset (SCHEMATIC DIAGRAM (HANDSET))
93
36.3. Charger Unit (SCHEMATIC DIAGRAM (CHARGER UNIT))
93
37 SCHEMATIC DIAGRAM (BASE UNIT)
94
38 SCHEMATIC DIAGRAM (HANDSET)
96
39 SCHEMATIC DIAGRAM (CHARGER UNIT)
98
40 CIRCUIT BOARD (BASE UNIT)
99
40.1. Component View
99
40.2. Flow Solder Side View
100
41 CIRCUIT BOARD (HANDSET)
101
41.1. Component View
101
41.2. Flow Solder Side View
102
42 CIRCUIT BOARD (CHARGER UNIT)
103
42.1. Component View
103
42.2. Flow Solder Side View
103
3
KX-TCD465UA / KX-TCD467U A / KX-A146UA
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
·
PbF solder has a melting point that is 50 °F ~70°F (30 °C ~ 40 °C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700 °F ± 20 °F (370 °C ± 10 °C). In case of using high temperature soldering iron, please
be careful not to heat too long.
temperature control and adjust it to 700 °F ± 20 °F (370 °C ± 10 °C). In case of using high temperature soldering iron, please
be careful not to heat too long.
·
PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 °F (600 °C).
·
If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
and be sure that any remaining is melted prior to applying the Pb solder.
·
When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
opposite side (See the figure below).
1.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
4
KX-TCD465UA / KX-TCD467U A / KX-A146UA
