Read Panasonic KX-TDA0490XJ / KX-TDA0490X Service Manual online
KX-TDA0490XJ
KX-TDA0490X
(for Europe, Asia Oceania, Middle Near East, Latin
America, Russia and Africa)
16-Channel VoIP Gateway Card
IMPORTANT INFORMATION ABOUT LEAD FREE, (PbF), SOLDERING
If lead free solder was used in the manufacture of this product the printed circuit boards will be marked PbF.
Standard leaded, (Pb), solder can be used as usual on boards without the PbF mark.
If lead free solder was used in the manufacture of this product the printed circuit boards will be marked PbF.
Standard leaded, (Pb), solder can be used as usual on boards without the PbF mark.
When this mark does appear please read and follow the special instructions described in this manual on the use of PbF and how
it might be permissible to use Pb solder during service and repair work.
it might be permissible to use Pb solder during service and repair work.
ORDER NO. KMS0410020C8
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
3
1.1.
SUGGESTED PbF SOLDER
3
1.2.
HOW TO RECOGNIZE THAT Pb FREE SOLDER IS
USED
4
2 FOR SERVICE TECHNICIANS
5
3 GENERAL DESCRIPTION
5
4 SPECIFICATION
5
5 NAMES AND LOCATIONS
6
5.1.
INSTALLING/REMOVING THE OPTIONAL SERVICE
CARDS
7
6 TROUBLESHOOTING GUIDE
10
6.1.
CARD START-UP CHECK (CHECK LED ON)
12
6.2.
POWER SUPPLY PROBLEM
14
6.3.
ERROR LOG
16
7 BLOCK DIAGRAM
17
8 CIRCUIT OPERATIONS
18
8.1.
BRIEF DESCRIPTION OF BLOCKS
18
8.2.
IP-Engine
18
8.3.
ASIC BLOCK
19
8.4.
PBX INTERFACE BLOCK
20
8.5.
DSP BLOCK (SUB BOARD)
20
8.6.
POWER SUPPLY BLOCK
21
9 IC DATA
22
9.1.
IC100 (LPR) MAIN BOARD
22
9.2.
IC202 (ASIC)
24
9.3.
IC400 (CPU)
25
9.4.
IC202 SUB BOARD
29
10 HOW TO REPLACE A FLAT PACKAGE IC
32
10.1. PREPARATION
32
10.2. PROCEDURE
32
10.3. REMOVING SOLDER FROM BETWEEN PINS
32
11 TERMINAL GUIDE OF ICs, TRANSISTORS AND DIODES
33
12 CABINET AND ELECTRICAL PARTS LOCATION
34
13 ACCESSORIES AND PACKING MATERIALS
35
14 REPLACEMENT PARTS LIST
36
14.1. CABINET AND ELECTRICAL PARTS LOCATION
36
14.2. ACCESSORIES AND PACKING MATERIALS
36
14.3. MAIN BOARD PARTS
36
14.4. SUB BOARD PARTS
41
15 FOR SCHEMATIC DIAGRAM
44
16 SCHEMATIC DIAGRAM
46
16.1. MAIN No.1-CPU-SH1 and Memory Block
46
16.2. MAIN No.2-ASIC Block
50
16.3. MAIN No.3 DPRAM and PCC FPGA Block
54
16.4. MAIN No.4-CPU-SH7750R Block
58
16.5. MAIN No.5-Flash and SDRAM Block
62
16.6. MAIN No.6-ICE and OPTION Interface Block
64
16.7. MAIN No.7-Power Supply Block
68
16.8. WAVEFORM
69
16.9. SUB No.1-IP GW16
70
16.10. SUB No.2-IP GW16
74
17 PRINTED CIRCUIT BOARD
78
17.1. MAIN BOARD
78
17.2. SUB BOARD
80
CONTENTS
Page
Page
2
KX-TDA0490XJ / KX-TDA0490X
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn),
Silver, (Ag), and Copper, (Cu).
Silver, (Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
•
•
•
• PbF solder has a melting point that is 50° ~ 70° F, (30° ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700° ± 20° F, (370° ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
be careful not to heat too long.
•
•
•
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F, (600°C).
•
•
•
• If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
•
•
•
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See figure, below).
1.1. SUGGESTED PbF SOLDER
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac
turer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac
turer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
3
KX-TDA0490XJ / KX-TDA0490X
1.2. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS USED
“PbF” is marked on the PCB to show that Pb free solder is used.(See the figure below.)
4
KX-TDA0490XJ / KX-TDA0490X