Read Panasonic KX-TCD435RU / KX-TCD437RU / KX-A143RU Service Manual online
KX-TCD435RU
KX-TCD437RU
KX-A143RU
KX-TCD437RU
KX-A143RU
Digital Cordless Phone
RUB - Black Version
RUC - Dark Blue Version
RUW - White Version
(for Russia)
Telephone Equipment
ORDER NO. KM40403361C3
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
4
1.1. Suggested PbF Solder
4
1.2. How to recognize that Pb Free solder is used
5
2 FOR SERVICE TECHNICIANS
7
3 CAUTION
7
4 BATTERY
8
4.1. Battery Installation
8
4.2. Battery Charge
8
4.3. Battery Life
9
4.4. Battery Replacement
9
5 LOCATION OF CONTROLS
10
5.1. Base Unit
10
5.2. Handset
10
6 SETTINGS
11
6.1. Connection
11
6.2. Ringer Volume
12
6.3. PIN Code
13
6.4. Reset
14
6.5. Key Lock
15
6.6. R button to use the recall feature
15
6.7. Pause button for PBX line/long distance service users
15
6.8. Setting Call Restriction
16
6.9. Cancelling a Restricted Number
16
6.10. Setting Call BAR
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6.11. Selecting the Display Language
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6.12. Setting Flash time
17
6.13. Automatic Route Selection
18
7 DISPLAY
20
7.1. Handset Display
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7.2. Caller ID Service
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7.3. Before Requesting Help (Troubleshooting)
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8 OPERATIONS
23
8.1. Turning the Power On/Off
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8.2. Setting the Time and Date
23
8.3. Redialling
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8.4. Phonebook
24
8.5. Registering a Handset to a Base Unit
26
8.6. Selecting a Base Unit
27
9 DISASSEMBLY INSTRUCTIONS
28
9.1. Base Unit
28
9.2. Handset
29
9.3. Charger Unit
30
10 ASSEMBLY INSTRUCTIONS
31
10.1. Warning When Constructing the Base Unit
31
10.2. Processing of Ringer/Charge Terminal Lead
32
11 TROUBLESHOOTING GUIDE
33
11.1. Check Power
34
11.2. Check Battery Charge
35
11.3. Check Link
36
11.4. Check Handset Transmission
38
11.5. Check Handset Reception
38
11.6. Check Caller ID
38
11.7. Bell Reception
39
12 CHECK PROCEDURE (BASE UNIT)
40
12.1. Preparation
40
12.2. PC Setting
40
13 CHECK PROCEDURE (HANDSET)
41
13.1. Preparation
41
13.2. PC Setting
41
14 ADJUSTMENTS (BASE UNIT AND CHARGER UNIT)
42
14.1. Adjustment (Base Unit)
42
14.2. Adjustment Standard (Base Unit)
46
14.3. Adjustment (Charger Unit)
48
14.4. Adjustment Standard (Charger Unit)
48
15 ADJUSTMENTS (HANDSET)
49
15.1. Adjustment (Handset)
49
15.2. Adjustment Standard (Handset)
52
16 RF SPECIFICATION
53
16.1. Base Unit
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16.2. Handset
53
17 HOW TO CHECK THE HANDSET SPEAKER
53
18 FREQUENCY TABLE (MHz)
54
Note:
Because CONTENTS 4 to 8 are the extracts from the Operating Instructions of this model, they are subject to change without
notice. Please refer to the original Operating Instructions for further information.
notice. Please refer to the original Operating Instructions for further information.
CONTENTS
Page
Page
2
KX-TCD435RU / KX-TCD437R U / KX-A143RU
19 BLOCK DIAGRAM (BASE UNIT)
55
20 CIRCUIT OPERATION (BASE UNIT)
56
20.1. Outline
56
20.2. Power Supply Circuit
57
20.3. Telephone Line Interface
58
20.4. Transmitter/Receiver
59
20.5. Pulse Dialing Section
59
21 BLOCK DIAGRAM (HANDSET)
60
22 CIRCUIT OPERATION (HANDSET)
61
22.1. Outline
61
22.2. Power Supply Circuit/Reset Circuit
61
22.3. Charge Circuit
61
22.4. Battery Low/Power Down Detector
61
23 CIRCUIT OPERATION (CHARGER UNIT)
62
23.1. Power Supply Circuit
62
24 SIGNAL ROUTE
63
25 CPU DATA (BASE UNIT)
64
25.1. IC2 (BBIC)
64
26 CPU DATA (HANDSET)
66
26.1. IC1 (BBIC)
66
27 EEPROM LAYOUT (BASE UNIT)
68
27.1. Scope
68
27.2. Introduction
68
27.3. EEPROM Layout
68
28 EEPROM LAYOUT (HANDSET)
71
28.1. Scope
71
28.2. Introduction
71
28.3. EEPROM contents
71
29 HOW TO REPLACE FLAT PACKAGE IC
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29.1. Preparation
74
29.2. Procedure
74
29.3. Modification Procedure of Bridge
74
30 CABINET AND ELECTRICAL PARTS LOCATION (BASE UNIT)
75
31 CABINET AND ELECTRICAL PARTS LOCATION (HANDSET)76
32 CABINET AND ELECTRICAL PARTS LOCATION (CHARGER
UNIT)
77
33 ACCESSORIES AND PACKING MATERIALS
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33.1. KX-TCD435RUB/RUC/RUW
78
33.2. KX-TCD437RUB/RUC/RUW
79
33.3. KX-A143RUB/RUC/RUW
80
34 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
81
34.1. Base Unit
81
34.2. Handset
81
34.3. Charger Unit
81
35 REPLACEMENT PARTS LIST
82
35.1. Base Unit
82
35.2. Handset
83
35.3. Charger Unit
84
35.4. Accessories and Packing Materials
85
35.5. Fixtures and Tools
85
36 FOR SCHEMATIC DIAGRAM
87
36.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT))
87
36.2. Handset (SCHEMATIC DIAGRAM (HANDSET))
87
36.3. Charger Unit (SCHEMATIC DIAGRAM (CHARGER UNIT))
87
37 SCHEMATIC DIAGRAM (BASE UNIT)
88
38 SCHEMATIC DIAGRAM (HANDSET)
90
39 SCHEMATIC DIAGRAM (CHARGER UNIT)
92
40 CIRCUIT BOARD (BASE UNIT)
93
40.1. Component View
93
40.2. Flow Solder Side View
94
41 CIRCUIT BOARD (HANDSET)
95
41.1. Component View
95
41.2. Flow Solder Side View
96
42 CIRCUIT BOARD (CHARGER UNIT)
97
42.1. Component View
97
42.2. Flow Solder Side View
97
3
KX-TCD435RU / KX-TCD437R U / KX-A143RU
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
•
•
•
•
PbF solder has a melting point that is 50°F ~70°F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
•
•
•
•
PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).
•
•
•
•
If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
and be sure that any remaining is melted prior to applying the Pb solder.
•
•
•
•
When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
opposite side (See the figure below).
1.1.
Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufac
turer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufac
turer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
4
KX-TCD435RU / KX-TCD437R U / KX-A143RU
