KX-NCP1188XJ - Panasonic PBX Service Manual (repair manual)

Model
KX-NCP1188XJ
Pages
48
Size
1.9 MB
Type
PDF
Document
Service Manual
Brand
Device
PBX / E-1 TRUNK CARD
File
kx-ncp1188xj.pdf
Date

View Panasonic KX-NCP1188XJ Service Manual online

ORDER NO. KMS0811620CE
 E-1 Trunk Card
Model No.
KX-NCP1188XJ
(for Asia, Oceania, Middle Near Esat, Africa 
and Latin America)
2
KX-NCP1188XJ
TABLE OF CONTENTS
PAGE
PAGE
1 Safety Precautions -----------------------------------------------3
1.1. For Service Technicians  ---------------------------------3
1.2. Discarding of P. C. Board --------------------------------3
2 Warning --------------------------------------------------------------4
2.1. About Lead Free Solder (PbF: Pb free) --------------4
2.1.1. Suggested PbF Solder -------------------------------4
3 Specifications ------------------------------------------------------5
4 Technical Descriptions
------------------------------------------6
4.1. Block Diagram ----------------------------------------------6
4.2. Circuit Operation -------------------------------------------7
4.2.1. CPU Peripheral Circuit -------------------------------7
4.3. Line Interface Function -----------------------------------9
4.3.1. Line Interface Outline---------------------------------9
4.3.2. Line Interface Loopback -----------------------------9
4.4. DSP---------------------------------------------------------- 10
4.4.1. DSP Function Outline ------------------------------ 10
4.4.2. DSP Peripheral Interface -------------------------- 11
4.5. Local Highway Interface Function ------------------- 12
4.6. EC BUS Interface ---------------------------------------- 13
4.6.1.  Dual Port RAM (DPRAM) Communication --- 13
4.7. Outline of Reset System ------------------------------- 14
4.7.1.  Reset Operation ------------------------------------ 14
4.8. Power Supply --------------------------------------------- 15
5 Location of Controls and Components------------------ 16
5.1. Names and Locations----------------------------------- 16
6 Installation Instructions--------------------------------------- 17
6.1. Information about the Physical Trunk Cards ------ 17
6.1.1. E1 Card ------------------------------------------------ 17
7 Troubleshooting Guide---------------------------------------- 19
8 Miscellaneous 
---------------------------------------------------- 24
8.1. How To Replace a Flat Package IC ----------------- 24
8.1.1. Preparation-------------------------------------------- 24
8.1.2. Removal Procedure--------------------------------- 24
8.1.3. Procedure --------------------------------------------- 24
8.1.4. Removing Solder From Between Pins --------- 24
8.2. Terminal Guide of the ICs Transistors and
Diodes------------------------------------------------------- 25
9 Schematic Diagram--------------------------------------------- 26
9.1. No.1---------------------------------------------------------- 26
9.2. No.2---------------------------------------------------------- 28
9.3. No.3---------------------------------------------------------- 30
9.4. No.4---------------------------------------------------------- 32
9.5. No.5---------------------------------------------------------- 34
10 Printed Circuit Board ------------------------------------------ 35
10.1. Component View ----------------------------------------- 35
10.2. Bottom View ----------------------------------------------- 36
11 Appendix Information of Schematic Diagram --------- 37
12 Exploded View and Replacement Parts List ----------- 38
12.1. IC Data------------------------------------------------------ 38
12.1.1. IC1 (CPU) --------------------------------------------- 38
12.1.2. IC2 (ASIC)--------------------------------------------- 40
12.2. Cabinet and Electrical Parts Location--------------- 42
12.3. Accessories and Packing Materials ----------------- 43
12.4. Replacement Parts List --------------------------------- 44
12.4.1. Cabinet and Electrical Parts Location ---------- 44
12.4.2. Accessories and Packing Materials------------- 44
12.4.3. Main Board Parts ------------------------------------ 44
3
     KX-NCP1188XJ
1 Safety Precautions
1.1.
For Service Technicians 
• Repair service shall be provided in accordance with repair technology information such as service manual so as to prevent fires,
injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
• ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
1.2.
Discarding of P. C. Board
When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.
4
KX-NCP1188XJ
2 Warning
2.1.
About Lead Free Solder (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that con-
tains lead.
We will use PbF when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn), Silver,
(Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder. 
Caution
• PbF solder has a melting point that is 50
° ~ 70° F, (30° ~ 40°C) higher than Pb solder. Please use a soldering iron with tempera-
ture control and adjust it to 700
