Read Panasonic KX-TC1215RUB Service Manual online
KX-TC1215RUB
Cordless Phone
Black Version
(for Russia)
Telephone Equipment
53ORDER NO. KM40211998C3
1
ABOUT LEAD FREE SOLDER (PbF: Pb free)
4
1.1.
Suggested PbF Solder
4
1.2.
How to recognize that Pb Free solder is used (at KX-
TC1215RUB)
5
2
BATTERY
6
2.1.
Battery Charge
6
2.2.
Battery Strength
6
2.3.
Recharge
6
2.4.
Battery Information
7
2.5.
Battery Replacement
7
3
LOCATION OF CONTROLS
8
3.1.
Base Unit
8
3.2.
Handset
9
4
SETTINGS
10
4.1.
Connections
10
4.2.
Adding Another Phone
11
4.3.
Dialing Mode
11
5
DISPLAY
12
6
OPERATIONS
13
6.1.
Making Calls
13
6.2.
Answering Calls
15
6.3.
Flash Button
16
6.4.
Directory
17
7
DISASSEMBLY INSTRUCUTIONS
22
8
ASSEMBLY INSTRUCTION
24
9
TROUBLESHOOTING GUIDE
25
9.1.
Check Power
26
9.2.
Check Battery Charge
27
9.3.
Check Link
28
9.4.
Check Handset Transmission
30
9.5.
Check Handset Reception
30
9.6.
Bell Reception
31
10 ADJUSTMENTS (BASE UNIT)
32
10.1. Test Mode Flow Chart (Base Unit)
32
10.2. How to Change the Chnannel
33
10.3. Adjustment
33
10.4. Adjustment Standard (Base Unit)
34
11 ADJUSTMENTS (HANDSET)
35
11.1. Test Mode Flow Chart (Handset)
35
11.2. How to Change the Channel
36
11.3. Adjustment
36
11.4. Adjustment Standard (Handset)
37
12 RF SPECIFICATION
38
12.1. Base Unit
38
12.2. Handset
38
13 HOW TO CHECK THE HANDSET SPEAKER
38
14 FREQUENCY TABLE (MHz)
39
15 EXPLANATION OF CPU DATA COMMUNICATION
40
15.1. STAND-BY -> TALK, TALK -> STAND-BY
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15.2. Ringing
41
CONTENTS
Page
Page
2
KX-TC1215RUB
15.3. Changing the channel
42
15.4. Ports for transmitting and receiving of data
43
15.5. Waveform of DATA used for cordless transmission and
reception
43
16 BLOCK DIAGRAM (BASE UNIT)
44
17 CIRCUIT OPERATION
45
17.1. Outline
45
17.2. Power Supply Circuit
45
17.3. Reset Circuit
46
17.4. Charge Circuit
47
17.5. Telephone Line Interface
48
17.6. Transmitter/Receiver
49
17.7. CPU Operation
50
18 BLOCK DIAGRAM (HANDSET)
51
19 CIRCUIT OPERATION (HANDSET)
52
19.1. Outline
52
19.2. Reset Circuit/Charge Circuit
52
19.3. Battery Low/Power Down Detector
53
20 SIGNAL ROUTE
54
21 CPU(DSP) DATA (BASE UNIT)
55
21.1. IC601
55
22 CPU(DSP) DATA (HANDSET)
56
22.1. IC601
56
23 EXPLANATION OF IC TERMINALS
57
23.1. Handset: IC801
57
24 HOW TO REPLACE FLAT PACKAGE IC
58
24.1. Preparation
58
24.2. Procedure
58
24.3. Modification Procedure of Bridge
58
25 CABINET AND ELECTRICAL PARTS LOCATION (BASE UNIT)
59
26 CABINET AND ELECTRICAL PARTS LOCATION (HANDSET) 60
27 ACCESSORIES AND PACKING MATERIALS
61
28 TERMINAL GUIDE OF THE ICs TRANSISTORS AND DIODES
62
28.1. Base Unit
62
28.2. Handset
62
29 REPLACEMENT PARTS LIST
63
29.1. Base Unit
63
29.2. Handset
65
29.3. ACCESSORIES AND PACKING MATERIALS
66
30 FOR SCHEMATIC DIAGRAM
68
30.1. Base Unit
68
30.2. Handset
68
31 VOLTAGE CHECK
69
31.1. Base unit
69
31.2. Handset
71
32 MEMO
73
33 SCHEMATIC DIAGRAM (BASE UNIT)
74
34 SCHEMATIC DIAGRAM (HANDSET)
76
35 CIRCUIT BOARD (BASE UNIT)
78
35.1. Component View
78
35.2. Flow Solder Side View
79
36 CIRCUIT BOARD (HANDSET)
80
36.1. Component View
80
36.2. Flow Solder Side View
81
3
KX-TC1215RUB
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
contains lead.
We will use PbF when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn), Silver,
(Ag), and Copper, (Cu).
(Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
·
PbF solder has a melting point that is 50° ~ 70° F, (30° ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 70 ± 20C°F (370 ± 10C°). In case of using high temperature soldering iron, please be
careful not to heat too long.
temperature control and adjust it to 70 ± 20C°F (370 ± 10C°). In case of using high temperature soldering iron, please be
careful not to heat too long.
·
PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F, (600°C).
·
If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
and be sure that any remaining is melted prior to applying the Pb solder.
·
When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See figure, below).
opposite side (See figure, below).
1.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac
turer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
4
KX-TC1215RUB
