KX-UDS124CE - Panasonic PBX Service Manual (repair manual)

ORDER NO. KMS1207901CE

(for Europe)

2

PAGE

PAGE

1 Safety Precautions -----------------------------------------------3

1.1. For Service Technicians ----------------------------------3
1.2. Caution--------------------------------------------------------3

2 Warning --------------------------------------------------------------3

2.1. About Lead Free Solder (PbF: Pb free) --------------3

2.1.1. Suggested PbF Solder -------------------------------4

2.2. Discarding of P. C. Board --------------------------------4

3 Specifications ------------------------------------------------------5
4 Technical Descriptions------------------------------------------7

4.1. Block Diagram ----------------------------------------------7
4.2. DMW74(IC101) and DE56(IC302) ---------------------8
4.3. Power Supply Circuit ( Include PoE ) -----------------8
4.4. Reset/Power Down Detect circuit ----------------------8
4.5. Clock circuit--------------------------------------------------9

4.5.1. System clock 12 MHz X301 ------------------------9
4.5.2. PHY clock 25 MHz X201 ----------------------------9
4.5.3. RF clock 13.824 MHz X303-------------------------9

4.6. BUS Access circuit-----------------------------------------9
4.7. Ethernet circuit ----------------------------------------------9
4.8. RF circuit --------------------------------------------------- 10
4.9. LED circuit ------------------------------------------------- 11

4.10. Backup circuit --------------------------------------------- 11

5 Location of Controls and Components------------------ 12

5.1. Names and Locations ----------------------------------- 12

6 Installation Instructions--------------------------------------- 13

6.1. Unpacking-------------------------------------------------- 13
6.2. LED Indications ------------------------------------------- 13
6.3. Connecting a SIP-CS to a LAN ----------------------- 13
6.4. Connecting an AC Adaptor to a SIP-CS ----------- 14

7 Test Mode ---------------------------------------------------------- 16

7.1. Peer to Peer Mode Test -------------------------------- 16

7.1.1. Preparation-------------------------------------------- 16
7.1.2. PC Setting for Configuration---------------------- 16
7.1.3. Connection for Test --------------------------------- 19
7.1.4. Communication Test -------------------------------- 19
7.1.5. How to Release the Peer to Peer Mode on

Base Unit ---------------------------------------------- 19

7.2. How to Login to Panasonic Administrator

Menu -------------------------------------------------------- 20

7.2.1. Web User Interface --------------------------------- 20

7.3. PS registration -------------------------------------------- 25
7.4. Firmware Version up ------------------------------------ 27

8 Service Mode ----------------------------------------------------- 28

8.1. How to Change MAC Address Label---------------- 28

8.1.1. Replacing Main P.C.B. ----------------------------- 28
8.1.2. Attaching MAC Address Label ------------------- 28

9 Troubleshooting Guide---------------------------------------- 29

9.1. No Power--------------------------------------------------- 29
9.2. No Operation ---------------------------------------------- 30
9.3. STM (Start Monitor)-------------------------------------- 33

10 Disassembly and Assembly Instructions --------------- 34

10.1. Disassembly Instructions------------------------------- 34

11 Measurements and Adjustments -------------------------- 35

11.1. USB Test Mode ------------------------------------------- 35

11.1.1. How to Install the Application for Test

Mode---------------------------------------------------- 35

11.1.2. How to Start USB Test Mode  -------------------- 38

11.2. Clock Adjustment----------------------------------------- 39

12 Miscellaneous --------------------------------------------------- 40

12.1. Terminal guide of ICs, Transistors and Diodes--- 40
12.2. How To Replace a Flat Package IC ----------------- 41

12.2.1. Preparation ------------------------------------------- 41
12.2.2. Removal Procedure -------------------------------- 41
12.2.3. Procedure--------------------------------------------- 41
12.2.4. Removing Solder From Between Pins--------- 41

12.3. How to Replace the LLP (Leadless Leadframe

Package) IC and IC ground plate-------------------- 42

12.3.1. Preparation ------------------------------------------- 42
12.3.2. Caution ------------------------------------------------ 42
12.3.3. How to Remove the IC ---------------------------- 42
12.3.4. How to Install the IC -------------------------------- 42
12.3.5. How to Remove a Solder Bridge (Doesn't

apply to IC ground plate.) ------------------------- 43

13 Schematic Diagram -------------------------------------------- 44

13.1. Main Board ------------------------------------------------ 44
13.2. Waveform -------------------------------------------------- 52

13.2.1. No.(1)-(8)---------------------------------------------- 52
13.2.2. No.(9)-(12) -------------------------------------------- 53

13.3. Memo ------------------------------------------------------- 54

14 Printed Circuit Board------------------------------------------ 55

14.1. Component View----------------------------------------- 55
14.2. Bottom View----------------------------------------------- 56

15 Appendix Information of Schematic Diagram -------- 57
16 Exploded View and Replacement Parts List----------- 58

16.1. IC Data ----------------------------------------------------- 58

16.1.1. IC101 (DMW74) ------------------------------------- 58
16.1.2. IC201 (PHY)------------------------------------------ 64
16.1.3. IC302 (DE56) ---------------------------------------- 65
16.1.4. IC401 (RFIC) ----------------------------------------- 67

16.2. Cabinet and Electrical Parts Location -------------- 68
16.3. Accessories and Packing Material ------------------ 69
16.4. Replacement Parts List -------------------------------- 70

16.4.1. Cabinet and Electrical Parts---------------------- 70
16.4.2. Accessory and Packing Materials -------------- 70
16.4.3. Main Boards Parts ---------------------------------- 70
16.4.4. FIXTURES AND TOOLS-------------------------- 73

3

1. Before servicing, unplug the AC power cord to prevent an electric shock.
2. When replacing parts, use only the manufacturer's recommended components.
3. Check the condition of the power cord. Replace if wear or damage is evident.
4. After servicing, be sure to restore the lead dress, insulation barriers, insulation papers, shields, etc.
5. Before returning the serviced equipment to the customer, be sure to perform the following insulation resistance test to prevent

the customer from being exposed to shock hazards.

• Repair service shall be provided in accordance with repair technology information such as service manual so as to pre-

vent fires, injury or electric shock, which can be caused by improper repair work.

1. When repair services are provided, neither the products nor their parts or members shall be remodeled. 
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced. 
3. FASTON terminals shall be plugged straight in and unplugged straight out. 

• ICs and LSIs are vulnerable to static electricity.

1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.

When you note the serial number, write down all of the 11 digits.
The serial number may be found on the label affixed to the bottom of the unit.

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that con-
tains lead.
We will use PbF when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn), Silver,
(Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder. 

• PbF solder has a melting point that is 50

° ~ 70° F, (30° ~ 40°C) higher than Pb solder. Please use a soldering iron with tempera-

ture control and adjust it to 700

° ± 20° F, (370° ± 10°C). 

Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.

• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100

°F, (600°C).

• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the

opposite side (See figure, below).

4

There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac
turer's specific instructions for the melting points of their products and any precautions for using their product with other 
materials. 
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.

When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.