° ± 20° F, (370° ± 10°C). 
Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100
°F, (600°C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See figure, below).
2.1.1.
Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac
turer's specific instructions for the melting points of their products and any precautions for using their product with other 
materials. 
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
5
     KX-NCP1188XJ
3 Specifications
Functional Block
Functional contents
E1 Line Interface
Number of Ports
30 ports
Transfer Rate
2.048Mbit/s
Line Code
HDB3
Framing
CRC-Multiframe or SMF (Sub Mutiframe)
E1 Line Interface IC
MT9074 made by MITEL
Line Interface Circuit
(Except Interface IC)
Main Front End Circuit
Pulse Transformer
Surge Absorber
 EMC Filter
ASIC (IC2)
EC Bus Interface Functional (Slave)
H.100 Bus Interface Functional, Digital PLL Function
Local Bus Interface Functional (Compatible with legacy)
Timing Switch Function, Gain Control Function, FIFO/DPRAM Function
Returning Sound Function
See the specification of eSAMSON for details.
Controller
CPU
SH7020(12.288MHz)
Flash
4Mbit(256K x 16)
For software download
SRAM
4Mbit(256K x 16)
DIMF Receiver/Generator
In-band Signaling Function
• No. of Channels 
MFC-R2 Receiver: 30ch(Composed of DSP)
MFC-R2 Generator: 30ch(Composed of DSP)
DTMF Receiver: 30ch(Composed of DSP; DSP supports 30ch.)
TMF Generator: Switch a signal from eMESSIAH on the MPR card.
                              /DTMF Generator of DSP-30ch
• Level
MFC-R2 Output: Programmable and variable in the range of -31 to 0 dB.
                              Detection: Programmable and variable in the range of -38 to 0dB.
DTMF Output: Programmable and variable in the range of -12 to +3dB.
                          Detection: Programmable and variable in the range of -42 to 0dB.
Gain Control Circuit
Use the gain control function in the eSAMSON
Insert the loss of xxdB at the call on the internal line
Insert the loss of 3dB at the call on the analog line
Mu/A Conversion Function
LED Display Circuit
Card State Display LED: 1
Line State Display LED: 4
Line Interface Connector
For External
RJ45
Both RJ45 and COAX should be mounted and switched
by slide switch depending on the destinations.
For Internal
RJ45
For External/Internal 
COAX
On-board DC/DC Power Supply
Input +15V
Output +5V, +3.3V, +1.8V
Self-diagnostic Functional
LSI Internal Loopback Test of E1 Line Interface
Loopback Function by a relay on the primary side of the line
6
KX-NCP1188XJ
4 Technical Descriptions
4.1.
Block Diagram
10MHz
RTS CTS
TX+
TX-
EC_bus
H100 bus
28
11
+3.3v
+1.8v +3.3v
+5v
RX+
RX-
RJ45
D15-0
A19-0
12.288MHz
Status
Indication x 4
nRD
nWR
nLBS
nCS1
nCS6
nCS2
nCS3
Local
Reset
nHALT
n
CS1
+3.3V
nRST
ASIC IC2
EC_CLK
EC_AD[15:0]
EC_BE[1:0]
EC_FRAME
EC_TRDY
EC_STOP
EC_INT
EC_PAR
EC_PERR
EC_nRST
EC_IDSEL
EC_DET
LDHW[1:0]
LUHW[1:0]
CT_NETREF
nCT_FRAME_A
CT_CLK_A
CT_D[7:0]
LA[12:0]
LD[7:0]
nRD,nWR
 nCSI
HW_FH
HW_CLK0
HW_CLK1
L_NETREF
nLRST
P0[7:0]
Jumper
+3.3v
DC/DC
Converter
+15v
nBREQ
nBACK
P1[4:0]
P2[0]
5v
Level
Shifter
nWAIT
OSC
16.384MHz
A12-0
D7-0
RXD
TXD
nRD,nWR
nIRQ2
RYnBY
RYnBY
PB[3]
PA[11]
PB[10]
nIRQ[0]
nCS[0]
nCS[0]_S
+3.3V
+3.3V
Flash
8Mbit
(IC5)
(512k x 16)
SRAM
4Mbit
Serge
EMC
Line Interface Block(E1)
Transformer
Serge
EMC
Transformer
CLKOUT(4.096MHz)
Termination
Termination
20MHz
DSP i/f
 DTMF Rcv 24ch
+5V
nINT_ISDN
A4-0 nRD,nWR
D7-0
E1-IC
(IC302)
E1.5o/C1.5o
nC4b
DSTo
DSTi
nFOb
nRES
nIRQ
D[7:0]
A[4:0]
UHW0
BS/nLS
S/nFR/C.1.5i
D7-0
RS232C
+5V
+3.3V
UHW0
DHW0
nCS_ISDN
A2-1
nRD,nWR
D7-0
DSP_nRST
nINT_DSP
DSP_nRST
P2[1]
DHW0(2.048Mbps)
UHW0(2.048Mbps)
+1.8V
nIRQ[1]
nINT_DSP
nINT_DSP
nIRQ3
LOS
nRxMF
nTxMF
LOS
nRxMF nTxMF
P2[
6]
nTxMF
LOS
nRxMF
DSP
(IC303)
A0
A3
DVdd
CVdd
HRDY
HRDY
nRESET
PLLCLK
nCS_DMA
nCS_DMA
P2[7]
CT_LOS
CPU
(IC1)
f=12.288MHz
nBREQ
nWAIT
nRES
nIRQ1
nBACK
nRxMF
LOS
PB[0]
nIRQ0
nIRQ4
nIRQ5
P2[4]
ALM(Red)
P2[3]
LED
(Gr)
HW_CLK0
HW_CLK1(2M)
nHW_FH
nSHW_FH(8kHz)
SHW_FH
nSHW_FH(8kHz)
BDR0
HCNT[1:0]
HBIL
HR/nW
nHDS1,nHDS2
HRDY
nHCS
nHINT
(Red)
P2[2]
DPLL
(MT8941)
nC4b
CVb
MS3-0
16.384MHz
ISDN
_RST
ISDN
_RST
nINT_ISDN
nINT_ISDN
+5V
nRESET
BDX0
BDR1
BFSR(X)0/1
BCLKR(X)0/1
P2[5]
MASK
P3[0]
LOOPB
LOOPB
LoopBack
Test
nCS0
A1
0
Decoder
nCS[0]_S
nCS_DSP
nCS_DSP
nCS_ISDN
nRESET
nRESET
P3[4]
HW_CLK0(4.096MHz)
nHW_FH(8KHz)
HW_CLK1(2.048MHz)
CLKOUT(4.096MHz)
Switch
Line        Extn
TX+
TX-
RX+
RX-
Coaxial
i/f
nWR,nRD
nCS0
D15-09
A1-1
D15-0
A18-1
nCS2
nWR,nRD,nLBS,A0
KX-NCP1188XJ  E1 CARD BLOCK DIAGRAM
(IC3)
3.3v
(256k x 16)
7
     KX-NCP1188XJ
4.2.
Circuit Operation
4.2.1.
CPU Peripheral Circuit
The CPU (IC1) is a single chip microcomputer of RISC architecture.
This item describes a memory interface (program & work) and peripheral functions.
4.2.1.1.
Memory (Program & Work)
4.2.1.2.
Chip Select Logic
Part Name
Size
Purpose
Remarks
Flash
(IC5)
4Mbit
(256K x 16)
Program Area
Flash memory is employed for the software downloading by on-board.
SRAM
(IC3)
4Mbit
(256K x 16)
Work Area
 
