KV-SS081 - Panasonic Other Service Manuals Service Manual (repair manual)

Order Number KM71210779CE

Category Number G14

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PAGE

1 GENERAL PRECAUTIONS -------------------------------------3

1.1. Safety Precautions-----------------------------------------3
1.2. Standard for Repair Service -----------------------------3
1.3. For Service Technicians ----------------------------------3
1.4. About Lead Free Solder (PbF: Pb free) --------------3
1.5. About RoHS -------------------------------------------------4

2 SPECIFICATIONS -------------------------------------------------5
3 COMPONENT IDENTIFICATION ------------------------------7

3.1. Part Names --------------------------------------------------7
3.2. Scanner Status----------------------------------------------8

4 INSTALLATION-----------------------------------------------------9

4.1. Minimum Space Requirements -------------------------9
4.2. Reversing Flatbed Sheet (as required) ------------- 10
4.3. Connecting Scanner to a Personal Computer ---- 12
4.4. System Requirements ---------------------------------- 13
4.5. Installing Software --------------------------------------- 13

5 SECTIONAL VIEWS--------------------------------------------- 14

5.1. Flatbed Block and Boards ----------------------------- 14

6 MECHANICAL FUNCTION ------------------------------------ 15

6.1. Scanning Unit Drive Mechanism --------------------- 15

7 MAINTENANCE -------------------------------------------------- 16

7.1. Maintenance Table--------------------------------------- 16
7.2. Cleaning ---------------------------------------------------- 16

8 DISASSEMBLY INSTRUCTIONS---------------------------- 17

8.1. Disassembly Flowchart --------------------------------- 17
8.2. Disassembling -------------------------------------------- 19

9 SERVICE UTILITY & SELF TEST --------------------------- 26

9.1. Main Menu Indication for Service Utility ------------ 26
9.2. List of Functions for Service Utility------------------- 27
9.3. Operation--------------------------------------------------- 28

10 TROUBLESHOOTING ------------------------------------------ 32

10.1. Troubleshooting-1 (when no error message is

displayed on PC) ----------------------------------------- 32

10.2. Troubleshooting-2 (when an error message is

displayed on PC) ----------------------------------------- 34

11 CIRCUIT DESCRIPTION --------------------------------------- 39

11.1. Block Diagram-1 (Image Processing)--------------- 39
11.2. Block Diagram-2 (Board) ------------------------------- 40
11.3. Explanation of Connector ------------------------------ 41

LIST ------------------------------------------------------------------ 43

12.1. Exterior------------------------------------------------------ 44
12.2. Packing ----------------------------------------------------- 46

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1. Before servicing, unplug the power cord to prevent electrical shock hazard.
2. When replacing parts, use only manufacture’s recommended components for safety.
3. Check the condition of power cord. Replace if wear or damage is evident.
4. After servicing, be sure to restore the wire dressing, insulation barriers, insulation papers, shields, etc.

5. Before returning the serviced equipment to the customer, perform the following electrical tests to prevent shock hazard.

Repair service shall be provided in accordance with repair technology information such as service manual
so as to prevent fires, injury or electric shock, which can be caused by improper repair work.

1. When performing repairs, neither the products nor its parts or components shall be modified.
2. If cable assembly is supplied as the smallest unit when servicing, make sure to replace the cable assembly.

ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help to prevent recurring malfunctions.

1. Cover the plastic parts with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on the worktable.
4. Do not grasp IC or LSI pins with bare fingers.

• In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder

• We will use PbF when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),

• This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and

• PCBs (manufactured) using lead free solder will have a PbF stamp on the PCB.

• PbF solder has a melting point that is 50 

° - 70 °F, (30 ° - 40 °C) higher than Pb solder. 

° ± 20 °F (370 ° ± 10 °C).

• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 

°F (600 °C). 

• When applying PbF solder to double layered boards, please check the component side for excess solder which may

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We recommend you to use the following solder when re-soldering components for repair. Before using other Pb free solder than the
following solder, make sure to confirm that the solder maker (you use) has the license agreement for Pb free solder.

Supplier: Senju Metal Industry Co., Ltd. (http://www.senju-m.co.jp)
Part Description in Senju: EcoSolder RMA02 P3 M705 Series

This product is fully compliant with the national laws transposed from the EU Directive on the restriction of the use of certain
hazardous substances (RoHS) in electrical and electronic equipment, effective 1st July 2006 in the EU countries.

In order for the product to comply with the RoHS Directive, the six particular substances (lead, mercury, cadmium, hexavalent
chromium, polybrominated biphenyls, and polybrominated biphenyl ethers) have been either totally eliminated or limited to the
concentration level below maximum allowed. Consequently spare parts have been changed to RoHS-compliant parts where
applicable.
Due to spare parts application of RoHS legislation, non-compliant spare parts cannot be used to repair compliant products put on
the EU market on or after 1st July 2006. Please therefore make sure to order and use RoHS-compliant spare parts listed in this
manual.