KX-HDV330RU, KX-HDV330RUB - Panasonic PBX Service Manual Supplement (repair manual)

ORDER NO. KMS1710932SE

R E F - 2

1

6

1

A1

A19

W 1 9

W1

T1

T9

A9

A1

P N L B 2 4 5 5 Z B - A P

B

M I C M

R217

V D D 1 8 V

I2C SCLK

R430

C201

R 4 3 1

PSB OU

SPM

SPP

C215

C

JC A

JI A

JO A

DG3

DG4

D G 7

JM A

JR A

U1_B

C430

C431

R E F - 2

C437

C243

C 2 4 8

C 2 4 9

+3.3V

C

C 2 5 2

C 2 5 3

C 4 4 8

C 2 5 4

CL142

U2_B

ST0

M I C P

ST1

C451

ST2

ST3

L10

PWR RST

L301

L302

IC2

I C 2 0 3

L501

ASIC RST

C494

C 4 9 5

J K 1 0 1

I2C SDA

ASIC CLK

ASIC INT

R 3 1 9

R 1 2 7

R 3 2 0

JABRA URX

C 3 0 1

X101

X102

C307

R 1 5 1

LF102

C503

C 3 1 0
C 3 1 1
C 3 1 2

C 3 1 3

C 3 1 5

C 3 1 6

DDR

1.5V

R 1 6 1

R 1 6 2

R 1 6 3

R 1 6 4

R 1 6 5

R 1 6 7

CL VDD12V

C337

C338

D C I N 1

C341

C342

+1.1V

L 2 0 1

L205

L206

L207

L208

L209

IC101

I C 1 0 2

I C 1 0 3

C377

C 3 7 8

L210

L 4 0 5

L211

L 4 0 6

L212

L 4 0 9

I C 3 0 2

IC303

C 3 8 5
C 3 8 6

I C 3 0 7

IC

I C 5 0 1

L420

L421

R209

+

-

Model No.

KX-HDV330/B

C

B

Suffix

2

Sup No.

KMS1512160CE

[ Ver.3.0 ]

Service Manual

Order No.

When servicing, you must confirm which service manual should be referred by the following methods.

Refer to “PNLB2455ZB”

Compatibility

Parts

Set Production

Original

New

Early (before change)

Late (after change)

Original parts may be used in early production sets only. 
New parts may be used in late production sets only. 
Stock both original and new parts.

USA

KX-HDV330CB

C

B

2

Canada

KX-HDV330NE/NEB

G

F

4

Europe

Destination

KX-HDV330X/XB

G

F

4

Asia, Oceania, Africa, Latin America

KX-HDV330SXB

E

D

4

India

KX-HDV330RU/RUB

E

D

4

Russia, Ukraine, Kazakhstan

2

3

PAGE

PAGE

1 Safety Precautions----------------------------------------------- 4

1.1. For Service Technicians --------------------------------- 4

2 Warning -------------------------------------------------------------- 4

2.1. About Lead Free Solder (PbF: Pb free)-------------- 4

2.1.1. Suggested PbF Solder ------------------------------ 5

2.2. Discarding of P. C. Board-------------------------------- 5

3 Specifications ----------------------------------------------------- 6
4 Technical Descriptions ----------------------------------------- 7

4.1. Block Diagram---------------------------------------------- 7
4.2. Circuit Operations ----------------------------------------- 8

4.2.1. Color TFT LCD display with touch panel ------- 8
4.2.2. Reset Circuit ------------------------------------------- 9
4.2.3. Ethernet Circuit ---------------------------------------10
4.2.4. PoE Circuit -------------------------------------------- 11
4.2.5. Analog Circuit ----------------------------------------- 11
4.2.6. Key Circuit ---------------------------------------------13
4.2.7. LED Circuit --------------------------------------------13
4.2.8. ASIC ----------------------------------------------------14
4.2.9. BT(Bluetooth) Module ------------------------------14

4.2.10. Power Supply Circuit--------------------------------15

5 Location of Controls and Components ------------------16

5.1. Name and Locations-------------------------------------16

6 Installation Instructions ---------------------------------------17

6.1. Connections------------------------------------------------17

7 Test Mode ----------------------------------------------------------18

7.1. Peer to Peer Test Mode---------------------------------18

7.1.1. Preparation --------------------------------------------18

7.2. Functional Test Mode------------------------------------19

7.2.1. Preparation --------------------------------------------19
7.2.2. Functional Test mode lists -------------------------20
7.2.3. Quit this Test Mode ----------------------------------20

8 Service Mode -----------------------------------------------------21

8.1. Factory Setting --------------------------------------------21

8.1.1. How to Clear User Setting -------------------------21

8.2. How to Change MAC Address

Label(Procedure after Replacing the Main
P.C.B.) -------------------------------------------------------21

