Read Panasonic KX-NCP500RU Service Manual online
4
KX-NCP500RU
2 Warning
2.1.
Battery Caution
1. Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recom-
mended by the manufacturer. Dispose of used batteries
according to the manufacturer's lnstructions.
mended by the manufacturer. Dispose of used batteries
according to the manufacturer's lnstructions.
2. The lithium battery is a critical component (type
No.CR23541). Please observe for the proper polarity and
the exact location when replacing it and soldering the
replacement lithium battery in.
the exact location when replacing it and soldering the
replacement lithium battery in.
2.2.
Caution
The power socket wall outlet should be located near this
equipment and be easily accessible.
equipment and be easily accessible.
2.3.
About Lead Free Solder (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that con-
tains lead.
We will use PbF when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn), Silver,
(Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
tains lead.
We will use PbF when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn), Silver,
(Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50
° ~ 70° F, (30° ~ 40°C) higher than Pb solder. Please use a soldering iron with tempera-
ture control and adjust it to 700
° ± 20° F, (370° ± 10°C).
Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100
°F, (600°C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See figure, below).
2.3.1.
Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac
turer's specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac
turer's specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
2.4.
Discarding of P. C. Board
When discarding P. C. Board, delete all personal informa-
tion such as telephone directory and caller list or scrap P. C.
Board.
tion such as telephone directory and caller list or scrap P. C.
Board.
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