KX-NCP1173XJ (serv.man2) - Panasonic PBX Service Manual (repair manual)

Model
KX-NCP1173XJ (serv.man2)
Pages
53
Size
2.37 MB
Type
PDF
Document
Service Manual
Brand
Device
PBX / 8-PORT SINGLE LINE TELEPHONE EXTENSION CARD
File
kx-ncp1173xj-sm2.pdf
Date

View Panasonic KX-NCP1173XJ (serv.man2) Service Manual online

ORDER NO. KMS0810561CE
8-Port Single Line Telephone Extension Card
Model No.
KX-NCP1173XJ
(for Canada, Asia, Oceania, Middle Near Esat, Africa 
and Latin America)
2
KX-NCP1173XJ
TABLE OF CONTENTS
PAGE
PAGE
1 Safety Precautions -----------------------------------------------3
1.1. For Service Technicians  ---------------------------------3
2 Warning --------------------------------------------------------------3
2.1. About Lead Free Solder (PbF: Pb free) --------------3
2.1.1. Suggested PbF Solder -------------------------------3
2.2. Discarding of P. C. Board --------------------------------4
3 Specifications ------------------------------------------------------5
4 General/Introduction 
---------------------------------------------5
4.1. General Description ---------------------------------------5
5 Technical Descriptions------------------------------------------6
5.1. Block Diagram ----------------------------------------------6
5.2. Circuit Operation -------------------------------------------7
5.2.1. Control-System Circuit -------------------------------7
5.2.2. Line-System Circuit -----------------------------------8
5.2.3. Power Supply Circuit ------------------------------- 11
6 Location of Controls and Components------------------ 13
6.1. Names and Locations----------------------------------- 13
7 Installation Instructions--------------------------------------- 14
7.1. Information about the Physical Extension
Cards -------------------------------------------------------- 14
7.1.1. SLC8 Card -------------------------------------------- 14
8 Troubleshooting Guide---------------------------------------- 15
9 Miscellaneous 
---------------------------------------------------- 22
9.1. How To Replace a Flat Package IC ----------------- 22
9.1.1. Preparation-------------------------------------------- 22
9.1.2. Removal Procedure--------------------------------- 22
9.1.3. Procedure --------------------------------------------- 22
9.1.4. Removing Solder From Between Pins --------- 22
9.2. Terminal Guide of the ICs Transistors and
Diodes------------------------------------------------------- 23
9.3. Memo-------------------------------------------------------- 24
10 Schematic Diagram--------------------------------------------- 25
10.1. Block Diagram -------------------------------------------- 25
10.2. No.1---------------------------------------------------------- 26
10.3. No.2---------------------------------------------------------- 28
10.4. No.3---------------------------------------------------------- 30
10.5. No.4---------------------------------------------------------- 34
11 Printed Circuit Board ------------------------------------------ 38
11.1. Component View ----------------------------------------- 38
11.2. Bottom View ----------------------------------------------- 39
12 Appendix Information of Schematic Diagram --------- 40
13 Exploded View and Replacement Parts List 
----------- 41
13.1. IC Data------------------------------------------------------ 41
13.1.1. IC100 (ASIC) ----------------------------------------- 41
13.1.2. IC300, IC302 (CODEC)---------------------------- 43
13.2. Cabinet and Electrical Parts Location--------------- 44
13.3. Accessories and Packing Material------------------- 45
13.4. Replacement Parts List --------------------------------- 46
13.4.1. Cabinet and Electrical Parts Location ---------- 46
13.4.2. Accessories and Packing Materials------------- 46
13.4.3. Main Board Parts ------------------------------------ 46
3
     KX-NCP1173XJ
1 Safety Precautions
1.1.
For Service Technicians 
• Repair service shall be provided in accordance with repair technology information such as service manual so as to prevent fires,
injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
• ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
2 Warning
2.1.
About Lead Free Solder (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that con-
tains lead.
We will use PbF when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn), Silver,
(Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder. 
Caution
• PbF solder has a melting point that is 50
° ~ 70° F, (30° ~ 40°C) higher than Pb solder. Please use a soldering iron with tempera-
ture control and adjust it to 700
° ± 20° F, (370° ± 10°C). 
Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100
°F, (600°C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See figure, below).
