KX-NT400RU - Panasonic PBX Service Manual (repair manual)

Model
KX-NT400RU
Pages
108
Size
4.33 MB
Type
PDF
Document
Service Manual
Brand
Device
PBX / IP PROPRIETARY TELEPHONE
File
kx-nt400ru.pdf
Date

View Panasonic KX-NT400RU Service Manual online

ORDER NO. KMS1003764CE
IP Proprietary Telephone
Model No. 
KX-NT400RU
(for Russia, Ukraine)
2
KX-NT400RU
TABLE OF CONTENTS
PAGE
PAGE
1 Safety Precautions -----------------------------------------------3
1.1. For Service Technicians  ---------------------------------3
2 Warning --------------------------------------------------------------3
2.1. About Lead Free Solder (PbF: Pb free) --------------3
2.1.1. Suggested PbF Solder -------------------------------4
2.2. Discarding of P. C. Board --------------------------------4
3 Specifications ------------------------------------------------------5
3.1. General Descriptions--------------------------------------5
4 Technical Descriptions------------------------------------------6
4.1. Block Diagram ----------------------------------------------6
4.2. Circuit Operations ------------------------------------------7
4.2.1. Main-CPU (IC1)----------------------------------------7
4.2.2. Application-CPU (IC101) ----------------------------7
4.2.3. LED Circuit ----------------------------------------------7
4.2.4. Backlight Circuit----------------------------------------8
4.2.5. TouchPanel I/F Circuit--------------------------------8
4.2.6. Reset Circuit --------------------------------------------9
4.2.7. Ethernet Circuit -------------------------------------- 10
4.2.8. Analog Circuit ---------------------------------------- 11
4.2.9. Sub-CPU(IC4)---------------------------------------- 13
4.2.10. KEY Input Control Circuit-------------------------- 14
4.2.11. LED Circuit -------------------------------------------- 15
4.2.12. Power Supply Circuit ------------------------------- 16
4.2.13. Bluetooth I/F Circuit--------------------------------- 17
4.2.14. SD Card I/F Circuit ---------------------------------- 17
4.2.15. USB I/F Circuit --------------------------------------- 18
5 Location of Controls and Components------------------ 19
5.1. Name and Locations ------------------------------------ 19
5.1.1. Front View--------------------------------------------- 19
5.1.2. Right Side View -------------------------------------- 20
5.1.3. Left Side View ---------------------------------------- 20
5.1.4. Back View --------------------------------------------- 21
5.1.5. Bottom View ------------------------------------------ 21
6 Installation Instructions--------------------------------------- 22
7 Troubleshooting Guide
---------------------------------------- 23
7.1. No Operation ---------------------------------------------- 23
7.1.1. Power Supply : AC adaptor ----------------------- 23
7.1.2. Power Supply : PoE Hub -------------------------- 23
7.2. LCD Does Not work ------------------------------------- 27
7.3. Touch Panel Does Not work--------------------------- 28
7.4. Sound of Tap Screen Does Not work --------------- 29
7.5. Handset Does Not work -------------------------------- 30
7.5.1. Receive ------------------------------------------------ 30
7.5.2. Send ---------------------------------------------------- 30
7.6. Headset Does Not work -------------------------------- 31
7.6.1. Receive ------------------------------------------------ 31
7.6.2. Send ---------------------------------------------------- 31
7.7. Speaker-Phone Does Not work----------------------- 32
7.7.1. Receive ------------------------------------------------ 32
7.7.2. Send ---------------------------------------------------- 32
7.8. Ethernet Does Not work -------------------------------- 33
7.8.1. LAN port ----------------------------------------------- 33
7.8.2. PC port ------------------------------------------------- 34
7.8.3. Internal MII connection----------------------------- 35
7.8.4. PoE (Power over Ethernet) ----------------------- 35
7.9. LED Does Not Light ------------------------------------- 36
7.10. Bluetooth Does Not work------------------------------- 36
7.11. USB Port does not work-------------------------------- 37
7.12. SD Card does not work -------------------------------- 37
8 Disassembly and Assembly Instructions -------------- 38
8.1. Remove Main Board and Jack Board -------------- 38
8.2. Disassembly for Lower Cabinet Ass’y-------------- 40
8.3. Disassembly for Stand Ass’y-------------------------- 40
