KX-UDT111RU (serv.man3) - Panasonic PBX Service Manual (repair manual). Page 43

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• PbF (: Pb free) Solder
• Soldering Iron

Tip Temperature of 700 

°F ± 20 °F (370 °C ± 10 °C)

Note:
We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less 
experience could overheat and damage the PCB foil.

• Hot Air Desoldering Tool

Temperature: 608 

°F ± 68 °F (320 °C ± 20 °C)

• To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package.
• Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.

1. Heat the IC with a hot air desoldering tool through the

P.C.Board.

2. Pick up the IC with tweezers, etc. when the solder is

melted completely.
Note:

• Be careful not to touch the peripheral parts with twee-

zers, etc. They are unstable. 

When it is hard to melt the solder completely, heat it with
a hot air desoldering tool through the IC besides through
the P.C.Board.

3. After removing the IC, clean the P.C.Board of residual sol-

der.

1. Place the solder a little on the land where the radiation

GND pad on IC bottom is to be attached.

2. Place the solder a little on the land where IC pins are to

be attached, then place the IC.
Note:

• When placing the IC, the positioning should be done very

carefully.

3. Heat the IC with a hot air desoldering tool through the

P.C.Board until the solder on IC bottom is melted.
Note:

• Be sure to place it precisely, controlling the air volume of

the hot air desoldering tool.

4. After soldering, confirm there are no short and open cir-

cuits with visual inspection.