Terminals
Function used 
Wait Function 
(Numeral is no. of 
clocks.) 
Remarks 
CS Terminals
Individual Output 
(1)
Individual Output 
(2)
nCS0 (area 0)
-
-
nCS0
1+Programable 
or
1+Programable+WAIT
Terminals
Used for Flash memory CS.
nCS1 (area 1)
nCASH (DRAM)
-
nCS1
Read  1/Write  2  or
2+WAIT Terminals
Used for ASIC (IC2) (ASIC) CS
nCS2 (area 2)
-
-
nCS2
1+Programable 
or
1+Programable+WAIT
Terminals
Used for SRAM (Basic) CS. Work
Area
nCS3 (area 3)
nCASL (DRAM)
-
nCS3
Read  1/Write  2  or
2+WAIT Terminals
CS Reserve
nCS4 (area 4)
PA0 (I/O)
TIOCA0 (Timer)
nCS4
Read  1/Write  2  or
2+WAIT Terminals
CS Reserve
nCS5 (area 5)
PA1 (I/O)
nRAS (DRAM)
nCS5
Read  1/Write  2  or
2+WAIT Terminals
CS Reserve
nCS6 (area 6)
PA2 (I/O)
TIOCB0 (Timer)
nCS6
1+Programable 
or
1+Programable+WAIT
Terminals
Used for peripheral LSI CS.
Used for framer IC, DSP CS.
nCS7 (area 7)
PA3 (I/O)
nWAIT
nWAIT
Read  1/Write  2  or
2+WAIT Terminals
Used for Input Wait Terminals.
Chip Select
Address
Device Bit Wide
Assignment 
Device
Bus Cycle
Remarks
nCS0
0000000h
l
0FFFFFFh
16bit
4M_Flash
(IC 5)
2 Clock (1+Long Wait1)
Port allocation of word by static bus sizing
Bus cycle has same setting as Area 2
(nCS2).
nCS1
1000000h
l
1FFFFFFh
8bit
ASIC (IC2)
2+WAIT Terminals
Port allocation of byte by static bus sizing. 
nCS2
A000000h
l
AFFFFFFh
16bit
4M_SRAM
(IC 3)
2 Clock (1+Long Wait1)
Port allocation of word by static bus sizing
Bus cycle has same setting as Area 0
(nCS0).
nCS6
6000000h
l
6FFFFFFh
8bit
E1_IC
(IC302)
3 Clock (1+Long Wait2)
Port allocation of byte by static bus sizing.
8
KX-NCP1188XJ
4.2.1.3.
Interrupt
Note:
• nHALT signal is consistent with the existing PBX and performs polling by I/O port.
However, when the CPU (IC1) goes to Sleep Mode at HALT, the CPU (IC1) is enabled for interruption on release nHALT and
return from Sleep Mode.
• The nIRQ[0] interrupt of ASIC (IC2) is set to output and the interrupt output is to the CPU (IC1) (Mainly, DPRAM communication
interrupts).
• The LOS signal of the T1-IC (IC302) is a level output which goes "H level" at the line reference lost. Thus, 
↓ edge interruption is
available at the line reference lost by inputting the inversion signal of the LOS to the CPU (IC1). The polling operation is also pos-
sible by setting the nIRQ4 terminal of the CPU (IC1) to i/o port. 
(The configuration with the interruption processing is to give a consistency with the existing PBX.)
• Since the nRxMF signal of the T1-IC (IC302) occurs in periodic frame timing, the polling by i/o port is impossible.
9
     KX-NCP1188XJ
4.3.
Line Interface Function
4.3.1.
Line Interface Outline
E1 card uses the E1-IC (IC302)(Mitel) as the IC for the line interface.
Also, see the E1-IC (IC302) Data Sheet for the detailed specifications.
4.3.2.
Line Interface Loopback
This card has a relay for loopback test on the primary side of the line to cut and divide into the line failure or the PBX's own fail-
ure, when there is a defect in operation.
Item
Contents
Remarks
Line Extraction Clock
2.048MHz
 