8.4. Assembly for Lower Cabinet Ass’y  ----------------- 41
9 Miscellaneous --------------------------------------------------- 44
9.1. Terminal Guide of the ICs Transistors and
Diodes ------------------------------------------------------ 44
9.2. How To Replace a Flat Package IC----------------- 46
9.2.1. Preparation ------------------------------------------- 46
9.2.2. Removal Procedure -------------------------------- 46
9.2.3. Procedure--------------------------------------------- 46
9.2.4. Removing Solder From Between Pins--------- 46
9.3. Memo ------------------------------------------------------- 47
10 Schematic Diagram -------------------------------------------- 48
10.1. Main Board ------------------------------------------------ 48
10.1.1. L2SW , PoE , Power DC -------------------------- 48
10.1.2. VoIP ---------------------------------------------------- 52
10.1.3. Analog Interface------------------------------------- 54
10.1.4. SUB-CPU , LED , KEY SCAN , Bluetooth
Interface ----------------------------------------------- 56
10.1.5. CE (X-Scale) ----------------------------------------- 58
10.1.6. Power , LCD Interface , JK Board Interface -- 62
10.2. Sub Board ------------------------------------------------- 64
10.3. Waveform-------------------------------------------------- 65
11 Printed Circuit Board------------------------------------------ 71
11.1. Main Board ------------------------------------------------ 71
11.1.1. Component View------------------------------------ 71
11.1.2. Bottom View------------------------------------------ 72
11.2. Sub1 Board------------------------------------------------ 73
11.2.1. Component View------------------------------------ 73
11.2.2. Bottom View------------------------------------------ 74
11.3. Sub2 Board------------------------------------------------ 75
11.3.1. Component View------------------------------------ 75
11.3.2. Bottom View------------------------------------------ 75
12 Appendix Information of Schematic Diagram -------- 76
13 Exploded View and Replacement Parts List
----------- 77
13.1. IC Data ----------------------------------------------------- 77
13.1.1. IC1 (VoIP)--------------------------------------------- 77
13.1.2. IC5 (Ethernet)---------------------------------------- 81
13.1.3. IC111 (DODEC) ------------------------------------- 84
13.1.4. IC107 (MAC/PHY) ---------------------------------- 85
13.1.5. IC120 (LED driver)---------------------------------- 86
13.1.6. IC7 (PoE) --------------------------------------------- 88
13.1.7. IC101 (XScale) -------------------------------------- 89
13.2. Cabinet and Electric Parts----------------------------- 98
13.3. Accessories and Packing Materials----------------- 99
13.4. Replacement Parts List ------------------------------- 100
13.4.1. Cabinet and Electrical Parts---------------------100
13.4.2. Accessories and Packing Materials -----------100
13.4.3. Main Board Parts ----------------------------------101
13.4.4. Jack Board Parts-----------------------------------108
3
KX-NT400RU
1 Safety Precautions
1.1.
For Service Technicians 
• Repair service shall be provided in accordance with repair technology information such as service manual so as to prevent fires,
injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
• ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
2 Warning
2.1.
About Lead Free Solder (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that con-
tains lead.
We will use PbF when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn), Silver,
(Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder. 
Caution
• PbF solder has a melting point that is 50
° ~ 70° F, (30° ~ 40°C) higher than Pb solder. Please use a soldering iron with tempera-
ture control and adjust it to 700
° ± 20° F, (370° ± 10°C). 
Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100
°F, (600°C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See figure, below).
4
KX-NT400RU
2.1.1.
Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac
turer's specific instructions for the melting points of their products and any precautions for using their product with other 
materials. 
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
2.2.
Discarding of P. C. Board
When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.
5
KX-NT400RU
3 Specifications
3.1.
General Descriptions
Rated Specification of the Equipment
List of Hardware Configuration
6
KX-NT400RU
4 Technical Descriptions
4.1.
Block Diagram
M
AIN
 P
C
B
 