2.1.1.
Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac
turer's specific instructions for the melting points of their products and any precautions for using their product with other 
materials. 
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
4
KX-NCP1173XJ
2.2.
Discarding of P. C. Board
When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.
5
     KX-NCP1173XJ
3 Specifications
4 General/Introduction
4.1.
General Description
This card, which is used in the free slot of the NCP system, can randomly connect eight of DPT. 
Functional Block
Functional contents
Extension Interface
Number of Ports
8 ports
SLT Interface
+30V 30mA Feeding function
Dial-pulse signal detecting function
DTMF signal detecting function
Bell signal issuing function
Hook detecting function
Ring trip detecting function
2W/4W converting function
Surge protective function
Infineon-manufactured 4ch codec function
CODEC function
µ/A Iaw switching function
Test function (Loop back, Tone generation)
Programmable digital filtering function
Serial interface function
PIO function
DTMF Receiver
8 lines for each port
Extension Caller ID
Supported standard 
ITU-TV.23 (1200bps) FSK
BELL202 (1200bps) FSK
On-board Ringer
20/25Hz 75Vrms
Phase control (Three-phase / Four-phase)
On-board DC/DC Power Supply
Input +15V
Output +15V, +5V, +3.3V
ASIC
EC bus interface function
CT bus interface function, Digital PLL function
Local bus interface function
Time switch function, Gain controlling function, DPRAM function
Private telephone controlling interface function
Parallel IO function
LED Display Circuit
Card status indicating LED: Two colors (Red/Green)
External Interface Connector
Extension interface
RJ45: 8port
6
KX-NCP1173XJ
5 Technical Descriptions
5.1.
Block Diagram
BACK BOARD
+3
.3
V
Por
t#
5
Por
t#
6
Por
t#
7
Sa
m
e
 as
 “
P
o
rt
#
1
”.
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m
e
 as
 “
P
o
rt
#
1
”.
S
a
m
e
 as
 “
P
o
rt
#1”
.
+1
5
VPT
+
15V
+
40V
H
W
C
L
K([
1
]
CP
[0
]
nC
S
[1
]
V
R
EF
+
VR
E
F-
nB
R
E
Q
nB
A
C
K
nI
R
Q
[0
]
L_n
R
S
T
nW
A
IT
nW
R
nR
D
nC
S
I
LA
[12:
0]
L
D
[7
:0
]
M
O
D
E
[5
:0
]
P
O
[7
:0
]
n
R
ESET
P
LLC
LK
HW
C
L
K
[0
]
P
3
[3
:0
]
P
2
[5
:4
]
R
X[
3
:0
]
E
C
_C
LK
E
C
_A
D
[15:
0
]
EC
_
P
A
R
EC
_
F
R
A
M
E
E
C
_
T
RDY
EC
_
S
T
O
P
EC
_
BE[
1
:0
]
EC
_
PER
R
EC
_
IN
T
EC
_
ID
SEL
EC
_
N
R
S
T
CT
_
N
E
T
RE
F
CT
_
F
RA
M
E
_
A
C
T
_C
8_A
C
T
_
D
[7
:0
]
CP
[0
]
A
[4:
0]
D
[7:
0]
ASI
C
(C
ID
)
nW
R
nR
D
nR
E
S
VR
E
F
CO
NT
nR
E
S
J
U
M
PER
R
ESET
IC
XT
A
L
16.
