Read Panasonic KX-TDA620BX Service Manual online
KX-TDA620BX
(for Asia, Middle Near East, Latin America and Africa)
Hybrid IP-PBX
IMPORTANT INFORMATION ABOUT LEAD FREE, (PbF), SOLDERING
If lead free solder was used in the manufacture of this product the printed circuit boards will be marked PbF.
Standard leaded, (Pb), solder can be used as usual on boards without the PbF mark.
If lead free solder was used in the manufacture of this product the printed circuit boards will be marked PbF.
Standard leaded, (Pb), solder can be used as usual on boards without the PbF mark.
When this mark does appear please read and follow the special instructions described in this manual on the use of PbF and how
it might be permissible to use Pb solder during service and repair work.
it might be permissible to use Pb solder during service and repair work.
60ORDER NO. KMS0510154CE
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
3
1.1.
SUGGESTED PbF SOLDER
3
1.2.
HOW TO RECOGNIZE THAT Pb FREE SOLDER IS
USED
4
2 FOR SERVICE TECHNICIANS
4
3 CAUTION
5
3.1.
NOTE
5
3.2.
SAFETY PRECAUTIONS
5
3.3.
INSULATION RESISTANCE TEST
5
3.4.
BATTERY CAUTION
5
3.5.
CAUTION
5
4 SPECIFICATIONS
6
4.1.
GENERAL DESCRIPTION
6
4.2.
CHARACTERISTICS
6
4.3.
SYSTEM CONSTRUCTION
7
4.4.
SYSTEM CAPACITY
11
5 SYSTEM OVERVIEW
14
5.1.
SYSTEM CONFIGURATIONS
14
5.2.
SYSTEM CONNECTION DIAGRAM
15
6 DISASSEMBLY INSTRUCTIONS
17
6.1.
DISASSEMBLY INSTRUCTION (BUS-S CARD)
17
6.2.
DISASSEMBLY INSTRUCTION (BACK BOARD)
18
7 OUTLINE
20
7.1.
GENERAL DESCRIPTION
20
7.2.
SYSTEM CONTROL
21
7.3.
BACK BOARD SIGNAL CONNECTION DIAGRAM
24
8 BUS-S CARD CIRCUIT OPERATION
27
8.1.
BUS-S CARD
27
9 BACK BOARD CIRCUIT OPERATION
32
10 TROUBLESHOOTING GUIDE
33
10.1. BUS-S CARD
33
11 IC DATA
39
11.1. CPU (IC200)
39
11.2. ASIC (IC101)
43
11.3. SYSTEM TSW (IC501)
47
11.4. CIRCLINK (IC401)
51
11.5. FPGA (IC402)
53
12 TERMINAL GUIDE OF ICS, TRANSISTORS AND DIODES
55
13 HOW TO REPLACE A FLAT PACKAGE IC
56
13.1. PREPARATION
56
13.2. REMOVAL PROCEDURE
56
13.3. INSTALLATION PROCEDURE
56
13.4. REMOVING SOLDER FROM BETWEEN PINS
56
14 CABINET AND ELECTRICAL PARTS LOCATION
57
14.1. EXTENSION BOARDS FOR SERVICING
58
15 ACCESSORIES AND PACKING MATERIALS
59
16 REPLACEMENT PARTS LIST
60
16.1. CABINET AND ELECTRICAL PARTS
60
16.2. ACCESSORIES AND PACKING MATERIALS
60
16.3. BUS-S BOARD PARTS
60
16.4. BB-EXP BOARD PARTS
66
16.5. FIXTURES AND TOOLS
66
17 FOR THE SCHEMATIC DIAGRAM
67
17.1. WAVEFORM
68
17.2. BUS-S BLOCK DIAGRAM
69
18 SCHEMATIC DIAGRAM
70
18.1. BUS-S BOARD No.1
70
18.2. BUS-S BOARD No.2
74
18.3. BUS-S BOARD No.3
78
18.4. BUS-S BOARD No.4
82
18.5. BUS-S BOARD No.5
84
18.6. BUS-S BOARD No.6
86
18.7. BUS-S BOARD No.7
88
18.8. BB-EXP BOARD No.1
90
18.9. BB-EXP BOARD No.2
92
18.10. BB-EXP BOARD No.3
94
19 PRINTED CIRCUIT BOARD
96
19.1. BUS-S BOARD
96
19.2. BB-EXP BOARD
97
CONTENTS
Page
Page
2
KX-TDA620BX
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
contains lead.
We will use PbF when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn), Silver,
(Ag), and Copper, (Cu).
(Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
•
•
•
• PbF solder has a melting point that is 50° ~ 70° F, (30° ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700° ± 20° F, (370° ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
be careful not to heat too long.
•
•
•
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F, (600°C).
•
•
•
• If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
•
•
•
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See figure, below).
1.1. SUGGESTED PbF SOLDER
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac
turer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac
turer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
3
KX-TDA620BX
1.2. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS USED
2 FOR SERVICE TECHNICIANS
ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover the plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on the worktable.
4. Do not touch IC or LSI pins with bare fingers.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover the plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on the worktable.
4. Do not touch IC or LSI pins with bare fingers.
4
KX-TDA620BX