DPLL
Low Jitter DPLL for calk generation
 
Elastic Buffer
Two-frame elastic buffer (Rx & Tx)
 
Signaling Controller
• HDLC0: Data link (4, 8, 12, 16, 20kbps) 
• HDLC1: CCS times slot 16
Built-in two pieces
FIFO (HDLC0)
128Byte x 2
TX/RX Variable in the range from 16 Byte to 128Byte in
increments of 16Byte.
FIFO (HDLC1)
128Byte x 2
TX/RX Variable in the range from 16 Byte to 128Byte in
increments of 16Byte.
PCM Highway Interface
ST-BUS Interface (2.048Mbps)
 
µP-Interface
8bit parallel Bus (Intel/Motorola)
Used Intel Mode for E1 Card.
10
KX-NCP1188XJ
4.4.
DSP
4.4.1.
DSP Function Outline
This card realizes the following functions as in-band signaling function by DSP (IC303).
-DTMF Receiver
-DTMF Generator
-MFC-R1/R2 Receiver
-MFCR1/R2 Generator
However, DTMF Generator has also a resource on the Main Body side of the TDA160 system.
See the "DSP Interface Specification for E1 Card" for the details.
Card 
Type   
Function   
Resource 
No. of Chan-
nels    
Procedure of Implementation
E1
DTMF Generator
30
DTMF Generator on the Main Body
DSP
DTMF Receiver
30
DSP
MFC-R2 Generator
30
DSP
MFC-R2 Receiver
30
DSP

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