Read Panasonic KX-TDA600RU Service Manual online
KX-TDA600RU
(for Russia)
Hybrid IP-PBX
IMPORTANT INFORMATION ABOUT LEAD FREE, (PbF), SOLDERING
If lead free solder was used in the manufacture of this product the printed circuit boards will be marked PbF.
Standard leaded, (Pb), solder can be used as usual on boards without the PbF mark.
If lead free solder was used in the manufacture of this product the printed circuit boards will be marked PbF.
Standard leaded, (Pb), solder can be used as usual on boards without the PbF mark.
When this mark does appear please read and follow the special instructions described in this manual on the use of PbF and how
it might be permissible to use Pb solder during service and repair work.
it might be permissible to use Pb solder during service and repair work.
ORDER NO. KMS0510152CE
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
3
1.1.
SUGGESTED PbF SOLDER
3
1.2.
HOW TO RECOGNIZE THAT Pb FREE SOLDER IS
USED
4
2 FOR SERVICE TECHNICIANS
5
3 CAUTION
5
3.1.
NOTE
5
3.2.
SAFETY PRECAUTIONS
5
3.3.
INSULATION RESISTANCE TEST
5
3.4.
BATTERY CAUTION
5
3.5.
CAUTION
5
4 SPECIFICATIONS
6
4.1.
GENERAL DESCRIPTION
6
4.2.
CHARACTERISTICS
6
4.3.
SYSTEM CONSTRUCTION
7
4.4.
SYSTEM CAPACITY
11
5 SYSTEM OVERVIEW
14
5.1.
SYSTEM CONFIGURATIONS
14
5.2.
SYSTEM COMPONENTS
15
5.3.
SYSTEM CONNECTION DIAGRAM
17
6 DISASSEMBLY INSTRUCTIONS
19
6.1.
DISASSEMBLY INSTRUCTION (EMPR CARD)
19
6.2.
DISASSEMBLY INSTRUCTION (BACK BOARD)
20
7 OUTLINE
22
7.1.
GENERAL DESCRIPTION
22
7.2.
SYSTEM CONTROL
23
7.3.
BACK BOARD SIGNAL CONNECTION DIAGRAM
26
8 EMPR CARD CIRCUIT OPERATION
29
8.1.
EMPR CARD
29
9 BACK BOARD CIRCUIT OPERATION
37
10 TROUBLESHOOTING GUIDE
38
10.1. EMPR
38
11 DIAGNOSIS
62
11.1. DIAGNOSIS FEATURES
62
11.2. DIAGNOSIS TEST
67
12 IC DATA
72
12.1. CPU (IC200)
72
12.2. ASIC (IC102)
76
13 TERMINAL GUIDE OF ICS, TRANSISTORS AND DIODES
81
14 HOW TO REPLACE A FLAT PACKAGE IC
82
14.1. PREPARATION
82
14.2. REMOVAL PROCEDURE
82
14.3. INSTALLATION PROCEDURE
82
14.4. REMOVING SOLDER FROM BETWEEN PINS
82
15 CABINET AND ELECTRICAL PARTS LOCATION
83
15.1. EXTENSION BOARDS FOR SERVICING
84
16 ACCESSORIES AND PACKING MATERIALS
85
17 REPLACEMENT PARTS LIST
86
17.1. CABINET AND ELECTRICAL PARTS
86
17.2. ACCESSORIES AND PACKING MATERIALS
86
17.3. EMPR BOARD PARTS
87
17.4. BB-B1 BOARD PARTS
92
17.5. BB-B2 BOARD PARTS
93
17.6. FIXTURES AND TOOLS
93
18 FOR THE SCHEMATIC DIAGRAM
94
18.1. WAVEFORM
95
18.2. EMPR BLOCK DIAGRAM
97
19 SCHEMATIC DIAGRAM
98
19.1. EMPR CARD No.1
98
19.2. EMPR CARD No.2
102
19.3. EMPR CARD No.3
106
19.4. EMPR CARD No.4
110
19.5. EMPR CARD No.5
114
19.6. EMPR CARD No.6
118
19.7. BB-B1 BOARD No.1
122
19.8. BB-B1 BOARD No.2
124
19.9. BB-B1 BOARD No.3
126
19.10. BB-B2 BOARD
128
19.11. MEMO
129
20 PRINTED CIRCUIT BOARD
130
20.1. EMPR BOARD
130
20.2. BB-B1 BOARD
132
20.3. BB-B2 BOARD
133
CONTENTS
Page
Page
2
KX-TDA600RU
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
contains lead.
We will use PbF when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn), Silver,
(Ag), and Copper, (Cu).
(Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
•
•
•
• PbF solder has a melting point that is 50° ~ 70° F, (30° ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700° ± 20° F, (370° ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
be careful not to heat too long.
•
•
•
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F, (600°C).
•
•
•
• If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
•
•
•
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See figure, below).
1.1. SUGGESTED PbF SOLDER
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac
turer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac
turer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
3
KX-TDA600RU
1.2. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS USED
4
KX-TDA600RU