38
4
MH
z
J
U
M
PER
D
T
L[
3:
0]
R
inger
 (
75V
rm
s
)
CO
DE
C
PEB
2466
ASI
C
(e
SAM
SO
N)
EC
_
D
ET
C
T
_
C
B_
A
RI
N
G
E
R
HW
C
L
K
HW
C
L
K
NC
S
1
HW
C
P
NW
R
NR
S
T
NR
D
UH
W
[0
]
nC
S
[1
]
XT
AL
4.096MH
z
UH
W
D
DR[
3
:0
]
P
1
[3
:0
]
D
T
H
[3:
0]
C
S
_D
LY
_D
T
AC
_
A
L
M
nC
S-
D
M
A
DO
UT
DI
N
DCL
K
CS
DRA
DRB
DX
A
DX
B
PC
L
K
MC
L
K
DI
N
DO
UT
DCL
K
C_
CS
[
1:
0]
FH
LD
H
W
[0
]
LU
H
W
[0
]
C_
CS
[1
:0
]
DH
W
[0
]
UH
W
[0
]
CL
K
FS
C
FH
Se
rg
e
EM
C
TA
RA
Be
ll R
e
la
y
O
PEAM
P
D
C
 F
eedi
ng(
+30V
)
D
C
Feedi
ng(
G
N
D
)
Hook-Det
&
Ri
ngtr
ip-Det
Be
ll
Re
la
y
 Dr
iv
e
r
DT
M
F
RE
C
1/4
SLT I
/F
nT
O
E
[0
]
ST
D
[0
]
n
H
OOK
[0
]
B
E
LL[
0]
D
[3:
0]
nT
O
E
[7
]
ST
D
[7
]
D
[3:
0]
n
H
OOK
[7
]
B
E
LL[
7]
nT
O
E
[7
]
ST
D
[7
]
D
[3:
0]
n
H
OOK
[7
]
B
E
LL[
7]
P2
0
P
5
[3
:0
]
T
D
E
[3:
0]
P
4
[3
:0
]
P
22
P
23
nC
S
0
nR
E
S
R
ESET
DR
IV
E
R
DR
IV
E
R
+3
.3
V
MO
D
E
4
P
O
[7
:0
]
JU
M
PER
8
Por
t#
2
Por
t#
3
Por
t#
4
Por
t#
8
Sa
m
e
 as
 “
P
o
rt
#
1”
.
Sa
m
e
 as
 “
P
o
rt
#
1”
.
Sa
m
e
 as
 “
P
o
rt
#
1”
.
Sa
m
e
 as
 “
P
o
rt
#
1
”.
nT
O
E
[6
]
ST
D
[6
]
D
[3:
0]
n
H
OOK
[6
]
B
E
LL[
6]
nT
O
E
[6
]
ST
D
[6
]
D
[3:
0]
n
H
OOK
[6
]
B
E
LL[
6]
nT
O
E
[5
]
ST
D
[5
]
D
[3:
0]
n
H
OOK
[5
]
B
E
LL[
5]
nT
O
E
[5
]
ST
D
[5
]
D
[3:
0]
n
H
OOK
[5
]
B
E
LL[
5]
nT
O
E
[2
]
ST
D
[2
]
D
[3:
0]
n
H
OOK
[2
]
B
E
LL[
2]
nT
O
E
[2
]
ST
D
[2
]
D
[3:
0]
n
H
OOK
[2
]
B
E
LL[
2]
nT
O
E
[4
]
ST
D
[4
]
D
[3:
0]
n
H
OOK
[4
]
B
E
LL[
4]
nT
O
E
[4
]
ST
D
[4
]
D
[3:
0]
n
H
OOK
[4
]
B
E
LL[
4]
nT
O
E
[1
]
ST
D
[1
]
D
[3:
0]
n
H
OOK
[1
]
B
E
LL[
1]
nT
O
E
[1
]
ST
D
[1
]
D
[3:
0]
n
H
OOK
[1
]
B
E
LL[
1]
nT
O
E
[3
]
ST
D
[3
]
D
[3:
0]
n
H
OOK
[3
]
B
E
LL[
3]
nT
O
E
[3
]
ST
D
[3
]
D
[3:
0]
n
H
OOK
[3
]
B
E
LL[
3]
DO
UT
DI
N
DCL
K
CS
DRA
DRB
DX
A
DX
B
PC
L
K
MC
L
K
FS
C
R
ESET
C_
CS
[1
]
C_
CS
[0
]
O
n
-B
oar
d
R
inger
+
40V
+
15V
20H
z
/25H
z
 S
ignal
+5
V
DC
/D
C
DC
/D
C
DC
/D
C
DC
/D
C
+2
.5
V
DC
/D
C
DC
/D
C
KX-NCP1
173XJ BLOCK DIAGRAM
7
     KX-NCP1173XJ
5.2.
Circuit Operation
5.2.1.
Control-System Circuit
5.2.1.1.
IC100 (ASIC)
• EC bus interface
Independent bus for 16bit/8MHz two-way address data multiplex.
• CT bus interface
Supports eight 8.192MHz highways (128 time slots).