RJ45
 
Vo
IP
L
S
I
RJ45
 
FL
A
S
H
 
4MByt
Sub
 
CP
U
 
SDRA
M
8MByt
JT
A
G
 
+12V
5.0V
 RE
G
3.3V
 RE
G
8.192MHz
25
M
H
BT mo
du
le
(op
ti
on)
 
AFE
 
L2SW
me
mo
ry
co
nt
ro
lle
PC
M
 
SD
 
co
nt
ro
lle
UA
RT
 
PC
M
 
SP
anal
o
g
anal
o
g
+5V
+5.5V
VD
D
_
C
O
R
E
V
D
D
_
D
33,
 _A
33
BT
 
co
Jack
 
co
MIC
 
co
SP
 
co
Jac
k P
C
B
 
SP
 
MI
C
 
1.5V
 REG
3.3V
 D
C
/D
C
5.5V
 D
C
/D
C
Po
MII2
 
MII1
 
USA
RT
2
USA
RT
1
A/
D
, D
/A
 
KE
Y
/LE
D
 
JT
A
G
 
MII2
 
MII1
 
SP
SIO
 
SIO
 
UA
RT
 
PI
O
 
GPI
O
SPI
 
LAN port
 
PC port
 
IF
 P
C
B
 
PXA
270
MA
C/PHY
FL
AS
H
 
64MByt
AC
’9
Cod
e
SDRA
M
32MByt
JT
A
G
VBU
40pi
co
1.3V
 REG
1.1V
 REG
32
kH
z
13
M
H
z
25
M
H
4pi
co
L
E
Dd
rv
USB
 
ho
st
 
Mem
o
ry
C
o
n
tr
o
lle
I2
C
 
A
C
97
 
SD
 
co
nt
ro
lle
SSP1
 
FFU
AR
T
JT
A
G
 
A
C
97
 
LCD
 
USB
SD
 
VD
D
_
S
R
AM
 
VD
D
_
PLL
 
LCD
 
C
o
n
tr
o
lle
20pi
co
20pi
co
BT
UAR
T
SSP2
 
1.5V
 D
C
/D
C
D3.3V
, A
3
.3V
VC
O
R
E
PW
M
PWM
LC
D /w 
T.P.
 
mo
du
le
9.8
M
H
SD
R
A
M
32MByt
IC
101
IC
102
 I
C
103
 I
C
104
IC
107
X503
 
X501
 
X502
 
IC
118
IC
111
IC
120
IC1
 
IC3
 
X201
 
IC2
 
X1
 
IC5
 
IC4
 
X401
 
IC7
 
IC9
 
IC10
 
IC14
 
IC
123
IC
122
IC
112
IC
113
 
IC
114
 
CN6
 
CN1
 
JK2
 
JK1
 
CN4
 
CN5
 
CN16
 
CN15
CN14
CN2
 
CN3
 
CN4
 
USB
 
co
SD
co
n
KX-NT400R
U Bloc
k Diag
ra
m
7
KX-NT400RU
4.2.
Circuit Operations
4.2.1.
Main-CPU (IC1)
The DSP , MAC, CODEC and the CPU are built into the VoIP (IC1).
The FLASH (IC2) and the SDRAM (IC3) are connected to the CPU. The contents of the FLASH are expanded to the SDRAM at
start-up. It also stores each setting.
4.2.2.
Application-CPU (IC101)
The SD card controller , USB host, LCD controller, PWM generator and the CPU are built into the PXA270 (IC101).
The FLASH (IC102) and the SDRAMs (IC103, IC104) are connected to the CPU. The contents of the FLASH are expanded to
the SDRAM at start-up. 
It also stores each setting. Also, The MAC/PHY and CODEC/TouchPanel controller are connected the CPU.
4.2.3.
LED Circuit
LCD data and timing signals are outputted from IC101 to LCD module.
CK, VSYNC, HSYNC, and ENAB are timing signals.
R5~0, G5~0 and B5~0 are data signals IC121 is FlipFlop for synchronizing of HSYNC and ENAB with CK rising edge.
8
KX-NT400RU
4.2.4.
Backlight Circuit
IC120 is LED driver for LCD backlight and generate V_BK(approx. 22V) from +12V.
IC101 controlls IC120 with BL_PWMPOW, BL_RSTB, BL_PWMOUT.
BL_PWMPOW and BL_RSTB must be "high" when Backlight turns on.
BL_PWMOUT is 200Hz PWM signal and it's duty controlls Backlight brightness.
4.2.5.
TouchPanel I/F Circuit
TouchPanel and IC111 are connected with 4-wire analog signals.
IC101 and IC111 are connected by synchronous serial bus.
When pendown detected, IC111 informes IC101 by raising TP_PENIRQ signal to "high".
Then, IC101 takes coordinate information of pen position by controlling IC111.
9
KX-NT400RU
4.2.6.
Reset Circuit
Reset Signal is outputted from IC131 and inputted into IC1 and IC2.
After IC1 is started, execute the reset cancellation on the peripheral.
10
KX-NT400RU
4.2.7.
Ethernet Circuit
The Ethernet hub IC(IC5)is used for the Ethernet interface.
It is connected from IC5 to the Ethernet port(JK2) through a transformer and so is isolated.
Also, LAN port(JK2) gets power from the Ethernet line for PoE(Power over Ethernet) as shown below.
It is connected between IC5 and the VoIP(IC1) by high-speed bus called MII(Media Independent Interface) bus operating with
25MHz.
Also, it is connected between IC107 and the VoIP(IC1) by MII for communication between VoIP(IC1) and PXA270(IC101).

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