8.2.1. Replacing Main P.C.B.------------------------------21
8.2.2. Attaching MAC Address Label -------------------22

9 Troubleshooting Guide ----------------------------------------23

9.1. No Operation ----------------------------------------------23

9.1.1. Power ON Error --------------------------------------23
9.1.2. Power Supply : AC adaptor -----------------------23
9.1.3. Power Supply : PoE ---------------------------------25

9.2. Color LCD with Touch Panel Does Not

Operate -----------------------------------------------------29

9.2.1. Color LCD Not Operate ----------------------------29
9.2.2. Touch Panel Not Operate--------------------------30

9.3. Handset Does Not work---------------------------------31

9.3.1. Receive-------------------------------------------------31
9.3.2. Send ----------------------------------------------------31

9.4. Headset Does Not work---------------------------------32

9.4.1. Receive-------------------------------------------------32
9.4.2. Send ----------------------------------------------------32

9.5. Speaker-Phone Does Not work -----------------------33

9.5.1. Receive-------------------------------------------------33
9.5.2. Sene ----------------------------------------------------33

9.6. BT(Bluetooth) Does Not work -------------------------34

9.7. EHS Does Not work (EHS control signal)---------- 35
9.8. Ethernet Does Not work -------------------------------- 36

9.8.1. L2SW Date error ------------------------------------ 36
9.8.2. LAN port ----------------------------------------------- 37
9.8.3. PC port ------------------------------------------------- 37

9.9. LCD back light and LED Not Light ------------------- 38

10 Disassembly and Assembly Instructions--------------- 39

10.1. Remove Main Board ------------------------------------ 39
10.2. Remove LCD unit ---------------------------------------- 40
10.3. Assembly for Lead wire--------------------------------- 40

10.3.1. Connecting Lead Wires ---------------------------- 41

11 Maintenance ------------------------------------------------------ 42

11.1. Terminal Guide of the ICs Transistors and

Diodes ------------------------------------------------------ 42

11.1.1. Main Board-------------------------------------------- 42

11.2. How To Replace a Flat Package IC ----------------- 43

11.2.1. Preparation-------------------------------------------- 43
11.2.2. Removal Procedure -------------------------------- 43
11.2.3. Procedure --------------------------------------------- 43
11.2.4. Removing Solder From Between Pins --------- 43

12 Schematic Diagram -------------------------------------------- 44

12.1. Main Board ------------------------------------------------ 44

12.1.1. No.1             Change ------------------------------- 44
12.1.2. No.2             Change ------------------------------- 45
12.1.3. No.3             Change ------------------------------- 46
12.1.4. No.4             Change ------------------------------- 47
12.1.5. No.5             Change ------------------------------- 48
12.1.6. No.6             Change ------------------------------- 49

12.2. Waveform -------------------------------------------------- 50

12.2.1. No.(1)-(8) ---------------------------------------------- 50
12.2.2. No.(9)-(16) -------------------------------------------- 51
12.2.3. No.(17)-(24)------------------------------------------- 52
12.2.4. No.(25)-(32)------------------------------------------- 53
12.2.5. No.(33)-(36)------------------------------------------- 54

13 Printed Circuit Board ------------------------------------------ 55

13.1. Main Board ------------------------------------------------ 55

13.1.1. Component View             Change --------------- 55
13.1.2. Bottom View             Change --------------------- 56

14 Appendix Information of Schematic Diagram --------- 57
15 Exploded View and Replacement Parts List ----------- 58

15.1. Cabinet and Electric Parts ----------------------------- 58
15.2. Accessories and Packing Materials ----------------- 59
15.3. Replacement Parts List--------------------------------- 61

15.3.1. Cabinet and Electrical Parts ---------------------- 61
15.3.2. Accessories and Packing Materials ------------ 62
15.3.3. Main Board Parts ------------------------------------ 62

16 History -------------------------------------------------------------- 67

4

1. Before servicing, unplug the AC power cord to prevent an electric shock.
2. When replacing parts, use only the manufacturer's recommended components.
3. Check the condition of the power cord. Replace if wear or damage is evident.
4. After servicing, be sure to restore the lead dress, insulation barriers, insulation papers, shields, etc.
5. Before returning the serviced equipment to the customer, be sure to perform the following insulation resistance test to prevent

the customer from being exposed to shock hazards.

• Repair service shall be provided in accordance with repair technology information such as service manual so as to prevent fires,

injury or electric shock, which can be caused by improper repair work.

1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.

• ICs and LSIs are vulnerable to static electricity.

When repairing, the following precautions will help prevent recurring malfunctions.

1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.

We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).

This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.

• PbF solder has a melting point that is 50 °F ~ 70 °F (30 °C ~ 40 °C) higher than Pb solder. Please use a soldering iron with

temperature control and adjust it to 700 °F ± 20 °F (370 °C ± 10 °C).

• Exercise care while using higher temperature soldering irons.: 

Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.

• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 °F (600 °C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the

opposite side (See the figure below).