• Local TSW
Exchanges the time slots between CT bus (1024ch) and local highway (64ch).
• Local highway interface
Accommodates 2.048, 4.096, and 8.192MHz highways (Up to 64 time slots).
• Local gain control
Controls the gain of the local highway up-and-down 64ch in 1db step arbitrarily.
• Local TSW
Exchanges the time slots between CT bus (1024ch) and local highway (64ch).
• Local gain control
Controls the gain of the local highway up-and-down 64ch in 1db step arbitrarily.
• PT interface
Allows APT/DPT interface to be selected for each port.
• CODEC interface
Can connect up to four Infineon-manufactured PEB2466, and is intended for enabling the line control.
• GPIO interface
Parallel interface that is arbitrarily programmable bidirectionally.
• Time slot structure
The following is the time slot structure of the local highway on NCP1170.
8
KX-NCP1173XJ
5.2.2.
Line-System Circuit
5.2.2.1.
SLT interface
• CODEC control......IC300
Infineon-manufactured PEB2466 is used. The analog characteristics, such as BN, frequency characteristic, level, and sidetone,
are set by the CODEC interface DCLK, CS, DOUT, and DIN. The built-in I/O port is used for HOOK detection, DTMF detection,
BELL relay control, and DIAG relay control.
• A/D, D/A conversion
The conversion of 4-line analog signal and G.711 format PCM code (
µ/A) is carried out.
• SLT current-supply circuit
The current-supply circuit feeds current at the constant-current circuit. When the telephone is taken off the hook, DC loop is
formed.
The feeding current is limited to 30mA by the circuit configurations of R59, Q53, R60, and Q54.
+40VTR 
→ R62 → R59 → Q52 → RL52(b → c) → L203 → L204 →R L52(c →b) → Q51 → R60 → R61 → SLTG(0 V)
9
     KX-NCP1173XJ
• Bell signal issuing circuit
When feeding and speech paths are connected, BELL relay will be in 'break' state. When the bell signal is issued, BELL relay will
be in “Make” state.
• HOOK detecting circuit
When BELL signal is not output or when dial pulse is received, this circuit distinguishes whether SLT is off hook or on hook.
When SLT is off hook, DC loop is formed and current flows into U52. At this time, the collector of U52 (3, 4, and 5 pin), namely,
HOOK signal changes from H to L and is detected by CPU by way of CODEC R ASIC. When SLT is on hook, DC loop is
interrupted and the current flow into U52 (3, 4, and 5 pin) ceases; the collector of U52, namely, HOOK signal changes from L to
H and is detected by CPU in like manner.
• Ring trip circuit
While BELL signal is output, this circuit detects SLT off-hook by the hardware, and makes BELL relay in 'break' state.
While BELL signal is issued, when SLT is on hook, U52 (1, 2, and 6 pin) is off. When SLT is taken off the hook, DC loop is
formed because 40V is superimposed on BELL signal; then, current flows into R52 
→ R58 → D51 → U52, and U52 (1, 2, and 6
pin) becomes on.
When U52 (1, 2, and 6 pin) has become on, because the base of Q57 that is the driver of BELL relay becomes L, BELL relay will
be in 'break' state and SLT current-supply circuit feeds current to SLT.
• DTMF signal detecting circuit
Each port has its DTMF receiver.
Ports A to D carry out detection at IC400.
That DTMF data has become valid at EST terminal = H is detected by CPU by way of CODEC 
→ ASIC, and then CPU reads and
detects the data of DTMF receiver.
• 2W-4W converting circuit
This circuit converts between the 2-line audio signal of APT or SLT and the 4-line audio signal on CODEC.
The audio signal from SLT is input to the differential amplifying circuit of IC302 (1, 2, and 3 pin) by way of C55 and C56, and its
output is input to CODEC.
CODEC output is issued to SLT in the form of the synthesis of the signal that is output through by way of R63 and the one that is
reversely output by IC302 (5, 6, and 7 pin). Programmable frequency characteristic adjusting filter, sidetone removing filter, and
return loss compensating filter are included in CODEC.
10
KX-NCP1173XJ
5.2.2.2.
EXT-CID Transmission
This ASIC (IC600) generates the extension Caller ID signals (FSK signal) with the CPU control.
The data flow is shown below.

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